Microwave Engineering Europe July-August 2012 - EE Times Europe

July/August 2012europeanbusiness pressengineering europeCAD/EDA/EM-SoftwareMicrowave Componentswww.microwave-eetimes.comThe European journal for the microwave and wireless design engineer

We’ve Pushed TheTechnology Envelope.Our New Hybrid Power Modules Now Provide High OutputPower Levels Across An Instantaneous BW From 4-18 GHz.AR’s new line of Hybrid Power Modules (HPM’s) are small, compact and lightweight, but they’re big on power and performance.Our standard products deliver up to 5 watts of output power with excellent linearity, gain flatness and the ability to withstand infinite output mismatches.Ultra Wide Bandwidth and High Power – A Great CombinationOur rugged modular products utilize the latest microelectronic technologies to achieve outstanding performance and small size fordemanding applications. Thin film processes using chip and wire devices are used for the higher frequency4-18 GHz frequency bands, whereas thick film lower cost custom design approaches using chip orpackaged transistors can be used in the lower frequency regions.Regardless of the techniques used, we can supply our HPM’s in true hermetic housings to meetboth fine and gross leak testing to military specifications.AR Has The Capabilities To Produce Cost-Effective, Custom-Designed HPM’s To Your SpecsBoth military and commercial solutions can be provided to meet your specific need for high performancein a compact size. Connectorized or pallet type custom designs, which can be integrated into higher order assemblies, can also be provided, giving youalternate solutions for even your most demanding applications. These modular amplifiers can also be supplied as a complete self contained air cooledassembly including power supplies, a digital control panel, gain control and input overdrive protection.Applications For Our HPM’s Are Limited Only By Your Imagination but a small sampling are:Jammers, Radars, ECM, ECCM, Data links, TWTA replacements and drivers, and Communications.www.ar-europe.ie/contact.phpISO 9001:2008Certifiedar europeNational Technology Park, Ashling Building, Limerick, Ireland • 353-61-504300 • www.ar-europe.ieIn Europe, call ar United Kingdom 441-908-282766 • ar France 33-1-47-91-75-30 • emv GmbH 89-614-1710 • ar Benelux 31-172-423-000Copyright © 2012 AR. The orange stripe on AR products is Reg. U.S. Pat. & TM. Off.

News 3in briefEutelsat acquires GE-23 toexpand in Asia-PacificEutelsat Communications hasannounced it has concludednegotiations to acquire the GE-23satellite, associated customercontracts and orbital rights fromGE Capital for US$228 million. Thetransaction is expected to close in thesecond half of 2012 (calendar), subjectto regulatory approvals.Built by Thales Alenia Space, GE-23was launched in December 2005 andhas an expected useful life of 15 years.From its location in geostationaryorbit at 172 degree(s) E, the satelliteoffers unique coverage over theAsia-Pacific region via a payload of20 Ku-band transponders accessingfive interconnecting beams and 18C-band transponders connected toa trans-Pacific beam. Leveraging itscomprehensive coverage and highbandwidthcapability, GE-23 offers abroad range of telecom services to adiverse base of blue chip customers.www.eutelsat.comLTE handover between TDand FDD demonstratedAltair Semiconductor has announcedthat its FourGee-3100/6200 chipsetsuccessfully completed TD/FDD LTElive handover testing with Rohde &Schwarz. The test, which employedAltair’s FourGee chipset in an enduserdevice, successfully enabledseamless communication betweendifferent LTE modes, achieving anuninterrupted and continuous datasession with low handover latency froma 20 MHz TD-LTE channel and a 10MHz FDD channel and back.Altair claims to be the first chipsetmanufacturer to achieve live TD/FDDLTE handover in commercially availabledevices. By allowing the two LTE duplexmodes to operate interchangeably onthe same device, as well as enablingglobal LTE roaming, this achievementhas significant market implications.www.altair-semi.comwww.rohde-schwarz.comMindspeed adds support for smart DAS intosmall cellsMindspeed Technologies has integrated supportfor smart Distributed Antenna Systems (DAS)technology into its range of System-on-Chip(SoCs) for small cell products. With this capability,the company can support ‘hybrid’ systems,with small cell base stations feeding DAS equipment,extending the opportunities for small cellsand bringing new value to companies currentlydeveloping DAS products.Until now, chips for small cells have beenunable to support DAS but Mindspeed’s PC333and PC3032 products have added specific supportto deal with the delay characteristics of thelong coaxial networks and the specific antennatechnology associated with DAS. The PC333 andPC3032 are expressly designed for high-performancepublic access small cells that serve urbanhot spots, city centers and dense in-building systems.They are the only small cell SoCs that support3GPP Local Area Base Station (LABS) performanceand soft handover (SHO) standards.Traditional DAS solutions channel radiofrequencies and provide excellent coverage forlarge buildings, underground tunnels, shoppingmalls and areas difficult to penetrate using outdoormacro cells. Today the biggest challengefacing operators is enabling excellent coveragewhile maintaining the capacity to support everincreasingamounts of data. This is where smallcells can provide a solution.www.mindspeed.comBroadband VNA system for on-wafercharacterization covers 70 kHz to 140 GHzAnritsu Company has demonstrated the onlybroadband Vector Network Analyzer (VNA) systemthat can conduct single sweeps from 70 kHzto 140 GHz at the International Microwave Symposium(IMS), in Montreal.A number of higher frequency bands are gainingpopularity, including 40-60 GHz for datatransmission wireless backhaul between basestations, 60 GHz for Wireless LAN transmissionin home and public locations, 77 GHz automotivecollision avoidance systems, and 94 GHz forairport radar applications, materials measurement,and homeland security imaging systems.The demonstration showcased the company’slatest technology, including a 0.8 mm connector,the excellent stability and RF performanceof the VectorStar vector network analyzer andmm-wave modules. The system conduced a singlesweep across multiple coax and waveguide bands,eliminating the need to use separate systems.www.anritsu.comADS system simulation model helpsdevelopment of Envelope Tracking systemsThe OpenET Alliance, the industry associationthat promotes energy efficient wireless transmissionthrough Envelope Tracking (ET), hastoday announced the availability of a new HighDynamic Range system simulation model forhandset Envelope Tracking applications.The ET System Simulation model, jointly developedby OpenET members Nujira and the Universityof Firenze, aids system optimization bymaking it easier for designers to identify sourcesof noise and distortion and to make the necessarydesign tradeoffs. The System Simulation model,which has been developed using Agilent’s AdvancedDesign System (ADS), provides a frameworkto model a complete handset ET system,and incorporates a High Dynamic Range (HDR)RF Power Amplifier model developed by Nujira.The model is suitable for use by chipset designers,PA vendors, filter manufacturers andhandset OEMs, and is being released to membersof the OpenET Alliance for download from:www.open-et.orgMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

4 NEWSin briefT-Mobile deploying LTERelease 10 networkIn an effort to leapfrog AT&T and Verizon,T-Mobile is deploying base stations forwhat it hopes will be the first cellularnetwork to support Release 10, the nextgeneration of LTE. The carrier hopes togo live with the network in 2013 as anadjunct to its existing HSPA+ service.Release 10 supports carrieraggregation, the ability to use separatespectrum bands in a single service. Italso supports up to 40 MHz channelsand up to 8x8 MIMO antennas.Carrier aggregation is seen as akey for a cellular industry starved forspectrum, particularly for T-Mobilewhich operates out of non-adjacentbands. T-Mobile is expected to spendabout $4 billion over the next yearputting in its LTE Release 10 networkrunning over its AWS bands.www.t-mobile.comLTE patent pool to includeover 20-membersVia Licensing will roll out in the next fewmonths a patent pool for 4G LTE cellulartechnology with more than 20 membersincluding AT&T. The effort comes as twoother LTE licensing efforts are said tohave fizzled.A growing number of patents, patentholders and law suits is threateningthe health of the mobile industry, saidpanelists debating the issue at theNGMN Alliance conference. Experts aremixed about how much the new poolwill help. Even proponents of the poolsaid the industry also needs to definereasonable licensing terms, especiallyfor patents essential to standards.The group is now in final reviewof flat-rate licensing terms it will offer.Exactly who are members of the pooland what patents they have remainsconfidential.As many as 3,000 LTE patents havebeen identified to date, about twicethe number as exist for 3G, said LuigiLicciardi, head of technology planningfor telecom Italia.www.vialicensing.comCarrier Wi-Fi equipment market to grow to$2.2 Billion by 2017​Global revenue for carrier Wi-Fi access pointsand controllers will reach $2.2 billion in 2017to reach a level equivalent to almost one-halfof the traditional enterprise or consumer/SoHoWi-Fi segments in the same period, according toABI Research. The majority of the total marketin 2011 was accounted for by Cisco, RuckusWireless, and Ericsson/BelAir, and as traditionalmobile infrastructure vendors add Wi-Fi to theirportfolios, these early market share rankings willfluctuate. Carrier Wi-Fi is defined as Wi-Fi that isprovided as a service to mobile carrier customers,owned and operated directly or indirectly bythe carrier, e.g., a third party hotspot provider.Nick Marshall, principal analyst, mobile networks,comments, “While carrier Wi-Fi is stillin relative infancy today, the drive by mobileoperators to offload data traffic is providing asignificant boost to this segment of the market.”The rollout of carrier Wi-Fi has been hamperedup until now by the lack of standardswhich make the process seamless and transparentfor the subscriber. “We believe that withstandardization initiatives well under way, likeHotspot 2.0 and the almost universal inclusionof Wi-Fi in every smartphone, PC, and tabletbeing built today, carrier controlled Wi-Fi is expectedto see wide-scale adoption, especially inmarkets like North America, Japan, and SouthKorea,” continues Marshall.www.abiresearch.comGaN goes mainstream as costs dropRecognized as a compelling alternative to siliconfor many RF applications, GaN (galliumnitride) technology has generated significantindustry interest due to its performance advantages,but has faced significant challengesrelated to cost — until now.At the IEEE MTT-S International MicrowaveSymposium in Montreal, NXP Semiconductorsdemonstrated its full portfolio of first-generationGaN products, and discussed its vision androadmap related to GaN. Core to that vision isthe concept of “mainstream GaN” — bringingeconomies of scale and over 30 years of experiencein RF power transistors to enable innovationand a secure, reliable supply chain for RFGaN products.NXP currently offers samples of its first-generationGaN products, including the CLF1G0035-50 and CLF1G0035-100 amplifiers for 50 W and100 W broadband applications. At IMS2012,the company demonstrated live application examples,including a multi-stage GaN line-up coveringa 200 to 2700 MHz frequency band. Usingthe CLF1G0060-10 driver, and the CLF1G0035-50 amplifier for the output stage, the GaN line-upfeatures 50 V GaN technology and best-in-classlinearity. Due to the higher impedance levels ofthe 50 V GaN process, broadband amplifiers canbe designed on a single transistor.Based on a 0.5 µm gate-length technology developedin collaboration with the Fraunhofer IAFInstitute in Freiburg, as well as United MonolithicSemiconductors (UMS) in Ulm, Germany,NXP’s first-generation GaN amplifiers deliverhigh linearity without compromise in power,ruggedness and efficiency, significantly reducingcomponent count and amplifier footprint. Thiscollaboration with UMS and Fraunhofer IAFInstitute also establishes a Europe-based supplychain for GaN technology.At IMS2012, NXP also showcased advancedapplications using GaN, including a live ClassE amplifier tuned for 2.45-GHz, showing thebreakthrough efficiency enabled by GaN. Featuringa transistor with internal Class E harmonicmatching, the amplifier achieves best-in-classefficiency of 75.2% at 24 W at 2.45 GHz. Basedon a 0.25 µm gate-length technology currentlyunder development, the company plans to makeits high-efficiency Class E narrow-band GaN solutionsavailable in 2013.NXP is also developing a digital power amplifierusing GaN switching transistors that offerhigher efficiency than linear amplifiers. Theseswitched-mode power amplifiers (SMPAs) canbe used in multiple bands without any modificationto the hardware, and will be a key driver ofthe “ultimate” base station of the future. Likethe company’s other GaN processes, the 0.25 µmGHSM process uses SiC substrates for better reliability,superior RF performance, and enhancedthermal management.www.nxp.comMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

