Download - Logitech Ltd

Equipment Manual 

for the 

Wafer Substrate Bonding Unit 

(4 inch version) 

Original Language - English Version 

V2011-01

! 

NB Logitech Ltd. assert it’s right under the 

Copyright, Designs and Patents Act 1988 

to be identified as the author of this work. 

c Logitech Limited. All rights reserved. 

Safety Precaution Sheet 

Logitech WSB Bonding Systems 

To be read carefully before use 

1. The operator should be fully aware of the use of the machine 

according to the Operations Manual 

2. The machine must be placed in an adequate working position, 

providing level, stable support and adequate ventilation. All 

functions on the machine and any connected equipment must be 

in working order. 

3. Be sure that the supply voltage corresponds to the voltage stated 

on the machine. The machine must be earthed. 

4. Establish that rear air outlets are completely unobstructed. 

5. Before loading samples, ensure that the installation test procedure 

has been completed. 

6. Ensure that the correct operation of the head locking screws is fully 

understood. 

7. Observe the current safety regulations for handling, emptying and 

disposal of the waste materials and fluids. 

8. Before opening the machine or working on any terminal 

connections, always turn off the power, remove the plug or cable, 

and ensure that the bonding heads are closed and at or near 

ambient temperature. 

9. When working with the machine, always remember that the 

heating system parts require extra care due to the system 

operating temperature. 

The apparatus/machine is designed for use with consumables 

supplied by Logitech. If subjected to misuse, improper installation, 

alteration, neglect, accident or improper repair, Logitech will take no 

responsibility for damage(s) to the user or the equipment. 

Dismantling of any part of the apparatus/machine, in case of service 

or repair, should always be performed by a qualified technician 

(electromechanical, electronic, mechanical, pneumatic, etc.).

11 

13 

12 

10 

LEGEND (Figure 1 and 2) 

1 

Figure 1: Three-station Wafer Substrate Bonding Unit 

1. Process Data display and touch panel controls 

2. Vacuum/pressure gauge 

3. Applied pressure gauge 

4. Air supply regulator 

5. Chamber air/positive pressure inlet 

6. Sample air inlet 

7. Bonding head 

8. Bonding diaphragm 

9. Sample chamber 

10. Vacuum connector 

11. Oil vapour outlet 

12. Water inlet* 

13. Water outlet* 

14. Mains On/Off switch (Figure 2) 

15. Positive pressure inlet connector (Figure 2) 

16. Swing bolt (Figure 2) 

17. Thumb screw (Figure 2) 

* Note: on the single-station unit the water inlet is to the rear of the water outlet. 

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8 

7 

6 

2 

5 

3 

4 

Page: 3

8 

17 

16 

9 

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LEGEND (Figure 1 and 2) 

1 

Figure 2: Single-station Wafer Substrate Bonding Unit 

1. Process Data display and touch panel controls 

2. Vacuum/pressure gauge 

3. Applied pressure gauge 

4. Air supply regulator 

5. Chamber air/positive pressure inlet 

6. Sample air inlet 

7. Bonding head 

8. Bonding diaphragm 

9. Sample chamber 

10. Vacuum connector (Figure 1) 

11. Oil vapour outlet (Figure 1) 

12. Water inlet* 

13. Water outlet* 

14. Mains On/Off switch (Figure 2) 

15. Positive pressure inlet connector (Figure 2) 

16. Swing bolt (Figure 2) 

17. Thumb screw (Figure 2) 

* Note: on the single-station unit the water inlet is to the rear of the water outlet. 

6 

5 

4 

2 

3 

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Page: 4

1 INTRODUCTION 

1.1 Scope 

This manual provides full instructions for installation, operation and maintenance of the Logitech WSB1 Wafer Substrate 

Bonding System. Numbers in brackets refer to parts shown on the front fold-out diagrams, Figures 1 and 2. 

NOTE: Figures 1 and 2 show the two variants of this system (single-station and three-station), from different angles. Please 

refer to both Figures where necessary. 

1.2 Lifting, Handling and Unpacking 

The units are intended as bench top machine and each model weight is listed under section 1.6 below. 

When unpacking the machines from the crate remove the top section with a suitable crow bar or claw hammer, taking care to 

avoid the nails protruding from the edges of the panel. 

Lift out the foam packing materials around the machine and then tap out the side panels with a hammer. Carefully store or 

discard the wooden panels. 

For the single head models 1WBS1; 1WBS2; 1WBS7 and 1WBS8 two authorised persons should stand either side of the 

machine and using correct safe lifting procedures, lift the machine onto the intended trolley or workbench before unpacking 

the plastic coverings. For the larger triple head models 1WBT1; 1WBT2 and 1WBT5, four persons should stand at each corner 

of the machine and together lift it onto the intended trolley or bench. 

The underside of the machine does not have sharp edges and can be held at the side/base interface with suitable gloves in 

order to lift the machine. 

The machine is now ready for installation and test. See section 1.12) 

1.3 Correct use of this Equipment 

The WBU series of wax bonding systems is intended for the temporary mounting of semiconductor and other wafer format 

materials to a stable support glass or other medium such as Sapphire. This is to allow subsequent thinning and other device 

fabrication processes to be undertaken on the fragile wafer and reduce the risk of it being damaged in process. 

The system is intended to be used up to a maximum temperature of 200 degrees C and to reach an optimum vacuum level of 

1.0 x 10E-1mbar when processing. 

It is not intended to be used for other applications outwith the above stated purposes without the operator first obtaining 

agreement from the manufacturer. Any unauthorised process or improper use of the system may invalidate the warranty and 

could damage the machine and/or cause injury to the operator. Logitech do not accept liability for any improper use of the 

system resulting in damage or harmful results. 

1.4 Machine Designation 

The serial plate of the machine is located next to the mains inlet cable on the right side of the unit. The serial number is a 6 

digit number in the format 00-00-00. The machine model is recognised by the first two numbers which will be either: 31 for a 

single head unit or 32 for a triple head unit. The second two numbers denote the number of machines built that year and the 

final two numbers represent the year of manufacture. For example: 32-05-08 represents the 5th triple head machine 

manufactured in 2008. 

