Tin Electrolytes - Schloetter.de

Matt Tin SAT 20 1Concentrations and operating conditionsRangeMatt Tin SAT 20 1 is a sulphate-free electrolyte forthe deposition of fine crystalline coatings. Thespecial features of this process are a good coveringand less sensitivity towards bleeding of alkali solubleplating resists. A preferred field of applicationfor the use as a metal resist is the PCB manufacturing.Anode solubility in systems based on the AcidConcentrate FF is much higher than in sulphuric acidbased processes, so the electrolyte is to use whenanode passivation occurs in a matt tin sulphateelectrolyte. Matt Tin SAT 20 1 is easy to operate andto maintain. The operation of the electrolyte onlyTin (II) g/l 10 - 30Acid Concentrate FF g/l 120 - 180Tin Additive SAT 22/26 ml/l 8 - 12Tin Additive SAT 23 1 ml/l 15 - 25Operating temperature °C 15 - 30Cathodic current density A/dm 2 0,5 - 2,0requires maintenance of the Sn(II) and sulphuricacid concentration and replenishment of additivescaused by drag-out losses. The electrolyte can beoperated with methanol free additives. The additivesare NPEO-free.Dr. - Ing. Max Schlötter GmbH & Co. KGTalgraben 3073312 Geislingen/SteigeGermanyT + 49 (0) 7331 205 - 0F + 49 (0) 7331 205 - 123info@schloetter.comwww.schloetter.comTin Electrolytesbright tin processesBrilliant prospects for your products!matt tin processeselectroless tin processesMatt Tin SAT 30 1Concentrations and operating conditionsRangeMatt Tin SAT 30 1 is a sulphuric acid based electrolytefor the deposition of fine crystalline deposits. Thisprocess offers an extraordinary covering power andexcellent solderability. Fields of application for thisprocess is the plating of electronic and electrotechnicalparts. In the PCB industry, Matt Tin SAT 30 1 isused also for the deposition of metal resist layers. Theadditive system is used in both barrel- and rackapplications. Without limitations, the deposits giveexcellent solderability even after heat ageing at155 °C / 16 hours. The formation of tetravalent tincompounds is retarded which results in reduction ofcloudiness in the electrolyte. Matt Tin SAT 30 1 is easyto operate and to maintain. The operation of theTin (II) g/l 10 - 30Sulphuric acid g/l 140 - 200Tin Additive SAT 31 1 ml/l 10 - 25Tin Additive SAT 32/26 ml/l 10 - 25Operating temperature °C 15 - 30Cathodic current density A/dm 2 0,5 - 2,0electrolyte only requires maintenance of the Sn(II)and sulphuric acid concentration and replenishmentof additives caused by drag-out losses. The electrolytecan be operated with methanol-free additives. Theadditives are NPEO-free.DIN EN ISO 9001:2008DIN EN ISO 14001:200406/2014www.schloetter.com

Bright Tin SLOTOTIN 70Bright Tin SLOTOTIN 70 is a sulphuric acid basedelectrolyte for the deposition of very bright tin layers.Even in very low current densities e.g. parts with acomplex surface geometry light zinc layers are stilldeposited. The solderability of the tin coatings depositedfrom Bright Tin SLOTOTIN 70 is excellent andremains excellent even after heat ageing tests(e.g. 155 °C / 16 hours). The usual cloud formation ofa sulphuric acid based tin electrolyte by tetravalenttin compounds is retarded in Bright Tin SLOTOTIN 70.A troublesome foaming does therefore not occurwhen operating this electrolyte. This is especiallybeneficial for barrel application since stronglyfoaming wetting agents would have a strong foamingeffect during the barrel lift-out. The additives requiredfor electrolyte make-up and operation meet therequirements of the RoHS Directive (Restriction ofcertain Hazardous Substances) EU Directive 2011/65/EU. The additives are free of alkylphenylethoxylaterespectively nonlyphenylethoxylate (NPEO).Bright Tin GF 20 1Bright Tin GF 20 1 is an organic acid-based fluorideandformaldehyde-free process for the deposition ofbright tin coatings. Solderability of the tin coatings isexcellent, even after accelerated heat ageing at e.g.155 °C for about 16 hours and the deposits aren’tsensitive towards fingerprints. Bright Tin GF 20 1 canbe used for the deposition of bright tin coatings inrack installations and at degreased metal content forbulk articles in barrel plants in the field of electronicandelectrotechnical component production includingthe printed circuit board (PCB) manufacturing.Bright Tin GF 20 1 is especially recommended for theapplication on small electronic components (ceramicchips) which tend to stick together. An especiallydeveloped additive prevents the parts as far as possiblefrom sticking together. The additives are NPEO-free.Glass, ceramic or titanium aren’t being attacked sinceConcentrations and operating conditionsRack BarrelTin (II) g/l 15 - 25 10 - 20Sulphuric acid g/l 160 - 200 60 - 200Starter SLOTOTIN 71 ml/l 15 - 25 15 - 25Operating temperature °C 10 - 30 10 - 30Cathodic current density A/dm 2 1,0 - 2,5 ≥ 0,4Concentrations and operating conditionsRack / BarrelRangeTin (II) g/l 8 - 25Acid Concentrate FF g/l 150 - 250Starter GF 21 1 ml/l 10 - 40Operating temperature °C 15 - 25Cathodic current density A/dm 2 > 0,6 - 3,0the electrolyte doesn’t contain any fluoride. The useof titanium anode hooks is possible for the contactingof anodes if drag-in of fluoride ions or complex fluorideions is prevented. If required the Bright Tin GF 20 1can be operated as a tin-lead electrolyte by addingLead Concentrate FP. This process is applied ifsulphuric acid based electrolytes cannot be used, e.g.if a crossing of tin-lead