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ML6554 3A Bus Termination Regulator - Future Electronics

ML6554 3A Bus Termination Regulator - Future Electronics

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Functional DescriptionThis switching regulator is capable of sinking and sourcing <strong>3A</strong> ofcurrent without an external heatsink. The <strong>ML6554</strong> uses a powersurface mount package (PSOP) that includes an integrated heatslug which is inherently connected to GND. The heat can bepiped through the bottom of the device and onto the PCB (Figure1).The <strong>ML6554</strong> integrates two power MOSFETs that can be usedto source and sink <strong>3A</strong> of current while maintaining a tight voltageregulation. Using the external feedback, the output can beregulated well within 3% or less, depending on the externalcomponents chosen. Separate voltage supply inputs have beenadded to accommodate applications with various power suppliesfor the databus and power buses, see Figure 2.OutputsThe output voltage pins (V L1 , V L2 ) are tied to the databus,address, or clock lines via an external inductor. See the Applicationssection for recommendations. Output voltage is determinedby the V CCQ or VREF IN inputs.InputsThe input voltage pins (V CCQ or VREF IN ) determine the outputvoltages (V L1 or V L2 ) . In the default mode, where the VREF INpin is floating, the output voltage is 50% of the V CCQ input.V CCQ can be the reference voltage for the databus.Output voltage can also be selected by forcing a voltage at theVREF IN pin. In this case, the output voltage follows the voltageat the VREF IN input. Simple voltage dividers can be used thiscase to produce a wide variety of output voltages between 0.7Vand V DD –0.7V.VREF Input and OutputThe VREF IN input can be used to force a voltage at the outputs(Inputs section, above). The VREF OUT pin is an output pin thatis driven by a small output buffer to provide the V REF signal toother devices in the system. The output buffer is capable of drivingseveral output loads. The output buffer can handle 3mA.Other Supply VoltagesSeveral inputs are provided for the supply voltages: PV DD1 ,PV DD2 , AV CC , and V DD .The PV DD1 and PV DD2 provide the power supply to the powerMOSFETs. V DD provides the voltage supply to the digital sections,while AV CC supplies the voltage for the analog sections.Again, see the Applications section for recommendations.Feedback InputThe V FB pin is an input that can be used for closed loop compensation.This input is derived from the voltage output. Seeapplication section for recommendation.<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>HEAT SLUGConnect this slug to a GNDPlane for better Thermalconductivity.Figure 1. Cutaway view of PSOP Package<strong>ML6554</strong> Rev. 1.1.54 www.fairchildsemi.com


ApplicationsUsing the <strong>ML6554</strong> for SSTL <strong>Bus</strong> <strong>Termination</strong>The circuit schematic in Figure 2 shows a recommendedapproach for constructing a bus terminating solution for anSSTL-2 bus. This circuit can be used in PC memory and Graphicsmemory applications as shown in Figures 4 and 5. Note thatthe <strong>ML6554</strong> can provide the voltage reference (V REF ) and terminatingvoltages (V TT ). Using the layout as shown in Figures 6, 7,and 8, and measuring the V TT performance using the test setupas described in Figure 9, the <strong>ML6554</strong> delivered a V TT ± 20mVfor 1A to <strong>3A</strong> loads (see Figure 10). Table 1 provides a recommendedparts list for the circuit in Figure 2.Power Handling Capability of the PSOPPackageUsing the board layout shown in Figures 6, 7, and 8; solderingthe <strong>ML6554</strong> to the board at zero LFPM the temperature aroundthe package measured 55°C for <strong>3A</strong> loads. Note that a 1 ouncecopper plane was used in the board construction.Airflow is not likely to be needed in the operation of this device(assuming a board layout similar to that described above). Thepower handling performance of the PSOP package is shown bya study of the package manufacturer for various airflow vs. θ JAconditions in Figure 11.<strong>Bus</strong> <strong>Termination</strong> Solutions for Others <strong>Bus</strong>esTable 3 provides a summary of various bus termination V REF &V TT requirements. The <strong>ML6554</strong> can be used for those applications.<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>R2 100ΩC8 0.1µF2.5V TO 4VR1 100ΩC9 0.1µFU1<strong>ML6554</strong>R3100kΩC5 C6330µF 330µFV TTTPITO SDRAMSC1820µFF2VOS-CONL1 3.3µH C3 0.1µFC20.1µFC4 0.1µF12345678V DDPV DD1V L1P GND1P GND2V L2PV DD2D GNDAV CCV CCQVREF OUTAGNDSHDNVREF INV FBV DD161514131211109V CCQVREF OUTSHDNVREF INR4 100kΩR5 1kΩC7 1nFGNDGNDFigure 2. Typical Application Circuit<strong>ML6554</strong> Rev. 1.1.55 www.fairchildsemi.com