RFMD.MMIC VCO SeriesThe RFMD ® RFVC18xx series is a family of voltage-controlled oscillators (VCOs) based on GaAs InGaPMMIC technology. The monolithic structure of the VCO ensures excellent temperature, shock, andvibration performance. With both broadband and narrowband options available, VCOs in this seriesare capable of operation ranging from 7GHz through 15GHz. Typical applications include point-topointradio, military, satellite communications, test instrumentation, industrial and medical, aerospace,and CATV. All products in the family operate from a single positive supply voltage and deliver lowphase noise performance with minimum power consumption. Each VCO comes in a compact, RoHScompliantQFN package.NARROWBAND MMIC VCOS WITH INTEGRATED FO/2, FO/4 DIVIDERPhase NoiseFreq Range(Min) (MHz)Freq Range(Max) (MHz)V TUNE(V)(dBc/Hzat 10kHz)Phase Noise(dBc/Hzat 100kHz)V CC(V)P OUT(dBm)PartNumber7300 8200 1.5 to 14.5 -91 -115 5.0 10.0 RFVC18317800 8800 1.5 to 14.5 -90 -115 5.0 9.0 RFVC18328400 9600 1.5 to 14.5 -90 -114 5.0 8.0 RFVC18339000 10200 1.5 to 14.5 -90 -114 5.0 9.0 RFVC18349600 10800 1.5 to 14.5 -88 -114 5.0 8.0 RFVC183510400 11600 1.5 to 14.5 -89 -113 5.0 8.0 RFVC183611100 12500 1.5 to 14.5 -88 -113 5.0 8.0 RFVC183711400 12800 1.5 to 14.5 -87 -113 5.0 8.0 RFVC183812400 13900 1.5 to 14.5 -87 -112 5.0 8.0 RFVC183913600 14900 1.5 to 14.5 -84 -110 5.0 7.0 RFVC18409300 10700 1.5 to 14.5 -90 -115 5.0 8.0 RFVC18429800 11300 1.5 to 14.5 -90 -114 5.0 7.0 RFVC184310500 12100 1.5 to 14.5 -88 -113 5.0 7.0 RFVC1844BROADBAND MMIC VCOS WITH INTEGRATED RF OUTPUT BUFFERPhase NoiseFreq Range(Min) (MHz)Freq Range(Max) (MHz)V TUNE(V)(dBc/Hzat 10kHz)Phase Noise(dBc/Hzat 100kHz)V CC(V)I D(mA)P OUT(dBm)PartNumber8000 12000 0.0 to 13.0 -66 -93 5.0 55 4.0 RFVC18005000 10000 0.0 to 18.0 -72 -96 5.0 52 3.0 RFVC18014000 8000 0.0 to 18.0 -74 -99 5.0 53 4.0 RFVC18026000 9000 0.0 to 15.0 -73 -97 5.0 53 3.5 RFVC1803NARROWBAND MMIC VCOS WITH INTEGRATED RF OUTPUT BUFFERPhase NoiseFreq Range(Min) (MHz)Freq Range(Max) (MHz)V TUNE(V)(dBc/Hzat 10kHz)Phase Noise(dBc/Hzat 100kHz)V CC(V)I D(mA)P OUT(dBm)PartNumber4450 5200 1.5 to 14.5 -84 -108 3.0 43 8.0 RFVC18215000 5500 0.0 to 12.0 -80 -103 3.0 45 9.0 RFVC18226100 6750 0.0 to 10.0 -76 -101 3.0 37 8.0 RFVC18237200 8300 1.5 to 14.0 -80 -106 3.0 65 12.0 RFVC18247800 8700 0.0 to 12.0 -80 -107 3.0 67 11.0 RFVC18256800 7400 0.0 to 12.0 -80 -103 3.0 70 12.0 RFVC1829RFMD ® is a trademark of RFMD, LLC. ©2012 RFMD.

6 NEWSin briefSamsung acquires WLANdeveloper, NanoradioSamsung Electronics Co. Ltd., hasacquired Nanoradio AB, a developer ofultra low power wireless LAN chipsetsfor high-speed wireless access inmobile phones.Headquartered in Kista, Sweden,Nanoradio is a “fabless” companywith approximately 60 employees andextensive experience in the wirelessindustry. In particular, Nanoradiospecializes in developing small formfactor high performance Wi-Fi chipsetswith low power consumption forcellular platforms.Nanoradio’s Wi-Fi chips target arange of applications, including mobilephones, wireless network camerasfor home surveillance, portable mediaplayers and gaming devices. Anotherbig area for Nanoradio is the growingfixed-mobile convergence market withdual-mode phones.www.nanoradio.comwww.samsung.comO2 launches UK M2MnetworkTelefonica UK is working with JasperWireless to deploy an automatedplatform for the managementof machine-to-machine (M2M)connections on the O2 cellular network.The cloud-based managementplatform will enable Telefonica UKcustomers to roll out connecteddevices quickly and efficiently,manage them in real time and deliverglobal support. Jasper Wireless’Control Centre is a software-as-aservice(SaaS) platform that providescustomers with global visibility ofall SIMs connected to the mobilenetwork. It allows customers toquickly distribute connected deviceswith robust self-service tools forprovisioning, real-time diagnostics andusage controls. It provides powerfulintelligence with a live view of howdevices are connecting to and usingthe mobile network.http://o2.m2m.comData growth to make small cells anindispensable part of LTE rolloutsMobile networks are exploding with many usersstreaming video simultaneously, putting a hugestrain on 4G/LTE, and small cells will createsolutions for vendors in the market, accordingto the latest report from Heavy Reading 4G/LTEInsider, a paid research service of Heavy Reading.The report, ‘The New 4G/LTE Radio: SmallCells & New Architectures’ examines the smallcell market, focusing on how small cells and newnetwork architectures will affect 4G/LTE offerings.It analyzes the mobile landscape, exploresdrivers and threats in the market, and evaluatesnew solutions available.“Sooner or later mobile networks are doomedto buckle under the load of billions of mobilebroadband users all streaming video at the sametime,” notes Claus Hetting, research analyst withHeavy Reading 4G/LTE Insider and author ofthe report. “One solution is for operators tobuild networks that offer a very high networkcapacity, exceeding 1 Gbit/s per square kilometer,by increasing 4G/LTE base station densitythrough mass deployment of small cells.”Small cells and new architectures are startingto form an indispensable part of the 4G/LTE,says Hetting. “While some constitute the naturalsmall cell extension of carrier-grade radio networkequipment, other vendors are approachingthe small cell market with enterprise and residentialfemtocell-type equipment,” he continues.www.heavyreading.com/researchGPS/GNSS IC market to reach 1.8 billionshipments by 2016GPS/GNSS is moving beyond cellular and traditionalnavigation markets, representing a marketof over $3.3 billion in 2016, according to ABIResearch. GPS/GNSS has always been stronglytied to car navigation, personal navigation devices(PND), and cellular space. However, it isnow finding applications in cameras, gaming, andtablets. Furthermore, femtocells and small cellsrepresent huge volume opportunities, with companieslike u-blox, Fastrax, and iPosi all developingspecific GPS/GNSS solutions for this market.Senior analyst, telematics and navigation,Patrick Connolly says, “Ultimately, GPS/GNSSmanufacturers will need to combine an increasingnumber of technologies, supporting ubiquitousindoor and outdoor location.”ABI Research’s market data, “GPS IC and DevicesForecasts, Global,” provides forecasts ofGPS/GNSS ICs and market shares across ninekey CE devices.www.abiresearch.comThales and Nokia Siemens to offer LTEbroadband for professional mobile radioThales and Nokia Siemens Networks have signeda memorandum of understanding to providebroadband LTE that offers high speed data communicationto professional mobile radio users.This cooperation covers Europe, the Middle Eastand Africa.In the intended agreement, Thales’s full IP distributedarchitecture has been designed to providethe public safety and first responder communitieswith a reliable solution that will improve incidentresponse. The resilience of Thales’s LTE distributedarchitecture allows dispatchers to successfullycommunicate messages between severalinterconnected base stations, towers and first responderseven if one of the base stations or towersare out of service.Nokia Siemens Networks expects to provideits award-winning Single RAN Advanced FlexiMultiradio Base Station to provide LTE access aspart of the broader Thales solution.www.thalesgroup.comMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

July/August 2012europeanbusiness presscontents 7engineering europeCAD/EDA/EM-SoftwareMicrowave Components3 News8 Wireless SoCs cut consumption free designers from proprietarysoftware frameworksThe European journal for the microwave and wireless design engineerThis month’s cover depicts the evolving worldof communications. Wireless is improving ata rapid rate, but the industry requires toolsand test equipment to keep up with the rapidadvances being made. In this issue we look ata VNA that reaches 750 GHz on page 17.EDITOR In ChiefJEAN-PIERRE JOOSTINGTel. +44-7800 548-133email: jean-pierre.joosting@eetimes.beEditorial Advisory BoardTom Brazil, University College Dublin, IrelandMarco Lisi, Telespazio, ItalyHolger Meinel, DaimlerChrysler Aerospace AG, GermanyMarco Guglielmi, ESTEC, The NetherlandsChris Snowden, Filtronic Compound Semiconductor/University of Leeds, UK.advertising ProductionLydia GijsegomTel +32 (0) 2 740 00 50email: lydia.gijsegom@eetimes.beCIRCULATION & FINANCELUC DESIMPELTel +32 (0) 2 740 0055email: luc.desimpel@eetimes.beart managerJean-Paul SpeliersTel +32 (0)2 740 0052email: jean-paul.speliers@eetimes.beACCOUNTINGRICARDO PINTO FERREIRATel +32 (0)2 740 0051email: financial@eetimes.bepublisherandre rousselotTel +32 (0)2 740 0053email: andre.rousselot@eetimes.beEuropean Business Press SA144 Avenue Eugène Plasky1030 Brussels - BelgiumTel: +32 (0)2 740 00 50Fax: +32 (0)2 740 00 59www.microwave-eetimes.comVAT Registration: BE 461.357.437RPM: BrusselsCompany Number: 0461357437© 2012 E.B.P. SA• All rights reserved. No part of this publication maybe reproduced or transmitted in any form or by anymeans, electronic or mechanical, including photocopying,recording or any information storage or retrieval systemwithout the express prior written consent of the publisher.• The contents of Microwave Engineering Europe are subjectto reproduction in information storage and retrieval systems.• Microwave Engineering Europe is published ten times ayear. Apply for a free copy of the journal online atwww.microwave-eetimes.com/subscribe• Subscriptions: Microwave Engineering Europe isavailable on subscription to others at 150 Euro. Refundson cancelled subscriptions will only be provided at thePublisher’s discretion, unless specifically guaranteedwithin the terms of the subscription offer.Paid subscription queries tel: +32 2 740 00 50• Printed by Coreliowww.microwave-eetimes.com9 Comment10 Cover feature: Microwave Components USB DC -18-GHzcoaxial switch...SiO2 coaxial cable keep phase noise flat...PA covers 71-76-GHz...12 CAD/EDA/EM-Software: Altium Designer makes ultra-highperformancedesign move faster at Spectrum IntegritySpectrum Integrity designs ultra-high-speed digital, RF, and microwavePCBs that process signals at frequencies from 20 to 110 GHzand above. Except for two customers using legacy software, thecompany now produces all of its designs using Altium Designer. “Wecan now use a mainstream tool for our ultra high-performance designwork, and customize it so we don’t have restrictions on getting creative,”says Ingham.14 RF and microwave solid-state power amplifiers design requiresspecialised engineeringIn the world of RF and microwave engineering, the design and developmentof solid-state amplifiers is a speciality. It has always requiredmany years of specialised engineering experience and a suitable collectionof test and measurement equipment. While these will alwaysbe necessary, to be successful in the marketplace today, it is alsoessential to use a combination of specialised and general CAD tools.17 VNA covers single sweep NF measurements over 70 kHz to125 GHz, extends coverage to 750 GHz18 Testing TD-LTE with real world test technologiesTD-LTE testing must consider test equipment dynamic range, phaseand amplitude balancing, and bidirectionality in order to modelTD-LTE deployment scenarios including beamforming. To ensureexcellent “real world” test of TD-LTE devices and systems, channelemulators can be chosen that both meet the aforementioned requirementsand which also provide appropriate automation and channelmodels that help bridge the field and the lab and enable effectivereplication of real world conditions in the lab.21 Products26 CalendarMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

