Tutorial 11, Final Review - ECSE 425 â Computer Organization and ...

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Trends in IC cost●●●●ICs are produced on silicon wafersMultiple dies are produced per waferCosts are split between:●●Fixed expenses: masksRecurring expenses: materials, manufacturing,testing, packaging, lossesWafers contain defects, <strong>and</strong> manufacturing canproduce defective parts●Yield: proportion of good dies on a wafer
Trends in IC cost●Four equations to determine the final cost of anintegrated circuit●●●●Dies per waferDie yieldDie costIC cost
Page 1 and 2: Tutorial 11Final Exam Review
Page 3: Trends in technology●●●Bandwi
Page 7 and 8: Locality●A processor spends most
Page 9 and 10: Pipelining●●●Split an instruc
Page 11 and 12: Pipeline hazards●●●Structural
Page 14 and 15: Multicycle operations●The FP pipe
Page 16 and 17: Instruction-level parallelism●●
Page 18 and 19: Loop unrolling●●●●We want t
Page 20 and 21: Dynamic scheduling●Hardware rearr
Page 22 and 23: Tomasulo's algorithm
Page 24 and 25: Speculative Tomasulo(C) 2003 Elsevi
Page 26 and 27: Memory hierarchy●●●●●Memo
Page 28 and 29: Caches●●●●●Block placemen
Page 30 and 31: Caches●●●●Miss rateMulti-le
Page 32 and 33: Cache coherence protocols●●●
Page 34 and 35: Virtual memory●●●●Each prog
Page 36: Final exam● December 9 th at 9am

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Tutorial 11, Final Review - ECSE 425 â Computer Organization and ...