V TTTO SDRAMSC1820µFF2VOS-CONL1 3.3µHC20.1µFC3 10µF12345678V DDPV DD1V L1P GND1P GND2V L2PV DD2D GNDU1<strong>ML6554</strong>AV CCV CCQVREF OUTAGNDSHDNVREF INV FBV DD161514131211109R3100kΩV CCQVREF OUTSHDNVREF IN2.5V TO 4VC5 C6330µF 330µF<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>R1 100kΩR2 1kΩC4 1nFGNDGNDFigure 3. Alternate Application CircuitAn alternate application circuit for the <strong>ML6554</strong> is shown in Figure3. The number of external components is reduced comparedto the circuit in Figure 2. This is achieved by replacingfour, 0.1µF bypass capacitors with one, low ESR, 10µF ceramiccapacitor placed right next to U1. Two 100Ω resistors are alsoeliminated. High value, surface-mount MLC capacitors were notavailable when the original application circuit (Figure 2) wasdeveloped. Both application circuits offer the same electricalperformance but that shown in Figure 2 has a reduced bill-ofmaterials.Table 2 shows the recommended parts list for the circuitof Figure 3.<strong>ML6554</strong> Rev. 1.1.56 www.fairchildsemi.com


PC CHIP SETNORTHBRIDGEDATA LINE, CLOCK LINES,ADDRESS LINES, CONTROL LINESTERMINATIONRESISTORS168/184/208-PIN DIMM CONNECTORSAND SDRAM/SGRAM MODULESTERMINATIONRESISTORSVTT<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>VREF<strong>ML6554</strong>Figure 4. Complete <strong>Termination</strong> Solution PC Main Memory (PC Motherboard)SO DIMMAND MODULESTERMINATIONRESISTORSSGRAM3DGRAPHIC CHIPDATA LINE, CLOCK LINES,ADDRESS LINES, CONTROL LINESVOLTAGEREGULATORTERMINATIONRESISTORS2.5VVTTVREF<strong>ML6554</strong>5V OR 3.3VAGP/PCI BUSFigure 5. Complete <strong>Termination</strong> Solution Graphics Memory <strong>Bus</strong> – AGP Graphics Cards<strong>ML6554</strong> Rev. 1.1.57 www.fairchildsemi.com


Figure 6. Top Silk<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>Figure 7. Top LayerFigure 8. Bottom Layer<strong>ML6554</strong> Rev. 1.1.58 www.fairchildsemi.com


3.3V POWERSUPPLYVV CCQSUPPLYAACTIVECLAMPV CCQV DD<strong>ML6554</strong>EVALGNDV TTI TTCURRENT SOURCE/SINKPOWER SUPPLY<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>VAFigure 9. Test Circuit SetupV TT VARIANCE WITH V DD @I TT (V CCQ 2.5V)TESTED WITH EVAL PCBI TT<strong>3A</strong> SINKING2A SINKING1.29V TT (V)1.281.271A SINKING0A SINKING<strong>3A</strong> SOURCING2A SOURCING1.262.0 2.5 3.0 3.5 4.0V DD (V)1A SOURCINGFigure 10. VTT Performance for SSTL-2 <strong>Bus</strong><strong>ML6554</strong> Rev. 1.1.59 www.fairchildsemi.com