8 News - wireless SoCsWireless SoCs cut consumption free designersfrom proprietary software frameworksBy Jean-Pierre JoostingOslo, Norway — Nordic Semiconductorhave launched the nRF51 SeriesULP wireless SoCs, which cut powerconsumption, increase RF performance, and freedesigners from proprietary software frameworksThe first two ICs to debut in the nRF51 Seriesare the nRF51822, a multi-protocol Bluetoothlow energy, 2.4 GHz proprietary RF SoC, and thenRF51422, the first ANT/ANT+ protocol basedSoC. The devices share a high performance,lower power 2.4 GHz multi-protocol radio and a32-bit ARM Cortex-M0 based processor. Theseenhancements deliver up to 50% lower powerconsumption, RF link budget improvementsof up to 9.5 dB, and over 10x more processingpower compared to the company’s previousgeneration of ULP wireless ICs.A clean partitioned software architecture forthe Bluetooth® low energy and ANT SoCsfrees designers from the integration effort,complexities, and restrictions of chip vendorsuppliedsoftware frameworks and instead allowscustomers to develop their designs quickly andeasily using the highly popular and familiarARM Cortex programming environment. Thismajor benefit is achieved by separating theprotocol stack and user application code —providing developers a clean boundary betweenapplication and protocol stack, and removes theneed to struggle with integration of applicationcode as part of a vendor-imposed applicationdevelopment framework. Code development isnow greatly simplified and accelerated and atthe same time risks associated with integrationof application and stack code are significantlyreduced. Customers can expect lower bug ratesand improved robustness for their applications.Moving to the Cortex-M0Nordic, which traditionally uses8051-compatible controllers, has implementedthe Cortex-M0 core in the nRF51 Series. Theuse of the ARM Cortex-M0 delivers up to 10xmore processing performance and 100x fasterstart-up of 2.5 µs from sleep, versus the legacy8-bit 8051.Further advantages of the Cortex-M0 coreinclude improved code density, industry-standardtool chain, large software ecosystem, 4.4 mApeak executing from Flash, and a smooth codemigration path.The processor finishes tasks faster, spendingmore time sleeping, quickly wakes up using lesscurrent starting up, and enables the peripheralsto operate autonomously. Here the CPUprograms a sequence of peripheral operationsand goes to sleep while the peripherals executethier operations. The SoC has no predefinedpower modes with only those blocks doingsomething requiring power.All about softwareThe nRF51 offers a different approach tosingle chip software development. By offeringa clean separation of application and stackcode, all the application designer sees is astandard Cortex M0. There is no proprietaryapplication framework, no scheduler, no RTOSdependencies. The engineer has full controlover the choice of operating environment.The application code and stack code arecompiled separately and there are no link-timedependencies. The stack is transparent andrun-time protected. Key advantages includeindependent develoment, testing and verificationas well as code portability, migration and reuse.Better radio performanceThe multi-protocol 2.4 GHz radio provideshigh-performance, ultra low powerconsumption, and flexibility. The radio features-92.5dB receive sensitivity in Bluetooth lowenergy mode and up to +4 dBm output powerin all modes.The radio delivers a 9.5 dBm improvementin link budget compared to the company’sprevious generation radio. It is Bluetoothlow energy (Bluetooth v4.0) compliant andoffers100% on air compatibility with Nordic’sexisting nRF24L series ICsThe radio supports non-concurrent andconcurrent operation of a range of protocolsincluding Bluetooth Low Energy, ANT, andproprietary 2.4 GHz RF. Keeping the low-powertheme, the radio draws sub-10-mA peak currentsrunning off a 3-V coin cell battery.Bluetooth Low EnergyThe nRF51822 multi-protocol Bluetooth lowenergy SoC includes 256 kB on-chip Flash and16kB RAM, a wide range of digital and mixedsignal peripherals including SPI, 2-wire, ADC,and a quadrature decoder, as well as 16 PPIchannels. The SoC features a complete Bluetoothprotocol stack from Link layer to Profiles.The S110 Bluetooth low energy stack forthe nRF51822 is provided as a downloadable,royalty-free, pre-compiled binary that can beprogrammed and updated separately. It requiresless than 128 kB code space and 6 kB of RAM,leaving more that 128 kB flash and 10 kB RAMfor application code.For proprietary applications the nRF51822is complemented by an improved Gazell2.4 GHz RF protocol stack providinginteroperability with nRF24L Series Gazellbasedapplications. It consumes 30 percent lessthan the previous generation nRF24LE1.The ANT SoCThe nRF51422 Flash-based ANT SoC isthe world’s first single chip solution forANT applications. It is a third generationNordic ANT solution, and an ideal fitfor cost, power, and size-constrainedapplications such as sports, fitness, andhealthcare sensors.The SoC supports Broadcast,Acknowledged, and Burst communicationmodes. It provides support for up to eightconcurrent ANT channels and a 60 kbpsburst rate – 300% faster than previousgeneration. The nRF51422 requiresless than 32 kB of code space and 2 kBof RAM, leaving more that 224 kB ofFlash and 14 kB of RAM available forapplication code.Microwave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

engineering europeSALES OFFICESEUROPEAustriaVictoria & Norbert HufmannTel +49 911 93 97 64 42 - sales@hufmann.infoBelgiumNadia LiefsoensTel: +32-11-224 397 - nadia@fivemedia.beFrance, Spain & PortugalAndré RousselotTel:+32 2 740 0053 - sales@eetimes.beGermany PLZ 0-3, 60-65, 8-9Victoria & Norbert HufmannTel: +49 911 93 97 64 42 - sales@hufmann.infoGermany PLZ 4-5Armin WezelTel: 0049(0)30 526 891 92 - armin@eurokom-media.deGermany PLZ 66-69, 7Ralf StegmannTel: +49 7131 9234-0 - r.stegmann@x-media.netIsraelAmir Ben-ArtziTel: +972 73 7367966 - amir@amircm.comItalyFerruccio SilveraTel: +39-02-284 6716 - info@silvera.itScandinaviaJeff DraycottMobile: +46-(0)702 067636 - jeff.draycott@comhem.seSwitzerlandMonika AilingerTel: +41-41-850 4424 - m.ailinger@marcomedia.chUK & Ireland & The NetherlandsNick WalkerTel: +44 (0) 1442 864191 nickjwalker@btinternet.comUSAUS East CoastKaren Smith-KerncTel: +1 717 397 7100 - KarenKCS@aol.conUS Central & West CoastAlan KerncTel: +1 717 397 7100 - AlanKCS@aol.comASIAJapanMasaya IshidaTel: +81-3-6824-9386 - MIshida@mx.itmedia.co.jpHong KongAsian Sources Publications Ltd.Tel: +852 2831 2775 - bennie@globalsources.comSouth KoreaJ. W. SuhTel: +82-2-7200-121 - hauintl@chol.coTaiwanLotus BusinessTel: +886-4-23235023 - medianet@ms13.hinet.netEUROPEAN BUSINESS PRESS SABuilding the Internet ofThingscomment 9The Internet of Things has long been touted as the nextbig wave with predictions of markets of tens or hundredsof billions of devices. While this may come to pass, justconnecting devices to the Internet in itself is a pointlessexercise. There needs to be a rationale for doing this. Forexample, does my microwave really need to communicate overthe web?There is another interesting trend in the making, that of the‘Appcessory’. This is basically and application tied to a devicesuch as a blood presure monitor, heart rate monitor, sportsand fitness monitors, peripherals or even a TV remote. Herea mobile phone or tablet can act as the portal to the internetas well as the display if needed. In this scenario, everythingtied to a particular individual becomes smartphone or tabletcentric. Similarly, intelligent power devices that know howmuch they consume or have a failure would become appbased.After all, a plug might talk a user’s phone to reporta fault in the power line, or the microwave could report itsconsumption. However, such devices do not necessary connectto the Internet, instead they use a low power wireless protocolsuch as ANT or Bluetooth Low Energy to talk to an ‘app’ onthe phone or tablet.Many devices could also talk to each other as well as thetablet or smartphone. Such personal sensor networks could bethe way forward in the connected home. Connecting devicesto an application gives the device a purpose and the user areason to use the device in such a way.However, making this happen requires very low powerconsumption of the wireless link, so low in fact that energyharvesting looks after the devices energy needs or a coin cellbattery powers the device. The battery needs to work foryears, if not for the life of the device in question.Nodic Semiconductor, a specialist focused solely on ultralowpower wireless is one company making all this possible.They have raised the bar with the release of Bluetooth LowEnergy and ANT SoCs that combine the 2.4 GHz radio,software stack and 32-bit ARM Cortex-M0 on a single chip.See page 8 for more details.It is quite likely the Internet of Things will come to pass,but the majority of such devices will be ‘app’ centric.André RousselotSales directorTel +32 (0)2 740 0053email: andre.rousselot@eetimes.beeuropeanbusiness pressJean-Pierre JoostingEditor (jean-pierre.joosting@eetimes.be)www.microwave-electronics.comMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

10 microwave componentsUSB DC -18-GHz coaxial switch... SiO2 coaxial cableskeep phase noise flat... PA covers 71-76-GHz...USB-powered, single-pole double-throw coaxialswitch covers DC to 18 GHzAgilent Technologies has announced a USBpowered,single-pole double-throw coaxialswitch, operating from DC to 18 GHz. Themicrowave switch driven by a USB port, theAgilent U1810B will provide system-design andmanufacturing engineers a long-operating-lifesolution with convenient RF switching.The U1810B USB coaxial switch will supportthe standard plug-and-play functionality oftypical USB devices, eliminating the need foradditional power adapters or drivers, andsimplifying setup. A button on the switchwill enable users to toggle the signal pathbetween two output ports without using thesoftware interface. These new capabilitieswill help engineers design switch matricesfor telecommunications and electronics/semiconductor manufacturing applications.The U1810B will deliver a guaranteed5-million-cycle operating life (though userscan expect 10 million cycles to be typical), andguaranteed 0.03 dB insertion loss repeatability.The long operating life helps reduce the costof test and ensures reliability of the test systemthroughout its life. The switch’s exceptionalinsertion loss repeatability will help minimizesystem measurement uncertainty, whilemaximizing test throughput.The U1810B’s front panel provides analternative software control interface. Users willalso be able to control the switch using varioussoftware platforms such as C, LabVIEW or VEE.www.agilent.comCoaxial cables boast superior phase performanceThe Times Microwave Systems phase criticalproduct line includes the recently broadenedrange of PhaseTrack® cable assembliesemploying the company’s TF-4 dielectric, andSiO2 dielectric semi-rigid cable assemblies foruse in extreme environments.PhaseTrack® coaxial cables are now availablein standard flexible, low smoke flexible, in-theboxflex and semi-rigid versions. Exhibitingsuperior phase performance with temperaturechanges, they eliminate the common “phaseknee” found in PTFE-based cables. All systemsrequiring phase stable or phase trackinginterconnects will benefit from the performanceoffered by the PhaseTrack® products, whicheliminate PTFE “phase knee”, and offer superiorabsolute phase performance, with tracking betterthan 50 ppm. The cables feature low insertionloss and VSWR characteristics and come inflexible and semi-rigid versions.SiO2 dielectric semi-rigid cable assembliesprovide the ultimate in phase trackingperformance and support applications withextreme temperature and environmentalexposure requirements.www.timesmicrowave.comCompact coaxial Ka-Band line amplifierModel AMF-6F-17702200-50-17P has beenadded to MITEQ’s family of Ka-Band, single bias,coaxial line amplifiers. This LNA has over 35 dBof gain from 17.7 GHz to 22.0 GHz, in a housingthat is only 0.72-inches long and 0.75-incheswide without the field replaceable K-connectors.Gain flatness is a maximum of 3.0 dB peakto-peak,though typical is less than 2.0 dB. TheAMF-6F-17702200-50-17P has a maximumnoise figure of 5.0 dB in the full band, thoughthe typical value is less than 3 dB. It operatesfrom -40 to +75°C of base temperature, hasa P1dB minimum of +17 dBm, output IP3of typically +25 dBm, and a current draw of300 mA maximum from a single +15-V DCsupply. Port VSWR is typically less than 2:1 forboth input and output.An aluminum case provides excellent thermalcharacteristics. Hermetic sealing and low noisefigure options are available.www.miteq.comHigh reliability power amplifier covers 71 to 76 GHzThe HHPAE-459 power amplifier, available fromRenaissance Electronics covers the frequencyrange from 71.0 to 76.0 GHz. It has an outputP1dB of +18 dBm with small signal gain of 29 dB.MMIC technology is employed for highreliability and repeatability. A single +6.5 VDCbias feeds an internal voltage regulator andbias sequencer to power the amplifier, freeingthe user from the complications of a dual biasconfiguration.The amplifier was designed for use intransmitters for E-Band radio communicationssystems.www.hxi.comwww.rec-usa.comMultiplied phase locked oscillators deliverlow phase noiseAPI Technologies has announced a line ofmultiplied phase locked oscillators offering aphase noise performance of -175 dBc/Hz (at100 kHz offset).The device can use an internal or external10 MHz reference. With an output range of 80to 1600 MHz, and the flexibility of the passivemultiplier design, these phase locked oscillatorscan be configured for most military and groundsbased applications.Desired output frequency is increased byusing a series of x2 multipliers. The oscillatoralso delivers excellent spurious performance of-60 dBc when powered by a +12-V supply.Additional features include: DC voltageregulation, automatic reference sensing, lowcurrent consumption and multiple RF outputs.www.apitechnologies.comMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

