ALPHA EF-3001 Product Guide
ALPHA EF-3001 Product Guide
ALPHA EF-3001 Product Guide
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➜A L P H A<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes1.1 1.2<strong>EF</strong>-<strong>3001</strong> Key Attribute Benefits<strong>EF</strong>-<strong>3001</strong> PRODUCT PERFORMANCE SUMMARY<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance SummarySelectiveSolderingWetting/Holefill100%*75%Bridging<strong>EF</strong>-<strong>3001</strong>Leading Competitor2. Wide Process Window3. Technical Bulletin50%4. MSDS5. Process <strong>Guide</strong>lines6. Performance vs CompetitionCleanability25%Pin Testability7. Electrical Reliability Data8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> Manual<strong>EF</strong>-4102 <strong>Product</strong> ManualTroubleshooting <strong>Guide</strong>ConformalCoating0%EMEM, SIRBellcoreVOC LeadershipLead-Free Leadership<strong>ALPHA</strong> FLUX <strong>Product</strong> LineGlobal AvailabilityJoint CosmeticsBulk InsulationResistance* 100% = best-in-product-class performanceMicro Solderballs➜The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes2.1 2.2<strong>EF</strong>-<strong>3001</strong> Wide Process WindowA L P H A<strong>EF</strong>-<strong>3001</strong> WIDE PROCESS WINDOW<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance Summary2. Wide Process Window3. Technical Bulletin4. MSDS5. Process <strong>Guide</strong>lines6. Performance vs Competition7. Electrical Reliability Data8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> Manual<strong>EF</strong>-4102 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong>Single WaveDual WaveProcessSuggested Process SettingsParametersSn/Pb Alloy SystemLead-Free Alloy SystemConveyor speed 0.9 -1.2 m/min 0.8-1.0 m/minFlux loading 100-200 micrograms/cm2* 120-200 micrograms/cm2*Topside preheat 105-115°C 105-115°CSolder pot temperature 240-260°C 255-265°CWave height 1/2 to 2/3 of board thickness 1/2 to 2/3 of board thicknessConveyor speed 0.9 -1.2 m/min 0.9 -1.2 m/minFlux loading 150-300 micrograms/cm2* 150-300 micrograms/cm2*Topside preheat 105-120°C 105-120°CSolder pot temperature 240-260°C 255-265°CWave height 1/2 to 2/3 of board thickness 1/2 to 2/3 of board thicknessTroubleshooting <strong>Guide</strong>VOC LeadershipLead-Free Leadership<strong>ALPHA</strong> FLUX <strong>Product</strong> LineNote:These process parameters were used in product development work and are guidelines only.They may not be optimal for your process. You will need to optimize the process parameters foryour particular application.* Flux weight after preheat.Global Availability➜➜The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
➜<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes4.1A L P H A<strong>EF</strong>-<strong>3001</strong> MSDS<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance Summary2. Wide Process Window3. Technical Bulletin4. MSDS5. Process <strong>Guide</strong>lines6. Performance vs Competition7. Electrical Reliability Data8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> Manual<strong>EF</strong>-4102 <strong>Product</strong> ManualTroubleshooting <strong>Guide</strong>VOC LeadershipTo view the <strong>EF</strong>-<strong>3001</strong> MSDS, click hereLead-Free Leadership<strong>ALPHA</strong> FLUX <strong>Product</strong> LineGlobal Availability➜The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
➜A L P H A<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance Summary2. Wide Process Window3. Technical Bulletin4. MSDS5. Process <strong>Guide</strong>lines6. Performance vs Competition7. Electrical Reliability Data8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> Manual<strong>EF</strong>-4102 <strong>Product</strong> ManualTroubleshooting <strong>Guide</strong>VOC LeadershipLead-Free Leadership<strong>ALPHA</strong> FLUX <strong>Product</strong> LineGlobal Availability5.1<strong>EF</strong>-<strong>3001</strong> Wave Soldering FluxRecommended Process <strong>Guide</strong>linesSafety<strong>EF</strong>-<strong>3001</strong> is a non-flammable, waterbased flux. Please refer to the<strong>EF</strong>-<strong>3001</strong> Material Safety Data Sheetas the primary source of health andsafety information.StorageThis product should be stored at alltimes above 3°C. Freezing thisproduct will render the productunusable. Always store in originalcontainer.Compatibility with<strong>ALPHA</strong> PASTES<strong>EF</strong>-<strong>3001</strong> is