Page: 5

1.5 Manufacturer 

Logitech Ltd 

Erskine Ferry Rd, 

Old Kilpatrick 

Glasgow 

G60 5EU, 

Scotland, UK 

Page: 6

We: 

EC Declaration of Conformity 

In accordance with EN ISO 17050-1:2004 

of: Logitech Limited 

Erskine Ferry Road, Old Kilpatrick, 

Glasgow G60 5EU, Scotland, UK 

Tel: +44 (0) 1389 875444 

Fax: +44 (0) 1389 890956 

in accordance with the following directive(s): 

BS EN ISO 9001:2008 Quality Management Systems 2008 

BS 8888:2008 TPS - Technical Product Specification 2008 

2004/108/EC The Electromagnetic Compatibility Directive 2004 

2006/95/EC The Low Voltage Directive 2006 

2006/42/EC The Machinery Directive 2006 

hereby declare that: 

Equipment: WBS and WBT series of Wax bonders 

Model Number(s):1 WBS1; 1WBS2; 1WBS7; 1WBS8; 1WBT1; 1WBT2 and 1WBT5 

Serial Number: From 

31-01-98 onwards 

Where 31 = single head 32 = triple 

head xx denotes the number built in the year to date and 11 denotes the year ‘1998’ 

is in conformity with the applicable requirements of the following documents/standards: 

BS EN ISO 13849-1:2008 Safety of Machinery. Safety related parts of 

control systems. 

General principles for design. 2008 

BS EN 953:1997+A1:2009 Safety of Machinery. Guards. General 

requirements for the design and construction of 

fixed and movable guards. 1997/09 

BS EN 60204-1:2006 + A1:2009 Safety of Machinery. Electrical equipment of 

machines. General guidelines. 2006/09 

BS EN ISO 13857:2008 Safety of Machinery. Safety distances to prevent 

hazard zones being reached by upper and lower 

limbs. 2008 

AND EMC Standard(s): 

DECCON REV01 

Page: 7

BS EN 61326-1: 2006 Electrical equipment for measurement, control and 

aboratory use 2006 

I hereby declare that the equipment named above has been designed to comply with the 

relevant sections of the above referenced specifications. The unit complies with all 

applicable Essential Requirements of the Directives. 

Done at: Logitech Ltd 

On 27th January 2011 

Document ref. No. 320112 

. 

DECCON REV01 

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Page: 8

1.6 Machine Weights. 

1WBS1 and 1WBS2 31kg (69lbs) 

1WBS7 and 1WBS8 38kg (84lbs) 

1WBT7 and 1WBT8 57kg (126lbs) 

1WBT5 117kg (258lbs) 

1.7 Safety 

When operating this unit the operator must be aware of the risks involved when working with temperature and pressure. 

a) The unit is operated up to 200 degrees C at the hotplate. Although the top lids are closed when operatin 

there is some heat transfer through to the outside metal lids. This becomes hot to the touch and the 

operator must be aware of the risk of minor burns to the hands as the temperature can reach between 

60 - 100 degrees C 

b) There are many specialist clean room gloves on the market which are suitable for up 100 degrees C 

and it is advisable that the operator may use such gloves to reduce the risk of minor burns 

c) The unit can also be put under pressure during the process and the clamp bars must not be removed 

when the unit is 'in process' If the clamps are removed when the maximum pressure (2bar) is being 

applied to the sample, the head may pop open by a few mm due to the rubber diaphragm stretching. 

The result being that the rubber may tear and need replaced as well as the wafer bond process being 

disrupted 

d) The vacuum pump exhaust port emits oil vapour and must be vented correctly through a suitable oil 

mist filter (see separate vacuum pump manual if supplied with the machine) or to the facility exhaust 

system to prevent oil mist in the working area. 

1.8 Noise Levels 

The WSB series of machines in normal operation run at a noise level below 70dB (A). 

The main noise from the unit occurs during 'cooling' when the oil pump and motor circulate the oil through a heat exchanger 

to cool it. As the pump motor runs at 3000rpm it emits a high frequency whine which is below 70dB (A) 

. 

The WSB unit was tested using a calibrated ISOTECH SLM-52N sound level gauge over a one hour period and averaged 

below 70dB (A). Background levels were recorded at 58dB (A) +/-2dB before and after the tests. The sound meter was placed 

1m from the unit and facing the unit directly at a height 1.6m from the floor. 

1.9 Potential Failures or Breakdowns 

a) The most common interruption to normal operation is when the rubber diaphragm wears out and needs 

replaced. The diaphragm along with the two o-rings may be regarded as consumable items as they will 

wear out after a number of runs. The number depends on the process conditions and can vary widely. 

The higher the temperature, the more wear will occur. See section 4.1 Page 25 for 'how to change a 

diaphragm'. See the spare parts list for parts numbers. 

b) It is possible for the head(s) temperature controller(s) to lose communication and this will display a fault 

condition if communication is lost. See service manual for resetting the communications. 

Page: 9

c) If the system does not reach the operator set vacuum levels or temperature then 

i) the vacuum pump may need purged or oil changed. See the vacuum pump manual for servicing 

ii)the temperature controller may have failed. See the Watlow controller manual for service or replacement 

instructions 

d) If the system failure cannot be found, in the first instance contact either your local representative or the 

manufacturer for assistance 

1.10 Operating Principles 

The operation of the Logitech WSB1 Wafer Substrate Bonding System is illustrated in Figure 3 which shows a section of one 

of the bonding heads (7). A wax coated glass disc, to which the wafer or sample is to be bonded, is placed in the sample 

chamber (9). The sample is placed on top of this glass disc and covered by a circle of filter paper or lint free tissue. The 

chamber cover is then closed and secured by four thumb-screws (17). When the cover is closed, the sample chamber can be 

evacuated to beyond 1 x 10 -1 mbar, the vacuum sealing being provided by the two large O-rings on to which the head cover 

locates. The cover of the sample chamber contains a diaphragm (8) which can have atmospheric or positive pressure admitted 

to the space above it. This diaphragm applies pressure to the sample during the bonding cycle to create a uniform wax bond 

between the sample and the glass disc. 

At the start of the bonding cycle, air is evacuated from space above the diaphragm, causing it to lift away from the sample, and 

then from the sample chamber (9). As the sample chamber is evacuated its temperature is raised to the preset point 

determined by the operator. This temperature should be just below the wax melting point: at this temperature the wax will soften 

but not liquify. Once the correct temperature and vacuum have been achieved, there is a ten minute delay ("soak") to allow 

temperatures throughout the head and sample to stabilise and the wax to outgas. After this soak time, atmospheric or positive 

pressure is admitted to the space above the diaphragm at a controlled rate, allowing the diaphragm to drop and press the 

sample into the softened wax. This pressure is maintained for the preset bond time. Once the bond time is complete, oil is 

circulated through the head and a heat exchanger to cool the chamber and sample to ambient temperature, whilst maintaining 

the pressure on the specimen. When the specimen chamber temperature has reduced to 40 o C the vacuum is released at a 

controlled rate. 