Table 1. Recommend Parts List for SSTL-2 <strong>Termination</strong> Circuit in Figure 2.Item Qty Description Manufacturer / Part Number DesignatorResistors1 2 100Ω1210 SMD Panasonic/ERJ-8ENF1000V R1, R22 1 1kΩ 1210 SMD Panasonic/ERJ-8ENF1001V R53 2 100kΩ1210 SMD Panasonic/ERJ-8ENF1003V R3, R4CapacitorsICSMagneticsOther4 3 0.1µF 1210 Film SMD Panasonic/ECV3VB1E104KC2, C8, C9Panasonic/ECU-V1H104KBW5 1 820µF 2V Solid Elect. SMD Sanyo/2SV820M Os Con C16 2 330µF Tant 6.3V 100mΩ AVX/TPSE337M006R0100 C5, C67 1 1nF 1210 Film SMD Panasonic/ECU-V1H102KBM C78 2 0.1µF 0805 Film Panasonic/ECJ-2VF1C104Z C3, C49 1 <strong>ML6554</strong> <strong>Bus</strong> TerminatorPower SOP Package<strong>ML6554</strong>CU or <strong>ML6554</strong>IU10 1 3.3µH 5A inductor SMD Coilcraft/D03316P-332HCPulse Eng./ P0751.332TGowanda/SMP3316-331MXFMRS inc./XF0046-S411 1 Scope probe socket Tektronics/131-4353-00 TP112 1 12 Pin breakaway strip Sullins/PTC36SAAN (36 PINS) I/O, standoffsU1L1<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>Table 2. Recommend Parts List for Figure 3.Item Qty Description Manufacturer / Part Number DesignatorResistors1 2 100kΩ 0805 SMD Panasonic/ERJ-8ENF1000V R1, R32 1 1kΩ 0805 SMD Panasonic/ERJ-8ENF1000V R2CapacitorsICSMagneticsOther3 1 0.1µF, 1210 Film SMD Panasonic/ECV3VB1E104KC2Panasonic/ECU-V1H104KBW4 1 820µF 2V Solid Elect. SMD Sanyo/2SV820M Os Con C15 2 330µF Tant 6.3V 100mΩ AVX/TPSE337M006R0100 C5, C66 1 1nF 1210 Film SMD Panasonic/ECU-V1H102KBM C47 1 10µF 6.3V Ceramic TDK/C2012X5R0J106M C38 1 <strong>ML6554</strong> <strong>Bus</strong> TerminatorPower SOP Package<strong>ML6554</strong>CU or <strong>ML6554</strong>IU9 1 3.3µH 5A inductor SMD Coilcraft/D03316P-332HCPulse Eng./ P0751.332TGowanda/SMP3316-331MXFMRS inc./XF0046-S410 1 Scope probe socket Tektronics/131-4353-00 TP111 1 12 Pin breakaway strip Sullins/PTC36SAAN (36 PINS) I/O, standoffsU1L1<strong>ML6554</strong> Rev. 1.1.510 www.fairchildsemi.com


Vendor List1. AVX (207) 282-51112. Sanyo (619) 661-68353. Tektronix (408) 496-08004. Coilcraft (847) 639-64005. Pulse (800) 797-85736. Gowanda (716) 532-22347. Xfmrs Inc. (317) 834-10668. Panasonic (714) 373-73669. Digikey (800) 344-45396060<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>4040θ JA (ºC/W)20Θ JA (ºC/W)2000.016Ld PSOP22.3x3.1mm PAD1.9mm DIE0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0POWER (W)NATURAL CONVECTION Θ JA TEST RESULTS1.27mm PITCH PowerSOP 2SLUG SOLDERED016Ld PSOP22.3x3.1mm PAD1.9mm DIE @ 0.8 WATTS0 100 200 300 400 500AIR VELOCITY (LFPM)FORCED CONVECTION Θ JA TEST RESULTS1.27mm PITCH PowerSOP 2SLUG SOLDEREDFigure 11. Graphical Results Summary – 1S2P Test Board<strong>ML6554</strong> Rev. 1.1.511 www.fairchildsemi.com


DRAWING NUMBERENG-CB-1007 REV AApplicable Jedec Spec JC 51-X (Note 1)(Proposed Spec)Substrate MaterialFR-4Dimensions (LxW) (Overall)114.3 x 76.2mmDimensions (LxW) (Metallization)55 x 65mmDimensions (LxW) (Inner Planes)73 x 73mmThickness1.6 mmPitch1.27mmStackup (# Signal Layers, # Cu Planes)1S2PCu Trace Coverage (Signal Layer) 12%Cu Coverage (Internal Layer) 100%Trace Width (Spec/Measured)235.5±25.5/288µmTrace Cu Thickness (Spec/Measured)70±14/67µmInner Cu Thickness (Spec/Measured)35±3.5/31µmBuild #C1797<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>Note 1: Proposed Spec "Thermal Test Board with Two Internal Solid Copper Planes for leaded Surface Mount Packages".Figure 12. Test Board Layout for Θ JA vs. AirflowTable 3. <strong>Termination</strong> Solutions Summary By <strong>Bus</strong>s Type<strong>Bus</strong>DescriptionDrivingFairchildMethod VDDQ VTT V REF SolutionsIndustrySystemComponentsGTL+GunningTransceiver<strong>Bus</strong> PlusOpen Drain 5v or 3.3VNote 101.5V±10%Note121.0V±2%Note 11<strong>ML6554</strong>CU;Mode: V REFInput = 1.5V,V CC = 5V300 to 500MHzProcessor;PC Chipsets;GTLP 16xxxBuffers;Fairchild,Texas Instr.SSTL_2Series StubTerminatedLogic for 2VSymmetricDrive, SeriesResistance2.5V±10% 0.5x(V DDQ )±3%2.5V <strong>ML6554</strong>CUor ML6553CS;Mode: V REFInput = Floatingor Forced,V CC = 3.3VSSTL SDRAM;Hitachi,Fujitsu,NEC, Micro,MitsubishiRAMBUSRAMBUSSignalingLogicOpen DrainNoneSpecified2.5V 2.0V ML6553CS;Mode: V REFInput = Open,V CC = V DDQnDRAM,RAMBUS,Intel, ToshibaLV-TTLLow VoltageTTL Logic orPECL or3.3V VMESymmetricDrive3.3±10% V DDQ /2 3.3V ML6553CS;Mode: V REFInput = Open,VCC = VDDQProcessors orbackplanes;LV-TTLSDRAM,EDO RAM<strong>ML6554</strong> Rev. 1.1.512 www.fairchildsemi.com