Smart now.Smart later.VectorStar TM Network Analyzers aretechnologically and economically smart.Anritsu’s industry-leading technology delivers performance where it really matters.The VectorStar 40 kHz to 140 GHz flagship broadband system provides industry-bestperformance in all three critical performance areas: broadband frequency coverage,dynamic range, and measurement stability. Whatever your starting requirement, feelsafe in the knowledge that Anritsu’s VectorStar offers the expandability you need inthe future. As your needs grow, so can your VectorStar.• The only VNA with a noise measurement to 125 GHz• Unique multi-frequency gain compression display• Widest broadband frequency range 40 kHz to 140 GHz• Two-port, four-port, and multiport (4-12) variants• Nonlinear measurement systemsFor applications ranging from microwave component testing to on-wafer devicecharacterization, when you want best-in-class performance and industry-leadingtechnology, you know the answer — Anritsu.Get the most out of yourVNA with our FREE 36 pageGuide to UnderstandingVNA Calibration.http://www.anritsu.com/en-GB/Promotions/vna-smart/index.aspxGet the most out of your VNA with our 36 page Guide to Understanding VNACalibration. Just scan the code opposite.Sales Offices: Europe 44 (0) 1582-433433, USA and Canada 1-800-ANRITSU,Japan 81 (46) 223-1111, Asia-Pacific (852) 2301-4980, www.anritsu.com©2012 Anritsu Company

12 Case study — CAD/EDA/EM-SoftwareAltium Designer makes ultra-high-performancedesign move faster at Spectrum IntegrityBy Michael Ingham, Director of Engineering Spectrum IntegritySpectrum Integrity designs ultra-high-speeddigital, RF, and microwave PCBs which,at 20 to 110 GHz and beyond, are amongthe most challenging applications in industry. Itscustomer design challenges require a proprietary“outside the box” process. Yet at the sametime, the company must interface with industrystandard component libraries as well as thedesign review processes of its clients.To design such esoteric designs, the companyrelies on a collection of very specialized tools.The native schematic capabilities in such toolshave proved completely unusable. SpectrumIntegrity had to rely instead on a third-partyschematic tool that prevented synchronizationof layout and schematic and no cross-probingcapability. The process had become toodisjointed.Furthermore, there was no free externalviewer feature for the board designs, and nosimple way to export design files. The frequentclient reviews were a tedious and long process.The company had tried to streamline theprocess using PADS, but its schematic capturetool was similarly inadequate, and its versioncontrol was missing critical built-in functionality.Spectrum Integrity and its customers neededa more integrated design environment that couldaccommodate the magic of high-speed and RFPCB design.RF design. “We added strategic, proprietaryimprovements to the tool suite to make themvery powerful and efficient for RF and ultrahigh-speeddigital design,” says Ingham. Tostreamline interaction with RF analysis, itexports board designs in Gerber data into a 3Dfield solver. After completing analysis, AltiumDesigner reads the files back in AutoCAD orDXF format, an easy process that retains netintelligence within the integrated tool suite.Also, Spectrum Integrity reports that creatingcustom footprints, with non-standard features,is much easier in Altium Designer than its oldtool suites.AutomationAutomation within Altium Designer PCB layouthelps streamline steps within the design process.For example, the application can apply real-BGA breakout screen shot.SolutionThe company has adopted Altium Designer, andhas seen an immediate improvement throughits advanced features and integration across thedesign process.“The Altium schematic program is verypowerful,” explains Michael Ingham, director ofengineering at Spectrum Integrity. The designsuite synchronizes with major componentsuppliers including Digi-Key, Mouser, andNewark, “an unexpected major benefit that hasmade our component engineering much moreefficient.” It also embeds component informationto automate most of the effort of makingaccurate BOMs.Spectrum Integrity also found itstraightforward to customize the AltiumDesigner environment for the intricacies ofBGA tunedtraces.Another BGAbreakout screenshot.Microwave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

Case study — CAD/EDA/EM-Software 13time updating of split power planes during thecourse of design, saving manual retouching ofthose planes during design changes. “With ourold tools, we would have to manually un-pourand re-pour power planes every time there wasa change,” says Ingham. “The pour feature inAltium saves us 75% of our time in this step.”“We can now use a mainstreamtool for our ultra high-performancedesign work, and customize itso we don’t have restrictions ongetting creative.”Perhaps the biggest efficiency improvementoccurs in data management. The versioncontrol features are very important to SpectrumIntegrity, because RF designs often requiremultiple versions stretched across a veryextensive review process. In addition, AltiumDesigner imports and exports across manypopular formats, and includes a free designviewer. As Ingham explains, “It’s the nature ofour designs to produce many versions to shareand review.” His team has found that even therelatively simple task of creating PDF checkplots has saved considerable process time andprevented the need for a third party program.ResultsExcept for two customers using legacy software,Spectrum Integrity now produces all of itsdesigns using Altium Designer. “We can nowuse a mainstream tool for our ultra highperformancedesign work, and customize it sowe don’t have restrictions on getting creative,”says Ingham.Altium Designer’s ease of use andcomprehensive training made adoption quickand painless. “The program was fairly intuitiveand we were able to be productive after justa few days of study,” says Ingham. “Using thenumerous available materials and very helpfulvideos, my engineers quickly became productivewithout the need for attending a dedicatedtraining class. They were proficient in about halfthe time it took for learning PADS.”Customer design reviews are much moreefficient with Altium Designer due to thedesign viewer and automated PDF feature.“The ease of review allows customer reviewsto be much more efficient and thorough, andit avoids unnecessary questions and steps. Ourcustomers are very pleased.”Finally, Altium Designer has automated thegeneration of Gerber manufacturing files, whichsaves time and minimizes manufacturing errors.ProductSpectrum Integrity designs ultra-high-speeddigital, RF, and microwave PCBs that processsignals at frequencies from 20 to 110 GHzand above. The CAD screenshots show12- and 14-layer ultra-high-speed digitalapplications successfully designed in AltiumDesigner. These examples have outer layertraces designed to support 50 GHz signals andmultiple inner layer traces designed to support28 GHz. These designs utilized complexgeometries, split power planes, transmissionlines, and coplanar vias successfully designedusing a combination of Altium Designer andproprietary design techniques.www.altium.comGet a New Picture of PCB-Prototypingand Production on DemandHigh speed laser structuring: LPKF ProtoLaser SEnjoy a clean process with all types of PCB materials.Minimal line/space width of 50/25 μm on ceramics.www.protolaser.comLPKF Laser & Electronics AG Phone +49 (0) 5131-7095-0 info@lpkf.com www.lpkf.comMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

Six Days Three Conferences One ExhibitionEurope’s PremierMicrowave, RF, Wirelessand Radar EventSpace for MicrowavesEXHIBITION &CONFERENCEREGISTRATIONINFORMATIONOctober 28 th - November 2 nd 2012Amsterdam RAI, The NetherlandsOfficial Publication:Organised by:Supported by:Co-sponsored by:Co-sponsored by:European Microwave AssociationRCo-sponsored by:Co-sponsored by:Co-sponsored by:®Register online at:www.eumweek.com®

EUROPEAN MICROWAVE WEEK 2012THE ONLY EUROPEAN EVENT DEDICATED TO THE MICROWAVE AND RF INDUSTRYEuropean Microwave Week continues its series of successful events, with its 15th at the RAI, Amsterdam, The Netherlands. The EuMW 2012team are excited to return to this superb city that offers the culture, entertainment and history of a big city, while also affording the charmand warmth of one much smaller. Bringing industry, academia and commerce together, European Microwave Week 2012 will see anestimated 1700 conference delegates, over 5000 visitors and 250 plus exhibitors.THE EXHIBITIONConcentrating on the needs of engineers, the event showcases the latest trends and developments that are widening the field of the applicationof microwaves. Pivotal to the week is the European Microwave Exhibition, which offers YOU the opportunity to see, first hand, the latesttechnological developments from global leaders in microwave technology, complemented by demonstrations and industrial workshops.Registration to the Exhibition is FREE!• International Companies - meet the industry's biggest names and network on a global scale• Cutting-edge Technology - exhibitors showcase the latest product innovations, offer hands-on demonstrations and provide the opportunityto talk technical with the experts• Technical Workshops - get first hand technical advice and guidance from some of the industry's leading innovatorsBE THEREExhibition DatesOpening TimesMonday 29th October 12:00 - 18:00Tuesday 30th October 9:30 - 18:00Wednesday 31st October 9:30 - 18:00Fast TrackBadge RetrievalEntrance to the Exhibition is FREE and attending couldn’t be easier.VISITORSRegistering for the Exhibition• Register as an Exhibition Visitor online at www.eumweek.com• Receive a confirmation email with barcode• Bring your barcode with you to the Exhibition• Go to the Fast Track Check In Desk and print out your visitors badge• Alternatively, you can register Onsite at the self service terminals during the Exhibition opening times.Please note NO visitor badges will be mailed out prior to the Exhibition.www.eumweek.com

EUROPEAN MICROWAVE WEEK 2012THE CONFERENCESDon't miss Europe's premier microwave conference event. The 2012 week consists of three conferences and associatedworkshops:• European Microwave Integrated Circuits Conference (EuMIC) – 29th – 30th October 2012• European Microwave Conference (EuMC) – 29th October - 1st November 2012• European Radar Conference (EuRAD) – 31st October - 2nd November 2012• Workshops – 28th - 29th October and 1st - 2nd November 2012The three conferences specifically target ground breaking innovation in microwave research through a call for papers explicitlyinviting the submission of presentations on the latest trends in the field, driven by industry roadmaps. The result is three superbconferences created from the very best papers, carefully selected from close to 1,000 submissions from all over the world.Special rates are available for EuMW delegates. For a detailed description of the conferences, workshops and short coursesplease visit www.eumweek.com. The full conference programme can be downloaded from there.Fast TrackBadge RetrievalRegister online and print out your badge in seconds onsite at the Fast Track Check In DeskConference PricesThere are TWO different rates available for the EuMW conferences:• ADVANCE DISCOUNTED RATE – for all registrations made online before 27th September• STANDARD RATE – for all registrations made online after 27th September and onsitePlease see the Conference Registration Rates table on the back page for complete pricing information.All payments must be in € euro – cards will be debited in € euro.Online registration is open now, up to and during the event until 2nd November 2012DELEGATESRegistering for the Conference• Register online at www.eumweek.com• Receive a confirmation email receipt with barcode• Bring your email, barcode and photo ID with you to the Event• Go to the Fast Track Check In Desk and print out your delegates badge• Alternatively, you can register Onsite at the self service terminals during the registration opening timesbelow:- Saturday 27th October (16.00 – 19.00) - Wednesday 31st October (07.30 – 17.00)- Sunday 28th October (07.30 – 17.00) - Thursday 1st November (07.30 – 17.00)- Monday 29th October (07.30 – 17.00) - Friday 2nd November (07.30 - 10.00)- Tuesday 30th October (07.30 – 17.00)Once you have collected your badge, you can collect the conference proceedings on USB stick anddelegate bag for the conferences from the specified delegate bag area by scanning your badge.