The single head and three head system will operate in the same manner. 

1.11 Operator Console 

The operator console comprises a display screen with four softkeys, three manual controls for air flow and two gauges. The 

sequence of control screens is described in section 3. 

The three manual controls are as follows:- 

a) REGULATOR (4) - The regulator limits the pressure that will be applied to the sample during the bonding phase if positive 

pressure is required for the bond. 

b) CHAMBER AIR/+VE PRESSURE INLET (5) - This needle valve controls the rate at which the diaphragm drops, as pressure 

is applied to the sample during the bonding phase.The default is set during factory set up and should allow the diaphragm to 

fall to zero in approximately 30 seconds to 1 minute. 

c) SAMPLE AIR INLET (6) - This needle valve controls the rate at which air is admitted to the sample chamber at the 

completion of a bonding cycle. The default should be fully open unless the process is affected by a sudden rush of air into the 

specimen chamber. 

The two gauges are as follows:- 

(3) PRESSURE - This gauge shows the additional air pressure that may be applied by the diaphragm to the sample during the 

bonding phase. 

Page: 10

(2) VACUUM/PRESSURE - This gauge always shows the current pressure applied by the diaphragm to the sample. 

24 

17 

18 

16 

23 

16. Swing bolts 

17. Thumb screws 

18. Heating element 

19. Thermocouple 

20. O-ring seals 

21. Chamber vacuum inlet 

22. Diaphragm vacuum inlet 

23. Vacuum diaphragm 

24. Support pillars 

Figure 3: Bonding chamber cross-sections 

20 

21 

22 

19 

Page: 11

1.12 Installation and Test 

The system is not sensitive to vibration and can be installed on a standard bench which will support the weight (see section 

1.6). 

The system should be situated away from areas of dust or particle contamination as this may affect the quality of the wax bond 

if airborne particulates become trapped in the bond layer. 

No special lighting is required for the system and the machine may be operated from 200 lux or above environment with no 

flicker or glare. The control display is a white on blue backlit display to aid visibility. 

The WSB1 must be connected to a suitable AC mains supply. This must be 110V or 230V (+/- 6%, which makes the acceptable 

operating range from 218 to 243 volts) according to the rating plate at the rear of the machine. The supply lead colours are as 

follows: 

LINE----------------------BROWN 

NEUTRAL--------------BLUE 

EARTH------------------GREEN/YELLOW 

Connect a vacuum line to the aluminium connector on the left hand side of the unit (10). The vacuum quality can be checked 

using the test screen described in Section 3.3. 

Connect cooling water inlet and outlet hoses to the large barbed tails on the left hand side of the unit ((12)and (13)). 

N.B. The heat exchanger system cools the bonding head(s) from 188 degrees celsius to 40 degrees celsius in less than 

9 minutes. In order to replicate this cooling time the following cooling water conditions should be applied: 

Flow rate of 2 litres per minute. 

Inlet temperature of 11 degrees celsius. 

The above conditions will produce a cool down time of less than 9 minutes from a head temperature of 188 degrees celsius 

to 40 degrees celsius. 

The outlet water temperature will rise to a maximum of 26 degrees celsius during cooling, i.e. immediately after the start 

of the cooling phase. 

Connect a service duct extract to the oil vapour outlet (11) on the 6mm diameter barbed tail adjacent to the cooling water 

connections. 

Connect an air line at a minimum pressure of 2 bar to the compressed air inlet "Hansen" connector (15) on the right hand side 

of the unit. 

On connection to the mains supply the cooling fan on the WSB1 will be running. Switch on the main switch at the rear of the 

right hand side panel (14). The top level operating screen will be displayed. A description of the display screens is given in 

Section 3. 

Please note: The diaphragm material will release an oily film when heated for the first few timesit is run, as the vacuum system 

will remove this fluid from the rubber material. This is normal and each time after fitting a new diaphragm, cycle the system at 

temperature and vacuum pressure with a glass blank in the chamber to outgas the diaphragm. 

1.13 Bonding Process and Recommended Waxes 

Samples may be bonded either to 83mm (3.27") diameter or 105mm(4.13") diameter glass mounting discs. The chamber is 

manufactured to suit a wafer thickness of 1mm or below, used with a 6mm thick glass disc. These discs should be pre-coated 

with an even layer of wax between 5 and 10 microns thick (when the Logitech WCS10 wax evaporation system is used). Where 

a manual application of wax is used, this is hand-applied by the operator. Three 83mm (3.27") diameter discs are provided with 

the machine, together with spacer rings which bring their effective diameter up to 105mm (4.13"). 

Page: 12

NOTE: DO NOT USE THE UNIT WITH ANY CHAMBER EMPTY. Equally importantly, the unit should not be operated using 

83mm (3.27") diameter discs without the rings in place, as there is a possibility of damage to the diaphragms or displacement 

of the samples. The rings should be fitted with the grooved side face down to provide a uniform surface for the diaphragm to 

press. Optional spacer discs can be provided if thinner substrate materials are necessary, e.g. sapphire. 

To bond a wafer to a glass substrate, both the wafer and glass must be prepared and cleaned before placing them in the 

bonding chamber (9). 

First take appropriate wafer measurements, then clean and store the wafers ready for bonding. Clean and measure the 

flatness and taper on the glass. This should be 2um or less to provide an effective substrate for lapping and polishing the wafer. 

By measuring the wafer and the glass before and after bonding, the wax layer uniformity and thickness can be calculated. This 

will enable any process parameters to be adjusted to further improve the geometry of the final component or device. 

As the bonding head surfaces will heat up during process care must be taken in the head 

area identified by the international hot surface symbols. 

This is designated as threeblack vertical wavy lines over a straight black horizontal line 

inside a black triangle, all on a yellow background. 

A uniform layer of wax should be applied by hand to the glass after placing it on a hotplate at the wax melting point and 

manually coating the surface with a thin, even layer. The glass should then be cooled and placed in the bonding chamber. 

Lay the wafers to be bonded on the waxed glasses; firmly press the wafer on to the glass to expel any trapped air, and cover 

each carefully with a disc of clean filter paper or tissue. Before closing the heads, ensure that the wafer has not floated offcentre. 

Close the heads, gently seat them on the seals and lightly tighten the locking screws by hand and start the bonding 

cycle. Once the vacuum evacuation and heating stage is reached, re-tighten the locking screws using only finger 

pressure. 