Mechanical Dimensions16-Pin PSOP6.00PIN ONEINDICATOR(0.30)169.90 ± 0.108.891 81.279A0.510.35B3.90 ± 0.100.25 M C B A1.951.753.700.601.277.508.89LAND PATTERN RECOMMENDATION2.50 7.403.50<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>1.75 MAX1.45 +0.05–0.20CSEE DETAIL A0.250.19(R0.10)(R0.10)8°0°0.70 ± 0.20(1.04)DETAIL ASCALE: 2:1+0.100.15–0.050.500.25X 45°GAGE PLANE0.36SEATING PLANE0.10 CNOTES: UNLESS OTHERWISE SPECIFIEDA) THIS PACKAGE CONFORMS TO JEDECMS–012, VARIATION AC, ISSUE C,DATED MAY 1990.B) ALL DIMENSIONS ARE IN MILLIMETERS.C) DIMENSIONS DO NOT INCLUDE MOLDFLASH OR BURRS.Ordering InformationPart Number Temperature Range Package<strong>ML6554</strong>CU 0°C to 70°C 16-Pin PSOP (U16)<strong>ML6554</strong>IU -40°C to +85°C 16-Pin PSOP (U16)<strong>ML6554</strong> Rev. 1.1.513 www.fairchildsemi.com


TRADEMARKSThe following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and isnot intended to be an exhaustive list of all such trademarks.ACExActiveArrayBottomlessCoolFETCROSSVOLTDOMEEcoSPARKE 2 CMOSEnSignaFACTFACT Quiet SeriesDISCLAIMERFAST ®FASTrFPSFRFETGlobalOptoisolatorGTOHiSeCI 2 Ci-LoImpliedDisconnectAcross the board. Around the world.The Power Franchise ®Programmable Active DroopIntelliMAXISOPLANARLittleFETMICROCOUPLERMicroFETMicroPakMICROWIREMSXMSXProOCXOCXProOPTOLOGIC ®OPTOPLANARPACMANPOPPower247PowerEdgePowerSaverPowerTrench ®QFET ®QSQT OptoelectronicsQuiet SeriesRapidConfigureRapidConnectµSerDesSILENT SWITCHER ®SMART STARTSPMStealthSuperFETSuperSOT-3SuperSOT-6SuperSOT-8SyncFETTinyLogic ®TINYOPTOTruTranslationUHCUltraFET ®UniFETVCX<strong>ML6554</strong> <strong>3A</strong> <strong>Bus</strong> <strong>Termination</strong> <strong>Regulator</strong>FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANYPRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITYARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES ITCONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices orsystems which, (a) are intended for surgical implant intothe body, or (b) support or sustain life, or (c) whosefailure to perform when properly used in accordancewith instructions for use provided in the labeling, can bereasonably expected to result in significant injury to theuser.PRODUCT STATUS DEFINITIONSDefinition of Terms2. A critical component is any component of a lifesupport device or system whose failure to perform canbe reasonably expected to cause the failure of the lifesupport device or system, or to affect its safety oreffectiveness.Datasheet Identification Product Status DefinitionAdvance InformationPreliminaryNo Identification NeededFormative orIn DesignFirst ProductionFull ProductionThis datasheet contains the design specifications forproduct development. Specifications may change inany manner without notice.This datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to makechanges at any time without notice in order to improvedesign.This datasheet contains final specifications. FairchildSemiconductor reserves the right to make changes atany time without notice in order to improve design.ObsoleteNot In ProductionThis datasheet contains specifications on a productthat has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.Rev. I15<strong>ML6554</strong> Rev. 1.1.514 www.fairchildsemi.com

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