CONFERENCE PRICING AND INFORMATIONEUROPEAN MICROWAVE WEEK 2012, 28th October - 2nd November, Amsterdam, The NetherlandsRegister Online at www.eumweek.comONLINE registration is open from 12th June 2012 up to and during the event until 2nd November 2012.ONSITE registration is open from 4pm on 27th October 2012.ADVANCE DISCOUNTED RATE (before 27 Sept), STANDARD RATE (after 27 Sept & Onsite)Reduced rates are offered if you have society membership to any of the following: EuMA, gaas, iet or ieeeEuMA membership costs: Professional: € 20/year Student € 10/yearReduced Rates for the conferences are also offered if you are a Student/Senior (Full-time students less than 30 yrs of age and Seniors 65 or older asof 2nd November 2012)ADVANCE REGISTRATION CONFERENCE FEES (BEFORE 27 SEPT)CONFERENCE FEESADVANCE DISCOUNTED RATESociety Member (*any of above)Non-member1 Conference Standard Student/Sr. Standard Student/Sr.EuMC € 420 € 100 € 550 € 130EuMIC € 325 € 90 € 430 € 120EuRAD € 255 € 80 € 340 € 1102 ConferencesEuMC + EuMIC € 600 € 190 € 790 € 250EuMC + EuRAD € 550 € 180 € 720 € 240EuMIC + EuRAD € 470 € 170 € 630 € 2303 ConferencesEuMC + EuMIC + EuRAD € 710 € 270 € 940 € 360STANDARD REGISTRATION CONFERENCE FEES (AFTER 27 SEPT AND ONSITE)CONFERENCE FEESADVANCE DISCOUNTED RATESociety Member (*any of above)Non-member1 Conference Standard Student/Sr. Standard Student/Sr.EuMC € 550 € 130 € 720 € 170EuMIC € 430 € 120 € 560 € 160EuRAD € 340 € 110 € 450 € 1502 ConferencesEuMC + EuMIC € 790 € 250 € 1030 € 330EuMC + EuRAD € 720 € 240 € 940 € 320EuMIC + EuRAD € 630 € 230 € 810 € 3103 ConferencesEuMC + EuMIC + EuRAD € 940 € 360 € 1230 € 480WORKSHOP AND SHORT COURSE FEES (ONE STANDARD RATE THROUGHOUT)For full details & titles of Workshops & Short Courses, visit www.eumweek.comFEESADVANCE DISCOUNTED RATESociety Member (*any of above)Non-memberStandard Student/Sr. Standard Student/Sr.1/2 day WITH Conference registration € 80 € 60 € 110 € 801/2 day WITHOUT Conference registration € 110 € 80 € 150 € 110Full day WITH Conference registration € 120 € 90 € 160 € 110Full day WITHOUT Conference registration € 160 € 120 € 210 € 150Proceedings on USB stickAll papers published for presentation at eachconference will be on a USB stick, given outFREE with the delegate bags to those attendingconferences. For additional USB sticks the cost is€ 50Hotel & Travel ServiceAmsterdam RAI Hotel & Travel Service hasenormous experience and can offer youconsiderable savings in money, time and hassle.Visit www.rai.nl/hotelserviceDVD Archive EuMCDVD Archive EuMC 1969-2003 € 10DVD Archive EuMC 2004-2008 € 35FREE SPECIAL FORUMS & SESSIONSDate Time Title Location No. of Days CostWeds 31st Oct 08:30 - 19:00 The 2012 Defence, Security and Space Forum Auditorium 1 FREEThurs 1st & Fri 2nd Nov 08:30 - 17:00 Doctoral School of Microwaves Room G001 2 € 80

14 PA Design — CAD/EDARF and microwave solid-state power amplifiersdesign requires specialised engineeringBy Ivan Boshnakov, Anna Wood, Simon Taylor, Amplifier Technology LtdIn the world of RF and microwaveengineering, the design and developmentof solid-state amplifiers is a speciality. Ithas always required many years of specialisedengineering experience and a suitable collectionof test and measurement equipment. Whilethese will always be necessary, to be successfulin the marketplace today, it is also essential touse a combination of specialised and generalCAD tools.The RF and microwave design software weuse has removed much of the risk and guesswork from creating a new amplifier design. Forus, the software design tools have transformedthe process of designing an amplifier in termsof speed, substantially shortening the productdesign cycle and massively improving theprobability that the new device will perform asspecified at the first attempt.In the last 10 years or so wide bandgaptransistors (SiC MESFETs and GaN HEMTs)have appeared on the market for high powerRF/microwave transistors. They offer higherpower density and higher voltage operation,which in turn are associated with much lowerparasitic capacitances and much higher load-linedynamic resistance, and hence wider bandwidthapplications. Of the two kinds the GaN HEMTsoffer higher gain performance and becamedominant on the market. However, the muchwider bandwidth matching networks could notbe designed optimally with the traditional SmithChart and optimisation techniques [1]. The newrequirements for broadband high power andhigh efficiency performance require new andmore sophisticated matching networks synthesistechniques such as the real frequency technique[4], [7].The design software for the RF andmicrowave amplifiersThe most important part of the design reliesupon extensive use of two RF/microwavesoftware programs which are used in tandem[5]. These are the MultiMatch Amplifier DesignWizard and the general simulator/optimizerMicrowave Office [7], [8].In MultiMatch the designer uses thepowerful real frequencies synthesis techniquefor lossy and lossless matching network designto achieve the optimum performance from theRF/microwave transistors [4], [7]. The designercan also use the new power parameters (aFigure 1: Extraction of design data in Microwave Office.Figure 2: Fittinglinear model to theS-parameters inMultiMatch.Figure 3: MultiMatch layout.properly and fully defined load-line approach)to design power amplifiers [2], [3], [4], [6].MultiMatch is like a massive amplifier designtemplate where the creation of the schematicsMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

PA Design — CAD/EDA 15and layouts is mostly automated to takeaway most of the boring click-and-drag workwith the mouse. Then, with only a few clicksof the mouse, the designed networks aretransferred into Microwave Office [8]. The useof MultiMatch is a major departure from theusual Smith Chart matching network designtechniques and provides the designer withmuch higher creativity and productivity.The networks created this way are thenanalysed further, and optimised if necessaryin Microwave Office using its powerful linear,nonlinear and EM simulation engines. Veryoften the design actually starts in MicrowaveOffice where the design data (linear models and/Figure 4: The layout in Microwave Office.Figure 5: Overall final look of the amplifier afterAltium and SolidWorks design process.or Load-Pull impedances) are extracted for thedesign process in MultiMatch. Microwave Officeis the friendliest RF/microwave simulationsoftware on the market and provides the highestproductivity for small size companies.The final RF layout created in MicrowaveOffice is then transferred to Altium Designerin which the control and power supply circuitsare designed first and then full PCB schematics,layout and Bill of Materials are produced.The mechanical design is done using SolidWorks. Solidworks and Altium, used togetherare probably the two most productive toolsthat small companies can use to create the fulldrawings and documentation.Figure 6: The photo of the product.Figure 7: MeasuredSmall Signal Gainand Gain at Psat.The design processThe design process could be started inMicrowave Office if there is a nonlinear model ofthe transistor to be used. Figure 1 shows a basicschematic from which we can determine thecapabilities of the transistor and the impedanceswhich have to be presented to the transistor forrequired performance.It is also possible, with different set-ups,to simulate IV curves and load-pull contoursat frequencies of interest for power, efficiency,linearity, etc., etc.In cases where a very broadband amplifierstage is required – let’s say 0.5- to 2.5-GHz with45 W Cree GaN HEMT – Figure 1 can be usedto extract S-parameters at a biasing point for halfthe maximum current of the transistor (Imax/2).Then the S-parameters are imported intoMultiMatch where a linear model is fitted tothem – Figure 2.Now, when the maximum current and voltageareas (clipping boundaries) on the IV curves aredefined, the novel power parameters are usedto synthesize the load impedances for maximumpre-clipped power - the output networks onthe right in Figure 3. Then the input lossy(with resistors) and lossless matching and gainequalizing networks are synthesized (on the leftin Figure 3).The layout is manipulated with great ease tothe desired shape, and then with a few clicks ofthe computer mouse the schematic and the layoutare exported into Microwave Office (Figure 4).The creation of schematics and layouts are mostlyautomated in MultiMatch, which saves hoursand hours of dragging elements in MicrowaveOffice. Then, in Microwave Office the microstripdiscontinuities are fully simulated, either byelectromagnetic models or full electromagneticsimulation of parts of the layout. The harmonicbalance simulation is used to simulate the powerlevels of fundamental and harmonic signals,the associated gain and gain compression,currents and voltages, efficiency, etc. Usingthese simulations some small adjustments wouldusually be done to achieve the best possibleperformance.In the fully designed amplifier the stagediscussed above is doubled in parallel andcombined with hybrid couplers to form abalanced configuration.There are three more driver stages designedin the same fashion. The layout of the finalizedRF/microwave circuits is imported into AltiumDesigner and Figures 5 and 6 show the fullmechanical and PCB design using Altium andSolidWorks.Microwave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

16 PA Design — CAD/EDAFigure 8: Simulated Small Signal Gain and Gain at Psat.scratch. To provide that kind of service requiresspecialised knowledge and experience andalso specialised engineering development andproduction tools.During the testing of the early prototypes,some tuning and adjustments are typically madeto the RF and DC/control circuitry, but after thedesign is finalised, usually very little tuning isdone during regular production.Large parts of the tests during prototypequalifications and tests in productionare automated. This helps to shorten thedevelopment time and improves productivity.The automated tests are done using standardmeasurement equipment used with speciallybuilt test fixtures and software.Figure 7 and 8 show comparisons of themeasured and simulated small signal gain andthe gain at full compression. The results arein very good agreement. The measured outputsaturated power is above 48 dBm across the 0.5-to 2.5-GHz frequency band and is again in verygood agreement with the simulation.ConclusionsNowadays, you have to design fast and getit “Right First Time” to have any hope ofcommercial success. The trend is to makeamplifiers that are smaller, with higheroperational bandwidth, higher power andefficiency, and higher linearity to provide bettervalue for money. An amplifier of the complexitydiscussed above typically needs to be ready fordelivery to the customer in as few as 10 to 12weeks after the order has been placed, eventhough the amplifier is often developed fromReferences1. Anthony J. Bichler, “An Introduction toBroadband Impedance Transformation for RFPower Amplifiers”, High Frequency design,January 2009.2. Cripps, S.C., “A Theory for the Predictionof GaAs Load-Pull Power Contours”, IEEE-MTT-S Int’l. Microwave Symposium Digest,1983, pp 221-223.3. Cripps, S.C., RF Power Amplifies for WirelessCommunications, Artech House, 1999, ISBN0-89006-989-I.4. Abrie, Pieter L.D., Design of RF andMicrowave Amplifiers and Oscillators, ArtechHouse, 2009, ISBN 978-1-59693-098-85. Ivan Boshnakov, Jon Divall. “Tandem RFsoftware programs streamline the design ofpower amplifiers”, website feature on PlanetAnalog and Microwave Engineering Europe,December 2002, http://www.eetimes.com/electronics-news/4164425/Tandem-RFsoftware-programs-streamline-the-design-ofpower-amplifiers6. Ivan Boshnakov. “First time right design ofClass A power amplifiers using the novelpower parameters”, Microwave EngineeringEurope, February 2005, http://i.cmpnet.com/mwee/archive/feb05/mwee0205p30.pdf7. MultiMatch Amplifier Design Wizard, Pretoria:Ampsa (Pty) Ltd.; http://www.ampsa.com.8. Microwave Office is a registered trademark ofApplied Wave Research, Inc.Advanced software tool for PA characterization and visualizationNujira has released an advancedmeasurement and data visualization toolfor characterizing RF power amplifiers(PAs) in Envelope Tracking (ET) mode.Designated ET Surface Explorer, itaccelerates PA characterization, providesPA and product designers greater insightinto the performance of ET PAs, andenables them to maximize the linearity,efficiency and output power benefits ofoperating PAs in ET mode.The software’s advanced workflowprovides a massive productivity boost,replacing thousands of complex, repetitiveand time-consuming lab measurements witha single measurement pass, which typicallytakes less than two minutes to capture andprocess. ET Surface Explorer lets designersvisualize how PAs behave under live ETsupply modulation conditions, unlockingthe optimum performance and efficiencycharacteristics of a given PA. Postprocessingand offline analysis tools create 3Dsurfaces of gain, phase and efficiency,to give designers far greater insight intoET PA performance. The tool can alsoautomatically generate, model and exporta wide variety of shaping tables, includingISOGAIN or Maximum Efficiency.ET Surface Explorer’s offline analysisand modeling tools allow the designer torapidly predict and compare applicationperformance from the comfort of theirdesk, without requiring multiple testiterations in the lab. The user simplyloads an input waveform from disk,specifies the RF power level and selects ashaping table or DC supply voltage. ETSurface Explorer then uses the capturedPA surface model to accurately predictadjacent channel leakage ratio (ACLR),efficiency, AM/AM and AM/PM distortion,power dissipation and other parametersin seconds. Selected scenarios can thenbe re-verified in hardware, and comparedagainst the predictions of the model.www.nujira.comMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