Two types of bonding wax are recommended: 

QUARTZ WAX (0CON-200) - A brittle, opaque amber, chippable wax that is particularly suited to bonding wafers. It is 

extremely fluid above its distinct melting point, hard and firm immediately below. It is soluble in trichloroethane. The 

recommended plate temperature for this wax is in the range 69 o C - 75°C. 

HIGH MELTING POINT WAX (0CON-196) - A tan coloured, medium hard synthetic wax with a melting point of 157-162° C. It 

is soluble in hot trichloroethane. The recommended plate temperature for this wax is 180 o C - 183°C. 

Both waxes have been chosen for two properties. First, they are extremely pure and can be evaporated on to the glass 

mounting discs using the Logitech WCS10 Wax Coating System. Secondly, finished wafers can readily be removed from the 

glasses by heating in a hot isopropanol vapour unit such as the Logitech 1ACCS-5100 solvent vapour cleaner, or by using a 

solvent such as ECOCLEAR. 

It will be noted that both recommended bonding temperatures are below the wax melting points. This is fundamental to the 

process as it is intended that the sample be pressed into a softened layer of wax under vacuum to achieve the bond, so 

protecting any devices of the bonded face from contact with the glass disc. For any particular combination of sample and wax 

the optimum temperature may vary by a few degrees either side of the above recommended values. 

The maximum bonding temperature recommended with the WSU is 180 degrees celsius. 

Page: 13

2 OPERATION 

Since all of the cycle parameters for the WSB1 are stored in non-volatile memory they may be recalled at any time. The 

following process parameters are stored in the machine’s battery backed-up memory. The default values are given in brackets 

• Bonding temperature (75°C) 

• End point temperature (40°C) 

• Soak, bond and maximum outgas times (all 10 minutes) 

• Vacuum thresholds (proceed if below 0.1millibar, abort if above 0.3 millibar) 

For more detailed process steps, refer back to section 1.5. To bond a wafer to a glass substrate both the wafer and glass must 

be placed in the bonding chamber. Lay the wafers to be bonded on the waxed substrates. Cover each carefully with a disc of 

clean filter paper or tissue. Once the vacuum evacuation and heating stage is reached, re-tighten the locking screws 

using only finger pressure. 

ANY HEADS NOT IN USE MUST BE LOADED WITH CLEAN 105mm DIAMETER GLASSES (OR 83mm DIAMETER 

GLASSES INSIDE RINGS) TO AVOID OVER-STRETCHING THE DIAPHRAGM. ALL HEADS MUST BE CLOSED BEFORE 

THE BONDING CYCLE IS COMMENCED. 

The bonding temperature should be set according to the melting point of the wax in use. The end point temperature is that at 

which the vacuum in the bonding chamber is released and the chamber lid may be opened. The cycle time may be shortened 

by reducing the soak time or the bond time, or by raising the end point temperature. 

DO NOT HANDLE SAMPLES THAT ARE ABOVE 55 o C WITHOUT GLOVES. 

At the start of each cycle it is advisable to check that the vacuum reading on the main display is dropping rapidly towards the 

ideal value of 1 x 10 -1 mbar. Slow pumpdown can either be caused by a leak at the bonding heads or by outgassing from the 

samples or bonding medium. Outgassing can cause significant delays in the cycle depending on the materials used and in 

particular on residual solvents which may have been used in cleaning operations. If, however, a vacuum leak is suspected, 

as a first step, stop the cycle, open the heads and clean the top face of the head seal O-ring with a tissue moistened with a 

smear of vacuum grease. Check also that the O-rings are not damaged and that the grooves and rings are clean. 

During the bonding cycle the vacuum in the specimen chamber is constantly monitored. Should the vacuum be lost 

then the process will be automatically aborted. A loss of vacuum is most likely to be caused by allowing the air 

pressure in the upper chamber to go above 2 bar; reducing this pressure with the pressure regulator should allow 

the vacuum to be re-established. Once the correct vacuum level has been reached again the bonding cycle will 

restart. 

When the machine is not in use the bonding chambers should be left closed. The locking screws should not be left 

tightened as this will distort the O-rings and damage the unit. 

NOTE: The machine must ALWAYS remain switched on while the water supply is connected to it. Should it be switched off 

with the water supply still connected, there will be a pressure build up within the unit, which may result in the supply pipe 

rupturing. This is due to the solenoid valve being positioned within the unit itself, allowing water to enter the machine before 

being stopped at the valve. If the supply pipe were to rupture within the machine itself this would have adverse effects on the 

unit. The supply pipe rupturing outside the machine would be equally undesirable. 

The operation of the Wafer Substrate Bonding System is controlled through a sequence of display screens as described in 

section 3. 

Page: 14

3 DISPLAY SCREENS 

3.1 The Title Screen 

When switching on the Wafer Substrate Bonding System, the software version and its revisal date will be displayed and the 

operator will be offered the choice between [PROCESS], [TEST] or [SETUP] as shown below. 

The [SETUP] softkey takes the user to the Setup Screen described in section 3.2, the [TEST] softkey takes the user to the 

Manual Menu Screen described in section 3.3 and the [PROCESS] softkey takes the user to the Process Screen described 

in section 3.4. 

3.2 The Setup Screen 

After selection of the Setup Screen Menu the operator will be offered the choice between [TEMPERATURE], [VACUUM 

THRESHOLDS], [PROCESS CONTROL], [HEADS] or [SOLENOIDS] as shown below. The [EXIT] softkey will return the 

operator to the Title Screen. 

. 

Wafer Substrate Bonder 

Version 1.8 2000-07-13 

[Process] [Test] [Setup] 

Temperature 

Vacuum Thresholds 

Process Control 

Heads 

[↓] 

[↑] 

Figure 4: Title Screen 

Setup 

Solenoids 

Service Hours 

Figure 5: Setup Menu Screen 

[Select] [Exit] 

The Temperature Setup Screen is described in section 3.2.1, the Vacuum Setup Screen in section 3.2.2, the Process Control 

Setup Screen in section 3.2.3, the Head Setup Screen in section 3.2.4 and the Solenoid Setup Screen in section 3.2.5. 

Page: 15

3.2.1 Temperature Setup Screen 

This screen allows the operator to adjust the set point temperature using the [+] and [-] softkeys (see figure 6). Selecting the 

[NEXT] softkey until the [UNITS] option is highlighted will enable the user to switch between the Celsius and Fahrenheit 

temperature scales (see figure 7). Having reached this point, the screen can be changed from measuring temperature in 

Celsius to Fahrenheit by pressing the degree [F] softkey. Once the user has selected the appropriate temperature scale, they 

can move between the Wax Temperature, Offset and End Point Temperature by selecting [NEXT]. The maximum value for 

both the Wax Temperature and the End Point Temperature is 200 o C, while the lower limit is 20 o C. 

