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Directed Self Assembly (DSA) - Sokudo

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550 Million Vias inspected on 300mm wafer<br />

Chris Bencher, et.al. “<strong>Directed</strong> <strong>Self</strong>-<strong>Assembly</strong> Defectivity Assessment,”<br />

Alternative Lithographic Technologies IV, Proc. of SPIE Vol. 8323 © 2012 SPIE<br />

16 SKD-120711(L1)<br />

Applied Materials<br />

UVision 3

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