test & measurement 17VNA covers single sweep NF measurements over70 kHz to 125 GHz, extends coverage to 750 GHzBy Jean-Pierre JoostingAnritsu Company has introduced noisefigure measurement capability for itsVectorStar MS4640A and ME7838AVector Network Analyzers (VNAs). OptionMS4640A-041 equips VectorStar with 70 kHzto 125 GHz noise figure measurement, enabledin part by a unique receiver optimized formeasurements from 30 GHz to 125 GHz.An example of Anritsu’s technical leadershipis embodied in the receiver used to performindustry-first VNA-based noise figuremeasurements at 125 GHz. It incorporatesa unique design focusing on improved noiseperformance and reduced sensitivity to sourceimpedance. The result is a robust capability tomake high quality microwave and millimeterwavenoise figure measurements on a widevariety of active devices.For less experienced test engineers, configuringa noise figure test setup can be particularlychallenging, as is often necessary to add preamplificationand filtering in front of themeasurement receiver to ensure sufficientsensitivity to make a quality measurement. If toolittle amplification is used, there may be excessivejitter from the instrument A/D converter. Iftoo much power or amplification is applied,compression can impact the measurements.These two constraints form the effectivenoise figure measurement range and can limitthe flexibility a user has in choosing pre-ampsand filters. The MS4640A-041 option takesadvantage of the high-performance VectorStararchitecture to provide a wider noise figuremeasurement range and greater configurationflexibility. In addition, the use of a simple,low-cost termination is possible, rather thana specialized noise source, as part of the coldsource noise figure measurement method. Theseadvantages result in an easier to use, moreflexible test system.The VectorStar series already includes featuressuch as a unique gain compression capabilitywhere a user can display gain compression at upto 401 frequencies to characterize performanceover a DUT’s operating bandwidth in one step.If there is a need to perform active device testingat the wafer level, the VectorStar platform canutilize active and passive tuning of source andload impedances to help accountfor both fundamental and harmoniccontent ensuring optimum DUTperformance during test.4-port measurement to 110 GHzThe VectorStar ME7838A broadbandVNA platform now also offers 4-portmeasurement capability, bringing theinherent advantages of the VectorStarplatform to 4-port and differentialmillimeter-wave (mm-wave)component development. Featuringbest-in-class stability and power levelcontrol, as well as frequency coverageof 70 kHz to 110 GHz in a compact design,the ME7838A offers R&D engineers a highlyaccurate test tool that reduces measurementtimes, controls cost-of-test, and helps improvetime to market.The ME7838A broadband VNA systemutilizes an advanced design that eliminatesthe need for large, heavy mm-wave modulesand coax combiners. This design allows theME7838A to be mounted on a smaller probestation using standard positioners. Directconnections to the probes can be achieved in a2 port configuration due to the design, furtherreducing space requirements, while eliminatinghigh-frequency cable loss and improving thesystem’s raw directivity. In a 4 port system thecompact size of the mm-wave modules meansshort RF cables can be used to provide bestavailable dynamic range and performance.Because of this, the ME7838A delivers industrybeststability and longer measurement cyclesbetween calibrations.The system configuration includes theMS4640A VectorStar and 3739A test set, whichoperates the mm-wave modules. In additionto claiming the widest broadband frequencycoverage, the ME7838A system also claimsbest-in-class RF performance, due to a real-timepower leveling control that provides the bestpower accuracy and stability to power levels aslow as -55 dBm. The system has industry-bestdynamic range of 108 dB at 65 GHz and 107 dBat 110 GHz, and the fastest measurement speedof 55 ms for 201 points at 10 kHz IFBW.VectorStar ME7838A broadband VNA platform providessingle-sweep 4-port coverage from 70 kHz to 110 GHz.Millimeter-ranges to 750 GHzA 4-port configuration for the ME7838AVectorStar VNA extends the measurementsystem’s capability to 750 GHz and higher.Incorporating a number of design featuresthat result in high performance, the ME7838Aprovides R&D engineers designing 4-portor differential millimeter-wave (mm-wave)components with the ability to sweep poweracross a wide range at frequencies up to750 GHz using external mm-wave moduleswithout the need for manual attenuators.The VectorStar ME7838A mm-wave VNAsystem offers real-time power leveling and highstability with wide power level control. It detectsIF and RF power and provides correction tothe mm-wave power in real time and withoutthe need for software correction feedback. Themethod delivers stable mm-wave power even atlow levels and reduces the risk of overdrivingpower-sensitive mm-wave devices – inherentin other systems. Faster power calibrations arealso achieved with the ME7838A VectorStar,compared to competitive mm-wave VNAs,helping to reduce test time and cost of test.A 2-port system configuration includes theMS4640A VectorStar and 3739A/SM6522 testset, which operates mm-wave modules.The VNA system can accurately test 4-portcomponents, as well as differential devices, suchas amplifiers used in e-band communications,automotive collision avoidance, airport radar,materials measurement, and imaging systems.www.anritsu.comMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

18 testing td-lteTesting TD-LTE with real world test technologiesBy Erik Org, Senior Marketing Manager, Azimuth SystemsMany wireless data networks wereinitially designed to offer symmetricaldata capacities as the original killerwireless application, voice, required equalcapacity for both uplink and downlink.Spectrum blocks were licensed and auctioned aspaired spectrum suitable for Frequency DivisionDuplexing (FDD) protocols, which servedcarriers and subscribers well when voice was theprimary application.However, as broadband data services haverapidly expanded, the demand on the networkhas become asymmetrical. In other words,the downlink and uplink loads on the networkare no longer balanced as subscribers typicallyrequest (and download) much more content thanthey upload. With a symmetrically provisioneddata service, the asymmetrical data demand willrapidly cause the uplink to become underutilizedas downlink capacity is reached.Time Division Duplexed (TD) protocolshave an advantage in this situation since therelative allocation of bandwidth betweenuplink and downlink can be adjusted byadjusting the scheduling of uplink and downlinktransmissions. With effective scheduling,carriers can operate their networks at a higherlevel of utilization than one which was built ona symmetrical model. TD-LTE allows bandwidthallocations to be dynamically modified anduplink and downlink transmission scheduleswithin a single channel can be updated,depending on the particular needs of thenetwork. This enables carriers to operate LTEnetworks at a higher level of utilization.The key to a robust and reliable TD-LTE testmethodology is to ensure that test equipmentsupports several key requirements. In the realworld, the uplink and downlink coexist in thesame spectrum, so effective test equipmentdesigned to support successful TD-LTEdeployments must also provide these samefeatures. In particular, test equipment mustsupport bidirectional testing and have phaseand amplitude balanced uplink and downlinkchannels.Advanced wireless test equipment suchas a channel emulator can provide the realworld environment necessary for TD-LTE Test.Integration of channel emulators within testsolutions that support device and infrastructuretesting provides test results that more closelyFigure 1: Schematic representation of a point-to-multipoint test case with channel emulation showinga fully bi-directional MIMO channel to each UE for realistic recreation of over-the-air conditions.reflect what happens in the real world. Withthe growing demand for bandwidth and thedevelopment of MIMO based protocols, channelemulators that can also support both the RFrequirements for TD-LTE testing as well asimplement the correlation models typical of realworld activity are essential to effective testing.Requirements for real world testing of TD-LTEsystems and devicesMIMO protocols such as LTE are now impactedmore than ever by the changing nature ofthe “real world” radio environment and aresignificantly affected by the degree of correlationexhibited by the channel models used duringtest. While basic conducted testing uses standardchannel models, more advanced test solutionscan enable test of TD-LTE solutions both overthe air and with replicated radio field conditionsin the lab.Standard laboratory testing completed usingwired connections produces repeatable resultsbut lacks the “real world” and “through theantenna” aspect of over-the-air testing. Whileover the air tests (such as drive tests) representthe real world, testing such as drive testing lacksrepeatability. This is because there are manyvariables which impact performance during areal world test, for example, channel conditionscould change depending upon seasonality andnetwork loading; real world testing such as drivetesting is also expensive to perform.To bridge this gap between laboratoryand real world over-the-air testing, channelemulators are deployed in the laboratory testbed.Channel emulators replicate real world channelpropagation conditions in a controllable andrepeatable fashion through the use of complexchannel models and multiple, programmableparameters (figure 1). Sophisticated channelemulators offer bi-directional operation(simultaneous activity in downlink and uplinkdirections) with independent programmabilityof channel characteristics in both directions.By using channel emulators, radio designs andperformance can be verified, test coverage canbe improved, test cycles decreased and higherquality products can be introduced to the marketin a shorter period of time.Data communications technologies, asemployed in TD-LTE, demand high systemdynamic range and excellent RF fidelity. Theseradio systems often employ advanced digitalmodulation technologies to increase capacity.An example is 64QAM (Quadrature AmplitudeModulation) that carries six bits per symbolper OFDM subcarrier. In addition, techniqueslike OFDMA improve the operation of thesystem and allow for scalable capacity. Thesetechniques, coupled with multiple antennatechnologies, MIMO, ultimately result in systemoperation that can provide scalable, reliablecapacity to mobile stations with aggregatedownstream data rates in excess of 100 Mbpsand upstream data rates in excess of 50 Mbps.But these increases do not come withoutsome cost. Higher order modulations demandhigh dynamic range and linearity. A 64QAMsignal may need in excess of 20 dB SNR toachieve better than desired maximum blockMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

testing td-lte 19error rate. OFDM systems transmit manysmall subcarriers which introduces widechanges in instantaneous power level; a peakto average power ratio (PAPR) greater than10 dB may not be uncommon. And, withfrequency selective fading environments typicalof mobile communications, certain OFDMsubcarriers may be deeply faded while othersmay not, further increasing the demand ondynamic range. The TD-LTE standard currentlyimplements the uplink with SC-FDMA and wasspecifically designed to reduce the impact ofdeeply fades and therefore reduce the powerconsumption of the UE.Figure 2:Beamforming.Channel emulator input dynamic rangeThere are several considerations associated withinput power when choosing a channel emulatorfor use with a 3GPP TD-LTE device. Theseconsiderations include input power range, peakpower and signal-to-noise margin.The transmitted signal from the 3GPPLTE device can have a very wide dynamicpower range. Although the average power mayhave some maximum value, when OFDM isemployed, the PAPR can be greater than 10 dB,and hence the system must accommodate thismaximum. Even with SC-FDMA as employedin transmitters for 3GPP TD-LTE UE devices,PAPR is still present and may be 8 dB or more.Mobile devices also implement transmit powercontrol to vary their output power, typically asa function of their distance from the eNodeB.TD-LTE transmit power control may resultin 63 dB or more of actual power change.Furthermore, when the device is transmittinga higher order modulation, such as 64QAM,an adequate signal to noise ratio (SNR) mustbe maintained. When interfacing with a 3GPPTD-LTE UE, a channel emulator that can allowfor direct connection of devices that transmitfrom +23 to -40 dBm, and still allows forsufficient PAPR and SNR margin, provides for arobust and efficient test configuration.Bidirectionality and phase balanceA time division duplexed signal poses a uniquechallenge to test equipment design. The signalpath through test equipment used for FDDprotocols isn’t required to support phase balancewhen conducting bidirectional testing since theuplink and downlink both work in differentspectrum and follow their own pilot.A TD protocol however requires that bothuplink and downlink paths be balanced in orderto correctly emulate a bidirectional connection.This is especially important as the base station isable to use information from the uplink tocontrol the downlink transmission.Fading and noise floorA fading channel emulator is employed toprovide realistic fast fading conditions; ideally,the emulated fading will match that observedby a subscriber using the devices on the serviceprovider’s network.With an OFDM signal, as used in 3GPPTD-LTE, certain subcarriers may be faded, ormomentarily reduced in amplitude by 20 dBor more due to the frequency selective fading.As each subcarrier is a modulated signal, withmodulation up to 64QAM, this momentarydrop in signal amplitude must be consideredrelative to the noise floor of the channelemulator equipment.For example, if a signal with an average outputpower of -40 dBm is momentarily reduced by 20dB due to fading, the amplitude will be -60 dBm.To maintain an adequate SNR for 64QAM at25 dB, the test equipment noise floor shouldbe no more than -85 dBm. Noise floor is oftenexpressed by test equipment vendors as a noisepower spectral density. Assuming 25º C anda 10 MHz wide signal as would be typical for3GPP LTE, the noise power spectral density ofthe test equipment would need to be less than-155 dBm/Hz to insure that the signal fidelity wasmaintained even during fading conditions. If thenoise floor was greater than this, it is possible thatas the emulator provides the fading channel, theemulator could also introduce a noise level thatwill cause demodulation errors in the receiver asa direct result of the channel emulator noise floorand not of the device under test.Implications of beamformingIn the TD-LTE environment, many serviceproviders and equipment vendors have beenconsidering beamforming in deployments. Byfocusing the transmission energy in beams:• Higher range can be reached;• Less energy can be used for the same range;• Interference can be mitigated;• Network capacity can be increased;• Overall improvements in system performance.Beamforming algorithms are distinguishedon the basis of the algorithm used to select the“beamformer.” With regards to TD-LTE, onemust consider that “air” is reciprocal in nature;i.e. the downlink wireless path looks exactlylike the wireless path in the uplink. Theremay also be multipath reflections, wirelesschannel variations, phase changes etc. as thesignal traverses the wireless environment. Ingeneral, beamforming algorithms utilize thecharacteristics of the air interface such aschannel variations and reciprocity.Channel emulation provides a methodologyto reproduce over-the-air conditions in the labfor testing and benchmarking different devices.Channel emulation can be used to validateimprovements and performance gains due tobeamforming algorithms. However, robusttest of a beamforming device in the lab willrequire the use of a channel emulator that isbidirectional and has reciprocal and balancedpaths in a cabled lab environment (figure 2).This is because beamforming algorithmsdepend on uplink phase and amplitudeinformation to steer the downlink antenna fieldpattern. Channel estimates and other signalingMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