Offset is used to set the temperature differential across the glass substrate. This is required due to the wax temperature 

equalling what is required on top of the substrate, however, the platinum plate must be higher in temperature in order to sustain 

the required conditions for bonding to take place. 

The following temperature settings should be used when bonding a 6mm float glass substrate using Logitech wax: 

(a) Wax Temperature 75 o C 

Offset 8 o C 

(b) Wax Temperature 162 o C 

Offset 26 o C 

In the above cases the actual platen temperature will be 83 o C and 188 o C respectively. 

The [EXIT] softkey will return the operator to the Setup Menu Screen. 

Wax Temp: 180 o C 

Offset: 8 o C 

Temperature Setup 

End pt. Temp: 40 o C°C 

[-] [+] [Next] [Exit] 

Figure 6: Temperature Setup Screen 

Units: o C 

When the temperature scale is changed both the bonding and end point temperatures will change accordingly. 

Wax Temp: 180°C 

Temperature Setup 

End pt. Temp: 40 o C°C 

Offset: 8 o C Units: o C 

[ o F] [Next] [Exit] 

Figure 7: Temperature Setup Screen 

Page: 16

3.2.2 Vacuum Setup Screen 

This screen allows the operator to adjust the vacuum levels at which the bonding process will proceed and the point at which 

the process will abort. The operator may highlight the values using the [NEXT] softkey, and alter them using the [+] and [-] 

softkeys. The [EXIT] softkey will return the operator to the Setup Menu Screen. 

3.2.3 Process Control Setup Screen 

Set Vacuum Thresholds 

Proceed if below : 1.0E-01mBar 

Abort if above : 3.2E-01mBar 

[-] [+] [Next] [Exit] 

Figure 8: Vacuum Setup Screen 

This screen allows the operator to adjust the soak time, bond times, maximum outgas time and positive pressure auto delay 

time. These values must be between 2 and 99 minutes. The operator may highlight either the PROCESS TYPE, SOAK, 

BOND, OUTGAS LIMIT or POSITIVE PRESSURE DELAY values by pressing the [NEXT] softkey, this will allow the user to 

scroll through each of the options available to them on the screen. After selecting an option, the chosen option’s values may 

be altered by using the arrow softkeys. The four options available to the user whilst the PROCESS TYPE option is highlighted 

are WAX COAT AND BOND, HEAT AND OUTGAS, COLD PROCESS and RESIN BOND. Again, the user may scroll through 

these options by use of the arrow keys. The [EXIT] softkey will return the operator to the Setup Menu Screen. When setting 

the outgas time the user should ensure that they set a time longer in duration than the actual outgassing time. This is to ensure 

that the machine progresses through the process cycle, otherwise the machine will automatically abort. 

Process Control Setup 

Process Type: Heat and Outgas 

Soak: 01Mins O.g.Limit: 10Mins 

Bond: 02Mins P.P.Del: 01Mins 

Figure 9: Process Setup Screen 

[Next] [Exit] 

(Please note that the Bond Time will always be 1 min. longer than the Positive Pressure Delay) 

Page: 17

3.2.4 Head Setup Screen 

The Head Setup screen allows the user to switch the heads on and off independently of one another by simply pressing the 

softkey below the required head on the display. Each key press toggles the associated head status from on to off or vice versa 

(in single head machines this screen displays only one option, telling the user that the head is on). The [EXIT] softkey will 

return the operator to the Setup Menu Screen. 

3.2.5 Solenoid Setup Screen 

The water source for the machine can be altered by the user at this point by simply pressing the [MAINS] or [PUMPED] 

softkeys. Once the water source has been established, the user can then alter the application of positive pressure to the head 

in the bonding phase by selecting the [NEXT] softkey. This will then enable them to select either [AUTO] / [MANUAL]. Should 

the user select the [MANUAL] option it should be noted that the [+ve] key which appears in the bond stage screen (figure 16) 

will only remain visible until pressed, whereupon it will disappear. 

The [EXIT] softkey will return the operator to the Setup Menu Screen. 

3.2.6 Service Hours Screen 

Head 1 

On 

Head Setup 

Head 2 Head 3 

On Off 

[Head 1] [Head 2] [Head 3] [Exit] 

Figure 10: Head Setup Screen 

Solenoid Setup 

Water Source: Recirculation pump 

+ve Pressure: Head 2 Manual 

On 

[Mains] [Pumped] [Next] [Exit] 

Figure 11: Solenoid Setup Screen 

This screen enables the operator to monitor the service time of the whole machine, the heaters and the 

oil pump. These can be viewed by selecting "Service Hours" in the Setup screen, which will lead to the 

screen shown in Figure 12. The [EXIT] softkey will return the operator to the Setup Menu Screen. 

Page: 18

3.3 The Solenoid Test Screen Menu 

Service Hours 

Power On (hh:mm:ss)= 1:22:06 

Heater (hh:mm:ss)= 00:00:00 

Oil Pump (hh:mm:ss)= 00:00:00 

Figure 12: Service Hours Screen 

[Exit] 

This screen allows the user to manually test the four Solenoid Valves and will display the following parameters: 

Solenoid Test 

Vacuum : 1.0e-01 mbar 

Water : OFF 

Lower Ch. Sel. : ATMOS 

Upper Ch. Inlet Sel. : ATMOS 

Upper Ch. Air Sel. : AIR 

[On] [Off] [Next] [Exit] 

Figure 13: Solenoid Test Screen 

From this screen the user will select which supply they wish to enter the machine’s chambers. Figure 13 depicts this process. 

By setting the Lower Chamber option to either Vacuum or Atmosphere the user will decide whether the lower chamber is 

evacuated or filled with air at atmospheric pressure. Similarly, the user decides whether the upper chamber is to be evacuated 

or filled with air by choosing either Atmos or Vacuum from the Upper Chamber Air Inlet Select option. The air that is supplied 

to the upper chamber can be selected from either air at atmospheric pressure or compressed air supply, as shown below at 

the Upper Chamber Source. 

Page: 19

UPPER CHAMBER 

INLET SELECT 

WAFER 

SOLENOID VALVES 

3.4 The Process Screen Menu 

On entering the process screen, by pressing the [PROCESS] softkey in the title screen (see Figure 4) the following information 

will be displayed: 

i) Current system temperature (i.e. the lowest temperature detected from all the enabled heads). 

