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8 1. Cut-off Wheels for Precision Cutters Precision saws are commonly used in metallographic preparation to section materials that are small, delicate, friable, extremely hard, where the cut must be made as close as possible to a feature of interest, or where the cut width and material loss must be minimal. Blades for the precision saws are much thinner than the abrasive wheels and the load applied during cutting is much less. 1.1. Abrasive Cut-off Wheels with Ø12.7 mm arbor IsoMet 2000, IsoMet 4000 and 5000 etc. AcuThin Blades, extra thin 127x0.48x12.7mm R/Al2O3 > HRC45 10-4060-010 10 98.00 127x0.48x12.7mm R/Al2O3 < HRC45 10-4061-010 10 98.00 Abrasive cut-off wheels 178x0.76x12.7mm R/Al2O3 Steel, etc. 11-4207-010 10 116.00 178x0.76x12.7mm R/SiC Non Ferrous materials 11-4217-010 10 116.00 Abrasive cut-off wheels, for soft materials, fine-grained 150x0.50x12.7mm Alumina fine grained 101520 10 75.00 200x0.50x12.7mm Alumina fine grained 102020 10 99.00 Abrasive cut-off wheels, for tough materials and general use, coarse-grained 150x1.0x12.7mm Alumina coarse grained 1015998E 10 98.00 200x1.5x12.7mm Alumina coarse grained 1020998E 10 164.00 1.2. Diamond Wafering Blades with Ø 12.7 mm arbor For all Precision Saws of the IsoMet-Series etc. Standard Quality Wafering Blades for general use 60x0.20x12.7mm Diamond metal bonded 100650 1 162.00 75x0.20x12.7mm Diamond metal bonded 100750 1 187.00 100x0.35x12.7mm Diamond metal bonded 101050 1 195.00 125x0.40x12.7mm Diamond metal bonded 101250 1 245.00 150x0.60x12.7mm Diamond metal bonded 101555 1 276.00 Standard Quality Wafering Blades for hard metals, tungsten carbide, glass and ceramics 100x0.60x12.7mm Diamond resin bonded 101056 1 229.00 125x0.80x12.7mm Diamond resin bonded 101256 1 259.00 150x0.80x12.7mm Diamond resin bonded 101556 1 298.00 200x0.80x12.7mm Diamond resin bonded 102056 1 349.00 High Quality Wafering Blades for aggressive general sectioning of ferrous and non-ferrous materials 127x0.40x12.7mm Series 20 HC metal bonded 11-4215 1 341.00 178x0.60x12.7mm Series 20 HC metal bonded 11-4237 1 527.00 203x0.90x12.7mm Series 20 HC metal bonded 11-4238 1 621.00 Buehler IsoMet Diamond Wafering Blades This proprietary high-tech family of blades was developed specifically to provide precise and accurate sectioning of metallographic samples. These blades utilize specially formulated grit-sized diamond particles to give accurate cuts without the mess or inconvenience of thicker conventional abrasive cut-off wheels. These blades have diamond particles bonded in a resin or metal matrix along the outside diameter of the blade. The proprietary formulation of bonded diamond particles is designed to allow the bonding to break down efficiently to ensure the most effective cutting. The thin blades (< 1 mm thick) make IsoMet blades ideal for sectioning small specimens. There is a wide selection of IsoMet blades to meet your specific needs. You can choose from different blades including different diameters, and high or low diamond concentration. This wide selection ensures you the right blade for fast, efficient sectioning of the most difficult materials. For fast cutting of ferrous and tough materials see our IsoCut Wafering Blades. IsoMet IsoMet 1000