20 testing td-lteFigure 3: Transfer functions of a beamforming MIMO system. Note that the channels must bereciprocal from end to end and not just internally to the emulator.However, TD-LTE will in reality delivercell edge performance comparable to FDDperformance, since almost all cells will typicallyhave more than one user and thus each devicewould be limited to a single resource block perunit time irrespective of the max capacity ofTD-LTE or FDD LTE.Verification of this performance can beaccomplished using a variable AWGN noisesource. AWGN noise is a good approximation ofthe noise seen by a device due to other sectors/cells in the vicinity of the terminal device.information are exchanged continuously betweenthe BS and the MS and hence a bi-directionalconnection needs to be provided in the lab.Reciprocity means that transfer functions for eachpath in a MIMO system look exactly the same inboth directions and the impulse responses h ij (t)must identical for both directions (figure 3).In practical terms, the test equipment usedfor beamforming must ensure that the phaseof the downlink channel should be calibratedto be equal to the phase of the uplink channeli.e. ΦDL needs to be equal to ΦUL, the balanceshould be end to end i.e. right from the pointof the connection of the antenna port of theeNodeB to the point of the connection of theFigure 4: Phaseequivalenceof uplink anddownlink.antenna port of the MS and similar amplitudebalancing may be required for UL and DL paths(figure 4).Impact of network loading on cell edge performanceAt the edge of a cell, a terminal device typicallyraises it’s transmit power to the maximumpermissible in order to ensure continued robustcommunications. However, this quickly leads tothe situation where the terminal device is onlyable to transmit one resource block in any giventime period. Any attempt to transmit more thanone resource block would necessarily spread allavailable transmit power across more resourceblocks and reduce max range.ConclusionThe rising demand for wireless broadband datais driving the adoption of TD-LTE around theglobe. With TD-LTE, the allocation of bandwidthcan be modified by adjusting the scheduling ofuplink and downlink transmissions on a singlechannel depending on the particular needs of thenetwork. This enables carriers to operate LTEnetworks at a higher level of utilization, but theprotocol poses a unique challenge to equipmentdesign as it requires that both the uplink anddownlink paths be balanced in order to correctlyemulate a bidirectional connection.TD-LTE testing must consider test equipmentdynamic range, phase and amplitude balancing,and bidirectionality in order to model TD-LTEdeployment scenarios including beamforming.To ensure excellent “real world” test of TD-LTEdevices and systems, channel emulators canbe chosen that both meet the aforementionedrequirements and which also provide appropriateautomation and channel models that helpbridge the field and the lab and enable effectivereplication of real world conditions in the lab.One good example of such a channel emulatoris Azimuth Systems’ ACE MX MIMO ChannelEmulator. The ACE MX channel emulator isdesigned to easily support bidirectional testingand because it include internal isolators andcirculators, is delivered to customers with phaseand amplitude balanced channels -- whichensures that regardless of the customer’s testbed,Azimuth’s real world solutions deliver excellentperformance for real world TD-LTE testing.Call for contributed articles — Upcoming featuresSept/Oct 2012: Low Power RF // 4G/LTE/LTE-AdvancedSend proposals or synopsis to the editor: joosting@mac.comMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

products 21RF power transistors offer high efficiency and power densityNXP Semiconductors isexpanding their eighthgeneration(Gen8) LDMOS RFpower transistor portfolio forwireless base stations, featuringexcellent linearized efficiency,gain and wideband capability.Covering all main cellularfrequency bands between 700to 2700 MHz, the latest versionof NXP’s proven LDMOSprocess increases the efficiencyof Doherty amplifiers by asmuch as three points andimproves gain by as much as1 dB. The Gen8 LDMOS RFpower transistors offer up to115 MHz of signal bandwidthto enable full-band operationfor all cellular frequency bands,including GSM, W-CDMA andLTE, as well as unprecedentedvideo bandwidth up to300 MHz.Designed for cost-sensitiveapplications, the Gen8 LDMOStransistors offer P1dB powersup to 270 W in SOT502-sized packages, and 400 Win SOT539-sized packages.Engineering samples of 17product types are now available.www.nxp.comCopper-moly-copper packagessuit power semiconductors to 6 GHzThe LL family of leaded laminate coppermoly-copper(CMC) base packages fromStratEdge dissipates heat from high powercompound semiconductor devices, suchas gallium nitride (GaN), gallium arsenide(GaAs), and silicon carbide (SiC).These packages handle applicationsthrough 6 GHz for use in RF radios forcommunications, radar, and high powermillimeter-wave signals. The series includestwo laminate power packages, both with aratio of 1:3:1 CMC, which provides a goodthermal match for alumina-based materialsand a GaN chip.The LL802302 is 20.32- x 9.91-mmwide with 2 leads and a raised lid with anepoxy seal. This is a flange package with abolt hole on each end so the package canbe bolted to the printed circuit board. TheLL362302 is a flangeless, fully hermeticversion of the LL802302 package, and hasa flat ceramic lid.StratEdge offers both flange andflangeless styles to accommodatemanufacturing processes to either boltdown or solder the package. Hermeticity isespecially critical in aerospace and defenseapplications.www.stratedge.comMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

22 productsHigh-linearity switchesmeet stringent Band XIII 4G LTE requirementsThe HaRP technologyenhancedSP10T PE426161switch from PeregrineSemiconductor meets thestringent second-harmonic(2f0) requirement of -80 dBmfor Band XIII 4G LTE —making it the highest-linearityswitch in the Peregrineportfolio.The SP12T PE426171switch features 12 fullysymmetricaltransmit ports thatgive designers the flexibilityto freely configure anycombination of ports for anymode, and any band, throughthe bi-directional, two-wireserial-bus control interface.Both of the switches are MIPIcompliant, and have a widesupply range of 2.3 to 4.8 Vfor operation from VBAT, aswell as high ESD tolerance of4 kV Human Body Model at theANT port, and 2 kV all pins.Both switches also include anon-chip SAW filter over-voltageprotection.In addition to eightsymmetric TX ports, thePE426161 switch features twoSuper TX (STX) ports thateach support low insertionloss of 0.20 dB at 700 MHz,and 0.55 dB at 2690 MHz.The eight symmetric TX portsfeature low insertion loss of0.35 dB at 900 MHz, 0.45 dBat 1900 MHz, and 0.60 dB at2690 MHz.The high-isolationPE426171 switch supportsfour LTE bands, six UMTSbands and four GSM bands,with co-banding applied. Thisswitch has low insertion loss of0.35 dB at 900 MHz, 0.45 dBat 1900 MHz, and 0.60 dB at2690 MHz; and high isolationof 38 dB at 900 and 1900 MHz,on all paths.www.psemi.comSMD true sinewave VCXOdelivers -172.9 dBc/Hz noise floor at 1 MHz offsetCrystek Crystals has launchedthe CVSS-945 — a truesinewave voltage controlledcrystal oscillator (VCXO)providing -172.9 dBc/Hznoise floor at 1 MHz offsetand ±20 ppm minimulAPR pullability. This highperformanceVCXO isavailable in the industrystandard 9 x 14 mm SMDpackage and is engineeredto MIL-STD-883 and MIL-STD-202 specifications.The CVSS-945 VCXOgenerates frequencies between50 MHz and 125 MHz, withoutput level of +5 dBm mininto 50 Ohms and harmonicslower than -25 dBc. The CVSS-945 consumes 30 mA maximulcurrent at 5.0-V and generatesno sub-harmonics. An extendedtemperature range of -40°Cto +85°C and other customspecifications are also available.www.crystek.comLow power multi-GNSS platformsupports GPS/GLONASS/QZSSAlpha Micro has introducedthe u-blox 7 next generationcore positioning technologyplatform designed to supportall Global Navigation SatelliteSystems (GNSS) - US, Russian,Chinese, Japanese - and EUsatellite positioning systems,as well as all Satellite-BasedAugmentation Systems.Based on the UBX-G7020multi-GNSS receiver IC,u-blox 7 has the lowest powerconsumption of any suchdevice on the market today bya factor of three compared toother stand-alone solutions.With 7 mW powerconsumption duringcontinuous navigation, theu-blox UBX-G7020 is perfectfor small portable and powersensitivedevices requiring longbattery life, high sensitivity,small size and fast positioning.The chip has been designedto support the lowest coststand-alone solution viaminimum eBOM; only 8external components arerequired resulting in a receiveroccupying only 30 mm 2 on a2-layer PCB. Standard crystaland TCXO are supported.The chip also provides lowpower,autonomous log dataoutput of position, velocity,and time. Support for A-GPSand u-blox’s CellLocate hybridGNSS/cellular positioningtechnology is embedded tofacilitate advanced telematicsapplications includingindoor positioning. Standardand automotive grades aresupported.www.alphamicro.netVerilog-A RF device modelshelp GaN adoption in 4G/LTE infrastructureCree has released a suite ofVerilog-A proprietary nonlineardevice models for itsGaN RF devices, developedfor use with leading RF designplatforms from Agilent ADSand AWR Microwave Office.The device modelssupport more complexcircuit simulations includingmodulation envelope analysisfor use in the latest innovativebroadband and multi-modeRF power amplifiers for 4Gcellular telecommunications.“The release of this newsuite of device models enablesRF design engineers to predictnon-linear performance usingharmonic balance, conductrobust transient analysisas well as use “real-world”arbitrary modulation signalswith envelope simulation forCree’s GaN HEMT devices,”said Jim Milligan, director RFand microwave, Cree. “TheVerilog-A models, togetherwith envelope simulators,allow designers to directlyinvestigate higher efficiencycircuit approaches, such asDoherty amplifiers, to improveadjacent channel powerratios, spectral re-growthand error vector magnitude,while assessing if amplifierperformance meets spectralmask requirements for LTEdeployments.”www.cree.com/rfMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

products 23Miniature wideband couplerfeatures high directivity over 700 to 2700 MHzAVX Corporation hasdeveloped a widebanddirectional coupler with highdirectivity. Based on thinfilmmultilayer technology,which provides the miniaturepart with excellent frequencyperformance and ruggedconstruction for reliableautomatic assembly, the ITFhigh directivity LGA couplerfeatures a 0402 chip size, highdirectivity (20 dB), and a stablecoupling factor (24 ±2-dB) overa broad frequency range (700to 2700 MHz).Compatible with severaltypes of high frequency wirelesssystems, the coupler is ideal forapplications including: mobilecommunications, satellite TVreceivers, GPS, vehicle locationsystems, wireless LANs, andmatching networks.The ITF high-directivityLGA couplers feature aninherently low profile, excellentsolderability, self-alignmentduring reflow, efficient heatdissipation, and a power ratingof 3 W. Featuring lead-freeSn100 nickel/solder coatedterminations, the couplers arecompatible with automaticsoldering technologies,including reflow, wavesoldering, vapor phase, andmanual. Rated for use from-40° to +85°C, the wideband,high-directivity couplersare also 100% tested forelectrical parameters and visualcharacteristics.www.avx.comLNA MMICstarget low noise applicationsHigh-speed digital step antennabasestation and test applicationsCustom MMIC is introducingthree devices from its growingMMIC IP/design library.CMD162 is a GaAs MMIC lownoiseamplifier (LNA) chip forapplications from 26 to 34 GHz.Optimized for 30 GHzsatellite communications,the CMD162 boasts a typicalnoise figure of 1.7 dB with asmall-signal gain of 22 dB andan output 1 dB compressionpoint of +7 dB. This amplifierdelivers high performance withhigh efficiency, reducing typicalindustry DC power dissipationfor a device in this frequencyband from approximately340 mW down to 50 mW.Two other LNAs includethe CMD157 (die) andCMD157P3 (packaged) GaAsMMICs for applications from6 to 18 GHz. These broadbanddevices each feature a lownoise figure of 1.5 dB, delivergreater than 25 dB of flat gain,and have a correspondingoutput 1 dB compression pointof +10 dBm.Both the CMD157 andthe CMD157P3 are 50Ohm matched designs, thuseliminating the need forexternal DC blocks and RFport matching. The CMD157is suitable for chip-and-wireapplications, whereas theCMD157P3 is housed in aleadless RoHS compliant 3- x3-mm plastic surface mountpackage.www.CustomMMIC.comTriQuint Semiconductorhas released a 7-bit digitalstep attenuator (DSA) thatdelivers the low insertion loss,high speed, linearity and andadvanced, fine-grain resolutionrequired by designers of basestation transceivers, testequipment and many othersimilar applications. TheTQP4M9083 provides up to31.75 dB of attenuation in0.25-dB steps and operatesfrom 400 MHz to 3.5 GHz. Thefiner step increment of 0.25‐dBversus the typical 0.5-dB stepprovides more choices forsystem gain control.The attenuator uses aTTL / CMOS-compatibleserial peripheral interface(SPI) controller for changingattenuation states; thismaintains high attenuationaccuracy over frequency andtemperature. Switching speedis 118 n/s, input third-orderintercept (IIP3) is +55 dBm,and insertion loss is 1.5 dB at2 GHz. The TQP4M9083 isdesigned to be robust, meetingstringent Class 1C HBM (up to2 kV) electrostatic discharge(ESD) requirements.www.triquint.comMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