This option is shown in all processes apart from the Cold Process, where it is not required. 

ii) Set point temperature, which can be user defined through the temperature setup screen. In 

the Wax Coat and Bond Process this will appear as Bond Temperature, while this option is 

not required in the Cold Process and does not appear for this reason. 

iii) Elapsed time into the process 

iv) Current vacuum level. 

COATED SUPPORT DISC 

DIAPHRAGM 

UPPER CHAMBER AIR SOURCE 

The process cycle is started by pressing the [START] softkey, which will activate either the Wax Coat and Bond Process, the 

Heat and Outgas Process, the Cold Process or the Resin Bond Process, depending upon which process the user selected at 

the Process Control Setup Screen (see Figure 9). The "Set point" prompt shown below will change depending upon which 

process has been selected (the Process Screen shown below is for the Heat and Outgas Process). Should the Wax Coat and 

Bond Process have been chosen, the "Set point" prompt will be replaced with a "Coat temp" prompt, while in the Cold Process 

the prompt space is left empty. In the Resin Bond Process the "Set point" prompt remains the same. The [EXIT] softkey will 

return the operator to the Title Screen. 

The Wax Coat and Bond, Heat and Outgas, Cold and Resin Bond process screens all are detailled over the proceding pages. 

Each stage of the process is shown allowing the user to visualise what should happen once the [START] softkey has been 

pressed. 

ATMOS 

SOLENOID VALVE 

VACUUM 

LINE 

PRESSURE 

ATMOS 

VACUUM PUMP 

LOWER CHAMBER INLET SELECT 

Figure 14: Solenoid Screen Process 

Status: Ready 

Actual: 025°C 

Vacuum: 1.00+03 mBar 

Figure 15: Process Screen 

Set point: 060°C 

Time: 0:00:00 

[Start] [Status] [Exit] 

Page: 20

The operator has the option of stopping each process by pressing the [ABORT] softkey. Should the user select the [ABORT] 

softkey, they will be prompted as to whether they still want to abort or not. Selecting the [No] key will return them to the previous 

screen, allowing the user to continue as before. On selecting the [Yes] key, the "Status" prompt will display the message 

"Cooling (user abort)". 

Selecting the [STATUS] option will take the user to the Head Status Screen (this does not apply to single head machine users). 

This screen displays which heads have been turned on or off by the user, process type and timings. 

HEAD 1 

ON 

HEAD 2 

ON 

HEAD 3 

OFF 

Process type: Outgas before Heat 

O.g. limit: 10 mins Outgas: 0:00 

Soak: 10 mins 

Heat: 0:00 

Bond: 10 mins 

Cool: 0:00 

Figure 16: Head Status Screen 

Should any difficulties occur that lead to one of the bonding head’s temperature controller not working a COMMUNICATIONS 

ERROR message will appear on the screen. 

When this message appears the user should switch off the unit and restart, as the bonding head affected by the message will 

no longer work. This bonding head will be shown as being switched off in the [STATUS] screen, with a message directly below 

it reading "Comms?". This message denotes that the temperature controller is not longer communicating with unit’s host 

processor nad the user should either contact the service engineer or Logitech directly. 

Once the unit has completed a full process, the display screen will show the word "Ready" next to the "Status" prompt (as 

shown in the first screen of each process). However, it should be noted that the final screen will also contain a "Last" prompt 

that informs the user of how the unit performed during the previous process. The different variables shown by the "Last" prompt 

are "OK", "User Abort", "Outgas Time Error", and "Threshold Error". This message will not appear if the unit is still to go through 

its first process. 

Status: Ready Last: OK 

Bonding temperature reached: 75 

Vacuum: 1.00+03 mBar Time: 0:03:40 

o C 

[+veP] 

Figure 17: Process End Screen 

[STATUS] [ABORT] 

NB To avoid the machine automatically aborting, ensure that the outgas time, set in the Process Control Setup screen, is longer 

than the actual outgassing time. 

Page: 21

3.4.1 Wax Coat and Bond Process 

Actual: 75 

Vacuum: 9.4E-02 mBar Time: 0:02:26 

o C Coat temp: 65 o Status: Ready 

C 

[Start] 

[Status] [Exit] 

The above screen shows a unit before starting the Wax Coating process. Once the user presses the [Start] softkey the unit 

will automatically move onto the "Heat" stage of the process displaying the screen depicted below. 

Actual: 25 


o C Coat temp: 65 o Status: Heat Wait Cool Wait Cool 

C 

[Status] [Abort] 

Coating temperature reached: 65 


o Status: Heat Wait Cool Wait Cool 

C 

[Cont.] 


When the coating temperature is reached, the above screen will be displayed and an audible warning will be issued. The user 

should open the sample chamber lids, apply wax to the support discs and press the [CONT.] softkey. After carrying out this 

procedure, the screen shown below will be displayed and the heads will start to cool until they reach the loading temperature. 

Actual: 61 



C Load temp.: 60 o C 


Page: 22

Loading temperature reached: 60 



C 

[Cont.] 


Once the loading temperature has been reached, the above screen will be displayed and a second audible warning will be 

issued. The user should load the samples on to the wax-coated support discs, cover with filter paper, close the lids securely 

and press the [CONT.] softkey. The screen shown below will then be displayed and the heads will cool to the hardening 

temperature. 

Actual: 59 



C Harden temp.: 55 o C 


Once the Wax Coating Process has been completed the unit will move onto the Bonding Process. In the screen depicted below 

the unit is emptying the chambers of air and will remain at this stage until the Vacuum proceed level is reached or, alternatively, 

the maximum outgas time is exceeded, whereupon the screen will read "Cooling (Outgas Timer Overrun)" at the "Status" 

prompt. 

Actual: 56 


o Status: Outgas Heat Soak Bond Cool 

C 

Set point: 60 o C 


Once the Outgas phase is complete the screen will move onto the "Heat" phase, as shown below. Whilst the "Heat" phase is 

highlighted, the machine will monitor the temperature of the heads until the procedure setpoint is reached before moving onto 

the "Soak" phase. 

Page: 23

Actual: 60 



C 



Providing the set point temperature is reached the screen will highlight the "Soak" phase. 




C 


During the "Soak" phase the vacuum level is monitored and compared to the proceed vacuum level. Should the vacuum rise 

above this preset level it will automatically switch to the abort sequence displaying the message "Cooling (Threshold Error)" 

at the "Status" prompt. 




C 

[+ve P] 


Once the bonding phase is reached the operator has the option of applying positive pressure to the upper chamber by pressing 

the [+ve P] softkey as shown above. After the user has applied positive pressure the [+ve P] option will no longer be shown. 