tested and is compatiblewith <strong>ALPHA</strong> no-clean solder pastesand water-soluble solder pastes aftercleaning.Cleaning<strong>EF</strong>-<strong>3001</strong> is a no-clean flux and theresidues are designed to be left onthe board. If desired, flux residuescan be removed with <strong>ALPHA</strong>EC-Ultra semi-aqueous cleaner orwith other commercially availablesolvents.Wave soldering machines: Tested to work with infrared and convection preheat machines<strong>EF</strong>-<strong>3001</strong><strong>EF</strong>-<strong>3001</strong> PROCESS GUIDELINESReworkUse of the Cleanline Write FluxApplicator with NR-205 flux andTelecore Plus cored solder isrecommended for hand solderingapplications.For lead-free products, the followingSAC 305 wires can be used: TelecorePlus and Fluitin1532.Shelf life12 months from date of manufacturein factory-sealed container.ProcessSuggested Process SettingsParameters SnPb Alloy System Lead-Free Alloy SystemConveyor speed 0.9 -1.2 m/min 0.8-1.0 m/minFlux loading 100-200 micrograms/cm2* 120-200 micrograms/cm2*Single Wave Topside preheat 105-115°C 105-115°CSolder pot temperature 240-260°C 255-265°CWave height 1/2 to 2/3 of board thickness 1/2 to 2/3 of board thicknessConveyor speed 0.9 -1.2 m/min 0.9 -1.2 m/minFlux loading 150-300 micrograms/cm2* 150-300 micrograms/cm2*Dual Wave Topside preheat 105-120°C 105-120°CSolder pot temperature 240-260°C 255-265°CWave height 1/2 to 2/3 of board thickness 1/2 to 2/3 of board thicknessNote: These process parameters were used in product development work and are guidelines only. They may not be optimal for your process.You will need to optimize the process parameters for your particular application.* Flux weight after preheat.➜The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
➜A L P H A<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance Summary2. Wide Process Window3. Technical Bulletin4. MSDS5. Process <strong>Guide</strong>lines6. Performance vs Competition7. Electrical Reliability Data8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> Manual<strong>EF</strong>-4102 <strong>Product</strong> ManualTroubleshooting <strong>Guide</strong>VOC LeadershipLead-Free Leadership6.1 6.2<strong>EF</strong>-<strong>3001</strong> PERFORMANCE VERSUS COMPETITION<strong>EF</strong>-<strong>3001</strong> Flux Performance vs CompetitionHole FillPercentage Hole Fill100806040200Hole Fill Comparison<strong>EF</strong>-<strong>3001</strong>Lead-Free SAC 305LeadingCompetitor<strong>EF</strong>-<strong>3001</strong> Enhanced Performance AttributesComparable hole fill on Cu OSP, one prior reflow, dual wave,versus the leading competitor<strong>EF</strong>-<strong>3001</strong><strong>ALPHA</strong> FLUX <strong>Product</strong> LineGlobal Availability➜The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
➜A L P H A<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance Summary2. Wide Process Window3. Technical Bulletin4. MSDS5. Process <strong>Guide</strong>lines6. Performance vs Competition7. Electrical Reliability Data8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> Manual<strong>EF</strong>-4102 <strong>Product</strong> ManualTroubleshooting <strong>Guide</strong>VOC LeadershipAvg. Micro Solderballs / 100 Pins6.1 6.22520151050Micro Solderballing Comparison<strong>EF</strong>-<strong>3001</strong>Lead-Free SAC 305LeadingCompetitor<strong>EF</strong>-<strong>3001</strong> Enhanced Performance AttributesSuperior to leading competitor, Cu OSP, one prior reflow, dual wave.<strong>EF</strong>-<strong>3001</strong> PERFORMANCE VERSUS COMPETITION<strong>EF</strong>-<strong>3001</strong> Flux Performance vs CompetitionReproducible Micro Solderball Results<strong>EF</strong>-<strong>3001</strong>Lead-Free Leadership<strong>ALPHA</strong> FLUX <strong>Product</strong> LineGlobal Availability➜The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