24 productsHigh-performance front end modulestarget next generation WiFi applicationsRF Micro Devices hasannounced the release of fourhigh-performance front endmodules (FEMs) for nextgeneration WiFi applications.The RFMD® RFFM8200,RFFM8500, RFFM8202, andRFFM8502 are highly integratedFEM solutions coveringmultiple WiFi standards andfrequency bands, particularlyIEEE802.11n and the emerging802.11ac specification. RFMD’sFEMs achieve industry-leadinglinear power and dynamicerror vector magnitude (EVM)performance in support of thenewest reference designs fromthe world’s leading WiFi chipsetproviders.Dynamic EVM is a criticaldesign specification for highdata rate WiFi systems. Whilecompetitor solutions havetraditionally measured staticEVM performance, RFMD’sFEMs achieve superior dynamicEVM to deliver best-in-classreal-world WiFi systemperformance. This enablesoptimum data throughputat increased operator range,current savings throughoptimal transmit and receivespeeds, and an enhanceduser experience during videostreaming, gaming, and otherhigh data rate applications.The RFFM8200/8202(2.5 GHz) andRFFM8500/8502 (5 GHz)FEMs integrate the poweramplifier, LNA, and switchfunctionality into a singleplastic QFN package. Designedfor both “chip on board” and“system-in-package” (SiP)implementations, both productfamilies deliver best-in-classlinear output power whileoperating over a wide range ofoperating voltages.www.rfmd.comRF signal generator and analyzeradd WLAN 802.11ac capabilityAeroflex Limited has addedIEEE 802.11ac capability to itsS-Series RF signal generatorand analyzer product line.Designed for use by engineersin WLAN research, design,and manufacturing, the new802.11ac capability is availablefor the SGD RF digital signalgenerators (Option 119) andthe SVA vector signal analyzers(Option 110).The S-Series product line’sstandard features include aclaim to the industry’s widestbandwidth at 200 MHz;level and frequency settlingtimes that are 5x faster thancompetitors at 100 µs; aswell as very low phase noiseperformance of -135 dB/Hzat 1 GHz, 20 kHz offset. Theinstruments feature a 4U heightand half-rack width.SGD’s comprehensiveWLAN signal generation suiteis now updated for 802.11ac,supporting bandwidths of 20,40, 80, 80+80 and 160 MHzand up to 8 spatial streams.Using an embedded versionof Aeroflex’s IQCreator®waveform creation software,802.11ac waveforms arequickly created and played fromwithin the signal generator.Modulation schemes up to256QAM are supported withexcellent residual EVM (ErrorVector Magnitude) to pinpointthe exact nature of any signaldegradationwww.aeroflex.comBreakthrough front-end systemhas all popular 2G/3G/4G bands and switches/filtersSkyworks Solutions haslaunched a breakthrough frontendsystem that integrates allRF and analog content betweenthe transceiver and antennafor simplified design withindemanding next generationmobile platforms.SkyOne is the firstsemiconductor device tocondense multiband poweramplifiers and high throwswitches along with allassociated filtering, duplexingand control functionality into asingle, ultra-compact package— all in less than half the areaof the industry’s most advancedapproach. At the same time,this groundbreaking solutionclaims the best linearity andpower added efficiency (PAE)for smart RF integration. Asa result, SkyOne offerssmartphone, tablet andultrabook OEMs significantboard space savings, ease ofimplementation, performanceand time to market advantages.Even as radio content andcomplexity continue to rise,consumers are demandingincreasingly thinner andlighter mobile platformswith increased talk/dataaccess time. To meet thischallenge, SkyOne optimizesperformance beyond what ispossible with less integrateddevices and incorporates allpopular 2G, 3G and 4G/LTEprotocols enabling seamlessglobal network roaming andextended battery life.The SkyOne family ofFEMs integrate the followingin a single package: 2G/3G/4Gpower amplifiers; support forbands 1, 2, 3, 4, 5, 7, 8, 13,17 and 20; quad band GSM/EDGE power amplifiers andfilters, all associated duplexerfunctionality, integrated CMOSswitches and control functions;and DCS/PCS Rx filters.ww.skyworksinc.comCompact Bluetooth Low Energy moduleincludes chip antennaMurata has started massproduction of a Bluetooth LowEnergy (BLE) wireless modulethat includes a chip antennaand all the Bluetooth protocolstacks required for low-energycommunication.The LBCA2ZZVZE isdesigned for a broad rangeof consumer electronics butthe module also benefits fromhealthcare protocol profilesbeing included in the stacks.Measuring just 20.0 x 13x 2.4 mm, and based on theCC2541 Texas Instrumentschipset, the module has anoutput power of typically-2 dBm and is fully wirelesscertified to Bluetooth 4.0,TELEC, FCC/IC and CEspecifications.www.murata.euMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

products 25Automotive cellular M2M moduleclaims to be smallest on the marketCinterion claims to offerthe smallest surface mountautomotive M2M moduleavailable, providing globalvoice and data communicationsfor vehicle telematics.The AGS2, measuring 27.6-x 18.8-mm is the company’sfirst offering as an AssociatePartner in the Intel IntelligentSystems Alliance program,which provides OEMs anddevelopers with the advancedhardware, software, firmware,tools and systems integrationsupport needed to bringleading-edge technologysolutions to market faster.The AGS2 surface mountmodule comes in LandGrid Array format and wasdesigned for cost effectivevehicle telematics such as fleetBasestation radio chip setenables active antennasUnitrx from PMC-Sierra is athree-chip set for base stationradios geared to break throughmobile network congestionby enabling active antennas.The chips replace as many as14 discrete devices used intraditional basestation radios.Up to four Unitrx chip-setscan be linked to support 8x8MIMO antennas. The extratransmit and receive channelslet carriers spread coverage tobroader areas and more usersthan conventional designs.Carriers are driving powerdissipation of base stationsfrom 60 W today to as much as80 W in some trials to extendtheir range. “We think smartantennas with MIMO are abetter approach to brute forceincreasing power,” said RobertChow, director of productmarketing in PMC’s broadbandwireless division.management solutions, caralarms and eCall applications.The module features a secureInternet protocol connection,digital audio and advancedvoice technology with voiceprompts, which can be crucialduring emergencies. Quadbandcapability helps eliminatecoverage disruptions, providingreliable communicationseven when roaming betweencounties and across differentcarrier networks.The module’s advancedjamming detectionfeature strengthens theftprevention while its lowpower consumption helpsextend vehicle battery life.Development kits are available.www.cinterion.comActive antennas will beused in tandem with a newtier of small cell base stationscarriers are also testing as away to extend the coverage ofback-haul networks cloggedwith mobile data. Carriers arestill defining just what mix ofactive antennas and small cellsthey will support in their nextgenerationnets.The three Unitrix chips forbasestation antennas consume8.1 W and 2,900 mm 2 inarea compared to as much as17.6 W and 6,200 mm 2 forthe 14 discretes they replace,PMC said. The chip set covers400 MHz to 4 GHz to supporteverything from GSM 2G toLTE 4G networks. The chipsinclude separate transmitterand receiver chips and a clocksynthesizer.http://pmcs.comWireless device precompliance testingcomes to the labRohde & Schwarz has addedthree options to its compactDST200 RF diagnosticchamber: the DST-B160automated 3D positioner, theDST-B210 cross-polarized testantenna and the DST-B270communications antenna.These options significantlyspeed up precompliance testingof wireless devices, allowingautomated test sequences tobe performed on the lab benchso that developers no longerrequire constant access to largeRF test chambers.In wireless deviceprecompliance testing,the compact DST200 RFdiagnostic chamber nowautomatically sets theequipment under test (EUT)to the required position. Withits latest options the DST200claims to be the only RF testchamber on the market thatenables OTA performanceand RSE testing of wirelessdevices such as smartphonesright on the lab bench. Testresults are comparable withthose obtained with large RFtest chambers and are used forproduct optimization duringthe design phase — providingan ideal preparation for finalcompliance testing.www.rohde-schwarz.com13 GHz PLL synthesizerachieves phase detector operating frequency of 110 MHzClaiming to be the industry’shighest performance 13 GHzPLL synthesizer, the ADF4159from Analog Devices achievesbreakthrough phase detectoroperating frequency of110 MHz and simultaneouslyconsumes less than 100 mWof power, which is 5 times lessthan competitive solutions.In addition, it containsa 25-bit fixed modulus aswell as on-chip functionalityto generate highly linearramp profiles, making it anideal solution for FrequencyModulated Continuous Wave(FMCW) radar applications,including automotive radar,microwave point-to-point(PtP), communicationsinstrumentation and testequipment.The ADF4159 Fractional-NPLL synthesizer consists ofa low-noise digital phasefrequency detector (PFD),precision charge pump anda programmable referencedivider. It can be used toimplement frequency shiftkeying (FSK) and phase shiftkeying (PSK) modulation.The ADF4159 featurescycle slip reduction circuitry,which leads to faster locktimes, without the need formodification to the loop filter.www.analog.com/rfMicrowave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

26 calendar — IndexEMC 20125th - 10th Aug 2012David L. Lawrence Convention CenterPittsburgh, PA, USAwww.emc2012.isemc.orgIBC Exhibition6th - 11th September 2012RAI AmsterdamThe Netherlandswww.ibc.orgICUWB2012 - 2012 IEEE InternationalConference on Ultra-Wideband17th - 20th Sept 2012Syracuse, New YorkUSAwww.icuwb2012.orgcalendarMM Live, MEMS Live & NANO Live25th - 26th Sept 2012NEC, BirminghamUKwww.mmliveuk.comAMTA 2012 - Antenna MeasurementTechniques Association21st Oct - 26th Oct 2012Hyatt RegencyBellevue, WA, USAwww.amta.orgEuropean Microwave Week28th Oct - 2nd Nov 2012RAI AmsterdamThe Netherlandswww.eumweek.com2012 Military CommunicationsConference (MILCOM)29th Oct - 01st Nov 2012Orlando, Florida, USAwww.milcom.orgInternational RFID Congress 2012RFID/NFC in Health-Care5th - 7th Nov 2012Palais de la MéditerranéeNice, Francewww.rfid-congress.com/2012/enElectronica 201213th - 16th Nov 2012Messe MünchenMunich, Germanywww.electronica.deCall for contributed articles — Upcoming featuresSept 2012: Low Power RF // 4G/LTE/LTE-AdvancedOct 2012: Radar/Satellite // Test & MeasurementSend proposals or synopsis to the editor: joosting@mac.comAdvertiser Website PageAR Europe www.arworld.us 2Anritsu Ltd. UK www.anritsu.com 11K & L Microwave, Inc. www.klmicrowave.com 21LPKF Laser & Electronics AG www.lpkf.com 13Lake Shore Cryotronics, Inc. www.lakeshore.com 23RFMD www.rfmd.com 5Microwave Engineering Europe ● July-August 2012 ● www.microwave-eetimes.com

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