If "auto" was selected from the Solenoid Setup Screen, this option will not appear on the process initiated screen. Instead the 

machine will automatically set the positive pressure delay to the time interval entered at the positive pressure delay prompt in 

the Process Control Setup Screen. 

Actual: 50 



C 

End point: 45o C 

[Status] 

Page: 24

After completing the bonding cycle, the machine will enter into the cooling cycle, which lasts until the end point temperature is 

reached. During this process the machine heads cannot be opened. The process is complete once the "Status" prompt returns 

to showing the word "Ready" and the "Last" prompt appears, as shown below. 

3.4.2 Heat and Outgas Process 

Actual: 32 


o Status: Ready 

C 

Last: OK 

Coat temp: 65 o C 

[Start] 


Actual: 26 


o Status: Ready 

C 

Set point: 60oC [Start] 


As in the second part of the Wax Coat and Bond process, detailed in the previous section, the Heat and Outgas Process 

consists of the same phases shown below at the "Status" prompt. Once the user has pressed the [START] softkey depicted 

above, the unit will automatically move through each phase. 

Actual: 33 



C 



In this process the "Outgas" and "Heat" phases are both highlighted, as the unit will monitor the evacuation of the system until 

the proceed threshold is reached, but will also monitor the system temperature on all heads until the procedure setpoint is 

reached. 

Page: 25

Once the unit has achieved the appropriate temperature on all heads, combined with the appropriate evacuation level, the 

screen will move onto the "Soak" phase and follow exactly the same procedure as in the bonding sequence described in the 

Wax Coat and Bond Process. The following two screens show this. 

The "Bond" phase screen in the Heat and Outgas Process: 

The "Cool" phase screen in the Heat and Outgas Process: 




C 





C 

[+ve P] 


Actual: 56 



C End point: 45 o C 

[Status] 

Page: 26

3.4.3 Cold Process 

In this process the vacuum level is monitored and once the correct level has been reached, the system will start the process 

cycle whilst continuing to monitor the vacuum level, ensuring that it doesn’t rise above the abort threshold. 

The user should note that the "Status" prompt only shows "Outgas" and "Bond" phases. This is due to there being no 

requirement for the system to reach a heat temperature prior to starting the bond process and there being no subsequent 

requirement for the system to cool down. 

3.4.4 Resin Bond Process 

Status: Ready 

Vacuum: 9.4E-02 mBar 

[Start] 

Status: Outgas Bond 


Status: Outgas Bond 


[+ve P] 

Time: 0:05:17 

[Status] 

Time: 0:00:05 

[Status] 

Time: 0:00:22 

[Status] 

[Exit] 

Status: Ready 

Actual: 25 


o C Set point: 60 o C 

[Start] 

[Status] 

[Abort] 

[Abort] 

[Exit] 

Page: 27

This process is used to bond two wafers together, rather than bonding a wafer to a support disc as in each of the other 

processes. The resin used should be a silicon resin that cures quickly at high temperatures. 

Status: Outgas Bond Heat Soak Cool 

Actual: 25 



[Status] 

[Abort] 

In the "Outgas" phase the unit will evacuate the specimen chambers at room temperature prior to moving onto the "Bond" 

phase. 


Actual: 25 



[+ve P] 

[Status] 

[Abort] 

Once the wafers are sufficiently bonded, the unit moves into the "Heat" phase, where the resin will cure once the required 

temperature is reached. After achieving this the unit moves through the "Soak" and "Cool" phases before the bonded wafers 

can be removed from the sample chambers. 




o C 

[Status] 




oC [Status] 

[Abort] 

[Abort] 

Page: 28


Actual: 60 


o C End Point: 45 o C 

[Status] 

[Abort] 

Page: 29

4 WSBU SYSTEM MAINTENANCE 

24 

Figure 18: Bonding Head (top view) 

4.1 Replacing the Bonding Head Diaphragm 

To replace the bonding head diaphragm, it is first necessary to remove the top cover of the bonding head. 

Remove the centre screw on the metal bar (21), then remove the two screws at the hinge end of the bar (22). Release the 

retaining thumb screws (17) and swing them down on to the work deck. The head can now be lifted away from the machine to 

replace the diaphragm. 

Release the eight M5 screws (23) which clamp the diaphragm between the lower ring and the lid, separate the two parts, and 

remove the old diaphragm. 

Place the new diaphragm between lid and lower ring, and re-attach the eight screws. NOTE: Ensure that the holes in the 

diaphragm are clear of the screws, to avoid tearing the diaphragm and causing vacuum problems. 

Refit the bonding head cover to the machine, and then test the system vacuum to ensure that there are no leaks. 

22 

17 

21 

23 

Page: 30

4.2 Removing the Top Casing 

The Logitech Wafer Substrate Bonding System is designed to require minimal regular maintenance. The Top Casing should 

only be removed after consultation with Logitech or their representative. 

SWITCH OFF THE MACHINE, DISCONNECT FROM THE MAINS SUPPLY AND ENSURE THAT THE BONDING HEADS 

ARE AT OR NEAR AMBIENT TEMPERATURE. 

(Refer to diagram on the previous page, and Figures 1 and 2 at the start of the manual) 

The machine should first be raised about 6 inches (15cm) off the bench on blocks. Release the thumb screws (17) on each 

bonding head, remove the two screws (22) at the rear of each bonding head which retain the head on the hinge, and then lift 

off the head. Remove the two screws (24) from each Thumbscrew Retaining Plate on either side of each bonding head and 

remove these plates. Remove the casing retaining screws from around the base of the casing at the sides and rear. There are 

six of these screws on a single station machine and seven on a three station machine. Finally remove the casing retaining 

screws under the front edge of the casing. There are two of these screws on a single station machine and three on a three 

station machine. Lift the casing from the machine. 

NOTE: NORMAL SAFETY PRECAUTIONS SHOULD BE TAKEN TO AVOID ELECTRIC SHOCK IF WORKING ON THE 

MACHINE WITHOUT THE CASING ON. 

After working on the interior it is recommended that a low temperature bonding cycle is run (say up to 50° C) before refitting 

the casing to check the integrity of any pipe or electrical connections which may have been disturbed. 

4.3 Filling the System with Oil 

All models use Shell Thermia B oil. 

Oil Capacities: 

6" Single head system -750mls 

4" Single head system -750mls 

4" Triple head system - 750mls 

6" Triple head system - 1.5 litres 

Tools Required 

3m Allen key for the 4mm cap screws, which hold the tank lid on. 