➜<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes7.1 7.2 7.3<strong>EF</strong>-<strong>3001</strong> Electrical ReliabilityA L P H A<strong>EF</strong>-<strong>3001</strong> ELECTRICAL RELIABILITY DATA<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance Summary2. Wide Process Window3. Technical Bulletin4. MSDSBellcore SIRPasses Bellcore SIR, IPC SIRand Bellcore ElectromigrationSIR Test Report – Bellcore(per GR-78-CORE Issue 1, September 1997)Test: 0241-2bDate: 6/15/02T/H/B: 35/85/-48Material Tested/ SIR SIRCondition (1 day) (4 days)IPC SIRSIR Test Report – J-STD-004(per IPC-TM-650 Issue method 2.6.3.3)Test: 0241-2iDate: 9/26/02T/H/B: 85/85/-48Material Tested/ SIR SIR SIRCondition (1 day) (4 days) (7 days)ElectromigrationEM – Bellcore(per GR-78-CORE Issue 1, September 1997)Test: 0241-1eDate: 7/22/02T/H/B: 65/85/10VMaterial Tested/ SIR SIRCondition (96 hr) (500 hr bias)5. Process <strong>Guide</strong>lines6. Performance vs Competition7. Electrical Reliability DataComb DownGeometric Mean: 7.50E+11 9.50E+11Comb UpGeometric Mean: 7.20E+11 7.00E+11Comb DownArithmetic Mean: 6.70E+09 1.50E+10 2.10E+10Comb UpArithmetic Mean: 8.70E+09 1.00E+10 1.40E+10Geometric Mean: 6.40E+08 1.90E+11 Comb Up5.60E+10 2.60E+10 Comb Down8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> ManualControl BoardsGeometric Mean: 9.90E+11 3.00E+11Control BoardsArithmetic Mean: 2.70E+10 2.00E+10 2.50E+10Passed electrical and visual requirements<strong>EF</strong>-4102 <strong>Product</strong> ManualTroubleshooting <strong>Guide</strong>VOC LeadershipLead-Free Leadership<strong>ALPHA</strong> FLUX <strong>Product</strong> LinePass/Fail Limit: 1E+11 Ohms<strong>EF</strong>-<strong>3001</strong> is Bellcore Compliantper GR-78-CORE.Pass/Fail Limit: 1E+08 Ohms<strong>EF</strong>-<strong>3001</strong> meets theSIR requirement for J-STD-004.J-STD Classification:ORL 0Pass/Fail Limit: ≥0.1 Geometric Mean SIR Initial<strong>EF</strong>-<strong>3001</strong> meets theGR-78-CORE and pendingIPC J-STD-004 requirementfor electromigration.Global Availability➜The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
➜<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes7.1 7.2 7.3<strong>EF</strong>-<strong>3001</strong> In-Circuit Test DataA L P H A<strong>EF</strong>-<strong>3001</strong> ICT DATA<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance Summary2. Wide Process Window3. Technical Bulletin4. MSDS5. Process <strong>Guide</strong>lines6. Performance vs Competition7. Electrical Reliability Data8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> Manual<strong>EF</strong>-4102 <strong>Product</strong> ManualTroubleshooting <strong>Guide</strong>Material: <strong>EF</strong>-<strong>3001</strong> wave fluxAlloy:63/37 solder potProcess conditions: Wave soldered 105°Cpreheat, 1.1 m/minconveyor speed,250°C solder potProcess Date: 6/26/2002Pin Tip:ChiselPin Force (oz.) = 3.5<strong>EF</strong>-<strong>3001</strong>Resistance (ohms) Board A Board B Board C Board D< 5 1000 998 1000 9995 - 10 0 2 0 010 - 20 0 0 0 020 - 50 0 0 0 050 - 100 0 0 0 0100 - 200 0 0 0 0200 - 500 0 0 0 0500 - 1000 0 0 0 01000 - 2000 0 0 0 0> 2000 (miss) 0 0 0 1*Average 0.30 0.37 0.31 0.35Standard deviation 0.11 0.25 0.12 0.11VOC LeadershipLead-Free Leadership<strong>ALPHA</strong> FLUX <strong>Product</strong> LineGlobal Availability* Probe missed pad, producing no contact. Miss not related to flux.• Excellent pin testability• Two misses in 4,000 attempts• No significant residue buildup on probe➜The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
➜<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes8.1 8.2 8.3<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> DemonstrationA L P H A<strong>EF</strong>-<strong>3001</strong> QUALIFICATION TOOLS<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance Summary2. Wide Process Window3. Technical Bulletin4. MSDS5. Process <strong>Guide</strong>lines6. Performance vs Competition7. Electrical Reliability Data8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> Manual<strong>EF</strong>-4102 <strong>Product</strong> ManualTroubleshooting <strong>Guide</strong>VOC LeadershipLead-Free Leadership<strong>ALPHA</strong> FLUX <strong>Product</strong> LineGlobal AvailabilityCheck ListThe intention of thischeck list is to act as aguide for setting up theequipment for running<strong>EF</strong>-<strong>3001</strong> in a typicalwave solderingprocess.1 The flux system (spray head, storage tanks and lines) should be clean and dry of anysolvents or residues from the previously used product. If the changeover is from analcohol based product to <strong>EF</strong>-<strong>3001</strong>, then the system should be purged first with IPAand then with DI water to remove the IPA completely. Failure to comply with thisrecommendation will result in the clogging of the spray system and especially thespray head.2 Check for uniform spray on the board and measure flux loading to compare withrecommended levels.3 Check fingers and pallets for cleanliness.4 Assure