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Directed Self Assembly (DSA) - Sokudo

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Contact Hole <strong>DSA</strong> Shrink Process …<br />

65~80nm CH<br />

20~24nm CH<br />

Chris Bencher, et.al. “<strong>Directed</strong> <strong>Self</strong>-<strong>Assembly</strong> Defectivity Assessment,”<br />

Alternative Lithographic Technologies IV, Proc. of SPIE Vol. 8323 © 2012 SPIE<br />

14 SKD-120711(L1)

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