1.2. Buehler Diamond Wafering Blades with Ø 12.7 mm arbor (continued) For all Precision Saws of the IsoMet-Series etc. High Quality Wafering Blades for routine use, metal matrix composites, PC boards, bone, titanium, thermal spray coatings 76x0.20x12.7mm Series 15 HC metal bonded 11-10066 1 248.00 102x0.30x12.7mm Series 15 HC metal bonded 11-4244 1 311.00 127x0.40x12.7mm Series 15 HC metal bonded 11-4245 1 340.00 152x0.50x12.7mm Series 15 HC metal bonded 11-4246 1 456.00 178x0.60x12.7mm Series 15 HC metal bonded 11-4247 1 573.00 203x0.90x12.7mm Series 15 HC metal bonded 11-4248 1 609.00 High Quality Wafering Blades for use with hard and brittle materials, structural ceramics, glass, electronic substrates, alumina, zirconia, concrete 76x0.20x12.7mm Series 15 LC metal bonded 11-10067 1 243.00 102x0.30x12.7mm Series 15 LC metal bonded 11-4254 1 304.00 127x0.40x12.7mm Series 15 LC metal bonded 11-4255 1 332.00 152x0.50x12.7mm Series 15 LC metal bonded 11-4276 1 449.00 178x0.60x12.7mm Series 15 LC metal bonded 11-4277 1 565.00 203x0.90x12.7mm Series 15 LC metal bonded 11-4279 1 594.00 High Quality Wafering Blades for use with medium to soft ceramics, electronic components, electronic packages, GaAs, AIN, glass fibre reinforced composites 76x0.20x12.7mm Series 10 LC metal bonded 11-10068 1 230.00 127x0.40x12.7mm Series 10 LC metal bonded 11-4285 1 332.00 178x0.50x12.7mm Series 10 LC metal bonded 11-4287 1 516.00 203x0.60x12.7mm Series 10 LC metal bonded 11-4288 1 594.00 High Quality Wafering Blades for use with hard tough materials, structural ceramics, boron nitride, silicon nitride 127x0.50x12.7mm Series 20 LC metal bonded 11-4225 1 341.00 178x0.60x12.7mm Series 20 LC metal bonded 11-4227 1 587.00 203x0.90x12.7mm Series 20 LC metal bonded 11-4228 1 609.00 High Quality Wafering Blades for use with soft friable ceramics, composites with fine reinforcing media, etc 76x0.20x12.7mm Series 5 LC metal bonded 11-10069 1 308.00 127x0.40x12.7mm Series 5 LC metal bonded 11-4295 1 321.00 High Quality Wafering Blades for use with polymers, rubber and other soft gummy materials 127x0.80x12.7mm Series 30 HC metal bonded 11-4239 1 370.00 178x0.80x12.7mm Series 30 HC metal bonded 11-4241 1 428.00 203x0.90x12.7mm Series 30 HC metal bonded 11-4242 1 614.00 1.3. IsoCut CBN-Wafering Blades with Ø 12.7 mm arbor For all Precision Saws of the IsoMet-Series etc. The IsoCut family of wafering blades was specifically developed to section ferrous materials, nickel, cobalt, leadbased alloys and super alloys. These thin blades (
Page 3 and 4: Buehler Headquarters for Europe and
Page 5: INTERNATIONAL Algeria Test S.A., Cr
Page 10 and 11: 10 Cut-off Wheels for Abrasive Cutt
Page 12 and 13: 12 2.1. 2. Abrasive Cut-off Wheels
Page 14 and 15: 14 2.3. Delta Orbital Cut-off Wheel
Page 16 and 17: 16 2.6. Sectioning Accessories Cutt
Page 18 and 19: 18 3.1. Compression Mounting Compou
Page 20 and 21: 20 4.1. Acrylics (continued) SamplK
Page 22 and 23: 22 4.3. Castable (Cold) Mounting Mo
Page 24 and 25: 24 24 MagnoSys Magnetic System Magn
Page 26 and 27: 26 5.8. ApexCGD CoarseGrindingDiscs
Page 28 and 29: 28 5.11 ApexDGD Color DiamondGrindi
Page 30 and 31: 30 6.4. Silicon Carbide Abrasive Pa
Page 32 and 33: 32 6.4.4. BuehlerMet Silicon Carbid
Page 34 and 35: 34 6.4.9. CarbiMet 2 SiC Abrasive P
Page 36 and 37: 36 6.6. Abrasive Powders Silicon ca
Page 38 and 39: 38 7.3. MetaDi Diamond Suspension,
Page 40 and 41: 40 8. Final Polishing Powders and S
Page 42 and 43: 42 Polishing Cloths Buehler offers
Page 44 and 45: 44 9.4. Polishing Cloths Ø 350 mm
Page 46 and 47: 46 12. Fibre optics and Microelectr
Page 48 and 49: 48 13. Various Aids and Laboratory
Page 50 and 51: Notes
Page 52 and 53: Notes
Page 54: 54 54

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