electrolytes is unavoidabledue to plant-specific reasons.Tin SLOTOTIN MT 1110The Tin SLOTOTIN 1110 is a strongly acidic, fluoride-freeprocess for the deposition of matt to silky-matt, finecrystalline coatings. This process is applied in barrelplants for the coating of chips and small electronic components.Components plated with Tin SLOTOTIN 1110show clearly less tendency to stick together like it’sknown from previously common processes. The depositsfrom Tin SLOTOTIN 1110 give excellent solderability andmelting behaviour in reflow processes even after heatageing (155 °C / 16 hours). The coatings contain a smallamount of bismuth.Tin SLOTOTIN MT 1080 is a sulphuric acid-basedelectrolyte for the deposition of silky-matt tincoatings. For acidic matt tin electrolytes an unusuallygood covering power combined with an excellentsolderability are the specific features of this process.The applications relate to tin plating of electronic orelectrotechnical components. Additive SLOTOTINMT 1081 is used in the same composition for barrelandrack parts. The solderability of the depositsremains unlimited excellent even after a heat ageingtest of 16 h / 155 °C. Cloud formation caused by theformation of Sn(IV) is retarded.Concentrations and operating conditionsRangeTin (II) g/l 10 - 30Acid Concentrate FF g/l 200 - 300Additive SLOTOTIN MT 1111 ml/l 30 - 60Additive SLOTOTIN MT 1112 ml/l 0,25 - 2,0Operating temperature °C 20 - 40Cathodic current density A/dm 2 > 0,1 - 2,0Concentrations and operating conditionsTin SLOTOTIN MT 1080RangeTin MBF 20Tin MBF 20 is a strongly acidic, fluoride-free processfor the deposition of silky-matt fine crystallinecoatings. It is used for tin plating of wires and tapesin reel-to-reel plating lines. The additives used arelow foaming and so during operation no disturbingfoam formation occurs. The deposits from TinMBF 20 give excellent solderability and meltingbehaviour in reflow processes even after heatageing (e.g. 155 °C / 16 hours).Tin (II) g/l 15 - 30Sulphuric acid g/l 150 - 200Additive SLOTOTIN MT 1081 ml/l 10 - 30Operating temperature °C 15 - 30Cathodic current density A/dm 2 > 0,5 - 2,0Concentrations and operating conditionsRangeTin (II) g/l 30 - 120 AcidAcid Concentrate FF g/l 70 - 135Additive SLOTOTIN MBF 16 1 ml/l 10 - 30Operating temperature °C 35 - 60Cathodic current density A/dm 2 10 - 80Matt Tin SLOTOTIN 40The Matt Tin SLOTOTIN 40 is a strongly acidic, fluoride-freeprocess for the deposition of silky-matt finecrystalline coatings. This process is mainly applied inreel-to-reel plants. With reduced tin concentration itcan also be used for rack- and barrel applications.Tin is deposited in a grain size of 3 - 8 μm and tendsto less formation of whiskers in comparison to brighttin layers (grain size < 1 μm). The deposited tin layerscontain only low quantities of co-deposited organiccompounds. Measured as carbon, the values areapprox. 0.005 % by weight. The additives don’tdecompose during deposition. Therefore, the carbonco-deposition rate remains low even after longeroperating period. Solderability of the tin coatingsBright Tin GBF 30Bright Tin GBF 30 is for the use in high speedreel-to-reel installations. The fluoride-free acidicelectrolyte deposits bright tin coatings. Dependingon plant conditions and operating temperaturecathodic current densities up to 30 A/dm² can beachieved. Solderability is still excellent even aftertempering (aging test). The additives used arelow foaming. This results, even during intensiveelectrolyte agitation to no foam formation.Immersion Tin SN 30 1Immersion Tin SN 30 1 is a process for the electrolessdeposition of tin on copper and copper alloysvia charge exchange. Deposition is also possible onlead surfaces. Therefore, this process can also beused to brighten lead- or tin-lead coatings. Smoothbright tin layers approx. 1 - 2 μm thick are depositedon copper surfaces at a temperature of 70 °C,still enabling solderability after tempering (e.g. 4hours at 155 °C). Immersion Tin SN 30 1 can beregenerated. The copper which accumulates overtime can be separated from the electrolyte. Componentsrequired for deposition may be replenishedaccording to analysis. As usual with conventionalimmersion tin electrolytes, disposal of the tinConcentrations and operating conditionsRangeTin (II) g/l 30 - 120Acid Concentrate FF g/l 70 - 200Additive SLOTOTIN MBF 41 1 ml/l 30 - 70Operating temperature °C 35 - 60Cathodic current density A/dm 2 10 - 80deposited from Matt Tin SLOTOTIN 40 is still excellentafter heat ageing at (155 °C / 16 hours) and can befused. The process has been developed as a lead-freealternative for all types of components. The coating iscompatible with all lead-free tin-based solder-alloys.Concentrations and operating conditionsRangeTin (II) g/l 30 - 120Make-up Concentrate GBF 33 g/l 100 - 200Additive SLOTOTIN MBF 16 1 ml/l 10 - 30Operating temperature °C 35 - 60Cathodic current density A/dm 2 10 - 80Concentrations and operating conditionsRangeTin (II) g/l 15 - 25Make-up Concentrate SN 31 ml/l 100 - 120Activation Salt SN 33 g/l 80 - 120Additive CULMO AN 11 1 ml/l 5 - 15Operating temperature °C 20 - 80Exposition time: depends on the required thicknessof layer, max. up to approx. 2 µm are possible.plating solution is not required. The layers depositedfrom this electrolyte meet the requirements of theRoHS Directive (Restriction of certain HazardousSubstances) EU Directive 2011/65/EU. The additivesare NPEO-free.