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Backend Process Exposure Tool Backend Process ... - Sokudo

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Depth of Focus for 1 μm pattern<br />

FPA-5510iV achieves large common DOF<br />

Reduction optics<br />

New chuck system<br />

Die-by-die tilt & focus<br />

50<br />

40<br />

FPA-5510iV<br />

Target: 1.0 μm L/S<br />

Image Field: 52 ×34<br />

Measurement points:<br />

9points / Field<br />

∆CD (%)<br />

30<br />

20<br />

10<br />

0<br />

‐10<br />

12.2 μm<br />

Measurement Points<br />

<strong>Exposure</strong> Image Field<br />

34 mm<br />

‐20<br />

‐15 ‐10 ‐5 0 5 10 15<br />

52 mm<br />

Focus (μm)<br />

20 th SOKUDO Breakfast Forum, July 10,2013 Slide Slide 8/23 8

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