Testing 1 - UCSB SoC Design and Test Lab
Testing 1 - UCSB SoC Design and Test Lab
Testing 1 - UCSB SoC Design and Test Lab
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Failure rate<br />
Typical Bathtub Curve of IC’s<br />
Failure Rate<br />
Earlyfailure<br />
period<br />
Useful-life period<br />
Wearout<br />
period<br />
Cumulative operating time<br />
~1,000 hours >10years<br />
© K.-T. Cheng, component.ppt, v1.0<br />
15<br />
Burn-in <strong><strong>Test</strong>ing</strong><br />
! Correlations have been made between life span at room<br />
temperature & life span at elevated temperature.<br />
! Charts of these correlations have been made for each<br />
technology<br />
! Put the device in a furnace for a certain length of time at<br />
an elevated temperature <strong>and</strong> voltage<br />
– By applying high voltage to the IC’s pins, burn-in<br />
accelerates the time-to-failure of oxide defects (weak<br />
oxide, pin holes, uneven layer growth, etc) typically<br />
found in MOS devices<br />
– High temperature accelerates these <strong>and</strong> other defects,<br />
such as ionic contamination <strong>and</strong> silicon defects<br />
© K.-T. Cheng, component.ppt, v1.0<br />
16
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