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8<br />
1. Cut-off Wheels for Precision Cutters<br />
Precision saws are commonly used in metallographic preparation to<br />
section materials that are small, delicate, friable, extremely hard, where<br />
the cut must be made as close as possible to a feature of interest, or<br />
where the cut width and material loss must be minimal. Blades for the<br />
precision saws are much thinner than the abrasive wheels and the load<br />
applied during cutting is much less.<br />
1.1. Abrasive Cut-off Wheels with Ø12.7 mm arbor<br />
IsoMet 2000, IsoMet 4000 and 5000 etc.<br />
AcuThin Blades, extra thin<br />
127x0.48x12.7mm R/Al2O3 > HRC45 10-4060-010 10 98.00<br />
127x0.48x12.7mm R/Al2O3 < HRC45 10-4061-010 10 98.00<br />
Abrasive cut-off wheels<br />
178x0.76x12.7mm R/Al2O3 Steel, etc. 11-4207-010 10 116.00<br />
178x0.76x12.7mm R/SiC Non Ferrous materials 11-4217-010 10 116.00<br />
Abrasive cut-off wheels, for soft materials, fine-grained<br />
150x0.50x12.7mm Alumina fine grained 101520 10 75.00<br />
200x0.50x12.7mm Alumina fine grained 102020 10 99.00<br />
Abrasive cut-off wheels, for tough materials and general use, coarse-grained<br />
150x1.0x12.7mm Alumina coarse grained 1015998E 10 98.00<br />
200x1.5x12.7mm Alumina coarse grained 1020998E 10 164.00<br />
1.2. Diamond Wafering Blades with Ø 12.7 mm arbor<br />
For all Precision Saws of the IsoMet-Series etc.<br />
Standard Quality Wafering Blades for general use<br />
60x0.20x12.7mm Diamond metal bonded 100650 1 162.00<br />
75x0.20x12.7mm Diamond metal bonded 100750 1 187.00<br />
100x0.35x12.7mm Diamond metal bonded 101050 1 195.00<br />
125x0.40x12.7mm Diamond metal bonded 101250 1 245.00<br />
150x0.60x12.7mm Diamond metal bonded 101555 1 276.00<br />
Standard Quality Wafering Blades for hard metals, tungsten carbide, glass and ceramics<br />
100x0.60x12.7mm Diamond resin bonded 101056 1 229.00<br />
125x0.80x12.7mm Diamond resin bonded 101256 1 259.00<br />
150x0.80x12.7mm Diamond resin bonded 101556 1 298.00<br />
200x0.80x12.7mm Diamond resin bonded 102056 1 349.00<br />
High Quality Wafering Blades for aggressive general sectioning of ferrous and non-ferrous materials<br />
127x0.40x12.7mm Series 20 HC metal bonded 11-4215 1 341.00<br />
178x0.60x12.7mm Series 20 HC metal bonded 11-4237 1 527.00<br />
203x0.90x12.7mm Series 20 HC metal bonded 11-4238 1 621.00<br />
Buehler IsoMet Diamond Wafering Blades<br />
This proprietary high-tech family of blades was developed specifically to provide precise and<br />
accurate sectioning of metallographic samples. These blades utilize specially formulated<br />
grit-sized diamond particles to give accurate cuts without the mess or inconvenience<br />
of thicker conventional abrasive cut-off wheels.<br />
These blades have diamond particles bonded in a resin or metal matrix along the outside<br />
diameter of the blade. The proprietary formulation of bonded diamond particles<br />
is designed to allow the bonding to break down efficiently to ensure the most<br />
effective cutting. The thin blades (< 1 mm thick) make IsoMet blades ideal<br />
for sectioning small specimens.<br />
There is a wide selection of IsoMet blades to meet your specific needs.<br />
You can choose from different blades including different diameters,<br />
and high or low diamond concentration. This wide selection ensures you<br />
the right blade for fast, efficient sectioning of the most difficult materials.<br />
For fast cutting of ferrous and tough materials see our IsoCut Wafering Blades.<br />
IsoMet<br />
IsoMet 1000
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