Advances in Solid-State Joining at EWI
Advances in Solid-State Joining at EWI
Advances in Solid-State Joining at EWI
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
Temp (deg C)<br />
Cool<strong>in</strong>g r<strong>at</strong>e (deg C/sec)<br />
Thermal Analysis of Various<br />
Localized Deposition Processes<br />
1600<br />
1400<br />
1200<br />
1000<br />
GTAW<br />
PAW<br />
PTA<br />
LBW<br />
ESD<br />
1.E+06<br />
1.E+05<br />
1.E+04<br />
GTAW<br />
PAW<br />
PTA<br />
LBW<br />
ESD<br />
800<br />
600<br />
400<br />
200<br />
0<br />
0 0.005 0.01 0.015 0.02 0.025<br />
Distance (mm)<br />
1.E+03<br />
1.E+02<br />
1.E+01<br />
1.E+00<br />
0 200 400 600 800 1000 1200 1400<br />
Temp (deg C)<br />
Arc and Laser Processes:<br />
2<br />
ESD:<br />
T T T T erf<br />
m m o<br />
x<br />
x<br />
Q<br />
T e T<br />
2 KR<br />
sp<br />
C T T<br />
p m o<br />
H<br />
m<br />
V R x<br />
1<br />
o<br />
Arc and Laser Processes:<br />
dT<br />
dt<br />
ESD:<br />
2 Cp<br />
x H<br />
2<br />
sp<br />
m<br />
dT<br />
dt<br />
T<br />
m<br />
V<br />
2 K T To<br />
T<br />
o<br />
2<br />
Q<br />
2
Change language