Spanners: 14mm for the 4" WSB's ¼" pipe fittings or 

16mm for the 6" WSB's 8mm fittings 

22mm for the vacuum fittings 

5/16" Whitworth for the Brass water inlet fitting 

¼" BSP needs a 19mm AF Spanner for the oil plug. 

Jug to pour thermal oil 

Materials: 

Thermia B oil 

Procedure: 

The reservoir tank is located next to the heat exchanger and the top lid has a Red plastic nut (¼" BSP) 

fitted to check the oil level when the system is not running. To refit, use a 19mm AF Spanner. The lid is 

held in place by 3 hex screws. Remove these and the open tank is ready to fill. 

Page: 31

The inside of the tank wall should have a scribe line at about 25mm below the sidewall inlet hole (the 

earliest machines did not). This is the fill level. See above for correct volumes. 

If the tank is being filled for the first time and is empty, overfill it to just below the inlet hole and then 

power up the pump to run the oil through the system. 

On the first few machines i.e. those with v1.7 software, there was no facility to run the pump out with the 

cooling cycle, and so the pump was powered directly. Also, on the very first machine with the new heat 

exchanger, the single head 6", the pump was a 220 volt mains pump). 

Watch the oil as it begins to re-enter the tank through the sidewall pipe. Run the pump until the incoming 

oil is clear of air and then stop the cycle. The oil will settle and then can be topped up to the scribe level 

or 25mm below the sidewall hole 

. 

Then refit the top lid and reassemble the WSB casing. 

Note: If the heat exchanger or any pipes need removed or replaced a 14mm spanner is needed. 

Note: If the system needs drained, unscrew one of the easiest to reach oil connectors at the lowest 

point. The machine can be propped up in the opposite corner on wooden blocks (~100mm high) to aid 

the flow out of the open pipe. 

4.4 Fault Finding 

The following are intended as diagnosis points only. Logitech will be pleased to assist with any fault diagnosis and repair or 

replacement of any part of the system during the warranty period and to provide prompt advice and service thereafter. 

4.4.1 No Front Panel Display 

Check the connections to the control board mounted on the rear of the front panel. If these are all secure check that there is 

12 volts at the power supply. 

4.4.2 Head Malfunction 

Check that all of the connectors at the base of the relevant temperature controller are correctly inserted. 

Page: 32

5. WSB1 SPARE PARTS 

2ELC-519 

2ELC-520 

2ELC-327 

2ELC-328 

2ELC-489 

2ELC-486 

2MTR-080 

2ELC-461 

Cat No Description 

2ELC-327 240V axial fan 


2ELC-461 Mains filter 

2ELC-486 12V power supply 

2ELC-489 Power supply cover 

2ELC-519 Pressure solenoid 240V 


2MSC-290 Heat exchanger 

2MTR-080 Oil pump motor 

2NUT-043 Thumb screw 

2PNU-221 Oil pump 

2PNU-221 

Figure 19: Three-station unit (rear view) 

WBS1-0504 Modified solenoid 240V 


2MSC-290 

2NUT-043 

WBS1-0504 

WBS2-0504 

Page: 33

2PNR-119 

2PNR-120 

2MSC-290 

2PNU-221 

2MTR-080 

2PAN-061 


2CAS-101 Control housing 

2GAG-036 Panel mount pressure gauge 

2GAG-037 Vacuum / pressure gauge 


2ELC-522 Temperature controller 

2ELC-540 Solid state relay 



2PAN-061 Membrane panel 

2PCB-054 Solid state relay snubber board 

2PCB-062 4 channel relay board 

2PNR-119 Viton O-ring 


2ELC-522 2ELC-540 

2PCB-054 

2GAG-037 

Figure 20: Three-station unit (top view) 

2CAS-101 

2PNU-107 

vacuum cold oil hot oil oil drain water inlet 

Note: Colour-coding on this diagram is intended to help the user identify pipes. It does 

not represent colours used on the actual system. 

2ELC-327 

2ELC-328 

2PCB- 

062 

2PNU-002 

2GAG-036 

water outlet 

Page: 34

2PNU-221 

2MTR-080 

2NUT-043 


2PNU-002 Air supply regulator 

2PNU-107 Needle valve 


WBS2-0504 

WBS1-0504 




2ELC-522 Temperature controller 

2ELC-540 Solid state relay (below 2ELC-522) 



2NUT-043 Thumb screw 

2PCB-054 SSR snubber board (below 2ELC-522) 

2PCB-062 4 channel relay board 


2MSC-290 

Figure 21: Single-station unit (top view) 

2ELC-328 

2ELC-327 

2ELC-540 

2PCB-054 

2ELC-522 

2PCB-062 

Page: 35

2GAG-037 

2PNR-119 

2PNR-120 

2PNU-107 




2PAN-061 

2CAS-101 2PNU-002 



2GAG-036 Panel mount pressure gauge 

2GAG-037 Vacuum / pressure gauge 




2ELC-486 12V power supply 

2ELC-489 Power supply cover 


2GAG-036 

Figure 22: Single-station unit (2) 

2ELC-486 

2ELC-489 

vacuum cold oil hot oil oil drain water inlet 

2ELC-522 

Note: Colour-coding on this diagram is intended to help the user identify pipes. It does 

not represent colours used on the actual system. 

2ELC-327 

2ELC-328 

2ELC-461 

2ELC-519 

2ELC-520 

water outlet 

Page: 36



2PAN-061 Membrane panel 



2PNU-002 Air supply regulator 

2PNU-107 Needle valve 

Page: 37


Other spares not shown on diagrams: 

2BRG-009 Bearing 

2CAS-099 Bonder casing (single station unit) 

2CAS-100 Bonder casing (three station unit) 


2ELC-485 Power supply loom kit 

2ELC-523 Heating element 

2ELC-524 20-way connector (rear of display panel) 

2ELC-527 Harness set (single-station unit) 

2ELC-528 Harness set (three-station unit) 

2ELC-530 Insulated thermocouple 

2PCB-052 Display module 

2PCB-055 WSB processor board 

2PNR-140 Adjustable foot 

2SCR-219 Swing bolt for thumb screw 

2VAC-002 Balston filter for vacuum pump 

2VAC-006 110V/60Hz E2M1.5 vacuum pump 

2VAC-007 240V/50Hz E2M1.5 vacuum pump 

2VAC-018 Active gauge head 

2VAC-087 Stainless steel bellows 

2VAC-106 8-way connector 

WBS1-0402 Bonding diaphragm 

WBS1-0408 Substrate holding ring 

Page: 38

APPENDIX A 

WIRING DIAGRAM 

Page: 39

APPENDIX B 

MSDS 

COSHH 

Page: 40

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