that the solder wave is free from dross. Remove dross if necessary.5 Fill flux tank with <strong>EF</strong> product. Fill thinner tank with de-ionized water if present.Purge fluxing system for minimum of 120 second6 Assure that the solder wave is level to the board. Use <strong>ALPHA</strong> Levchek, if required.7 Check the wave height to make sure it is set to 1/2 to 2/3 of the board thickness,including chip wave, if used.8 Set conveyor to the recommended speed, and degree of angle.9 Measure top side preheats and adjust temperature settings on the machine toachieve the recommended temperature.Notes:1. Temperature tabs can be placed at multiple locations on the board (pick high density andlow density areas to determine overall range of temperature).2. Thermocouple probes or moles can be used as well (choose high density and low densityboard areas to determine overall range of temperature).3. The highest and lowest measured top-side preheat temperatures should be within therecommended guidelines for <strong>EF</strong>-<strong>3001</strong>.➜The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
➜<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes8.1 8.2 8.3<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Evaluation <strong>Guide</strong>A L P H A<strong>EF</strong>-<strong>3001</strong> QUALIFICATION TOOLS<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance Summary2. Wide Process Window3. Technical Bulletin4. MSDS5. Process <strong>Guide</strong>lines<strong>Product</strong> Focus and Key FeaturesI. Exhibits excellent hole fillII.III.IV.Provides for high-yield production, minimum first-pass defectsExhibits excellent conformal coating compatibilityProvides both single wave and dual wave capabilitiesV. Tack-free residuesVI.Provides excellent cosmeticsVII. Exhibits minimum micro solderballsm/min.1.41.21.0.8125120°C 115110Conveyor SpeedSnPb System Pb-Free SystemSingleDualSingleDualTopside PreheatSnPb System Pb-Free System6. Performance vs Competition7. Electrical Reliability Data8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> Manual<strong>EF</strong>-4102 <strong>Product</strong> ManualTroubleshooting <strong>Guide</strong>VOC LeadershipLead-Free Leadership<strong>ALPHA</strong> FLUX <strong>Product</strong> LineGlobal AvailabilityDemonstration ProcedureRun 5 boards with <strong>EF</strong>-<strong>3001</strong> at suggested process parameters for eithersingle wave or dual wave:I. Evaluate hole fill and count the number of bridges and icicles• compare to current fluxII.III.Evaluate residue• on board surface• at the edges where conveyor fingers or pallets were used• in areas where pallets were used for selective soldering- compare to current flux- check tackEvaluate conformal-coating results• compare to current fluxmicrograms/cm 2*°C10510032028024020016012080280270260250240SingleSingleDualSnPb SystemDualSingleFlux LoadingSingleDualPb-Free SystemDualPot TemperatureSnPb System Pb-Free System230SingleDualSingleDual➜* Flux weight after preheat.The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.
<strong>ALPHA</strong><strong>EF</strong>-SeriesEnvironmentally FriendlyFluxes8.1 8.2 8.3<strong>EF</strong>-<strong>3001</strong> Flux Loading ChartA L P H A<strong>EF</strong>-<strong>3001</strong> QUALIFICATION TOOLS<strong>EF</strong>-Series Introduction<strong>EF</strong>-2202<strong>EF</strong>-2202 <strong>Product</strong> Manual<strong>EF</strong>-<strong>3001</strong> <strong>Product</strong> Manual1. Performance Summary2. Wide Process Window3. Technical Bulletin4. MSDS5. Process <strong>Guide</strong>lines6. Performance vs Competition7. Electrical Reliability Data8. Qualification Tools<strong>EF</strong>-3215 <strong>Product</strong> Manual<strong>EF</strong>-4102 <strong>Product</strong> ManualTroubleshooting <strong>Guide</strong>VOC LeadershipLead-Free Leadership<strong>ALPHA</strong> FLUX <strong>Product</strong> LineGlobal Availability➜Single WaveDual WaveCoverage Suggested Suggested Suggested SuggestedArea* Lower Limit Upper Limit Lower Limit Upper Limit(100µg/cm 2) (200µg/cm 2) (150µg/cm 2) (300µg/cm 2)cm2 grams grams grams grams100 0.192 0.385 0.288 0.577150 0.288 0.577 0.433 0.865200 0.385 0.769 0.577 1.154250 0.481 0.962 0.721 1.442300 0.577 1.154 0.865 1.731350 0.673 1.346 1.010 2.019400 0.769 1.538 1.154 2.308450 0.865 1.731 1.298 2.596500 0.962 1.923 1.442 2.885550 1.058 2.115 1.587 3.173600 1.154 2.308 1.731 3.462650 1.250 2.500 1.875 3.750700 1.346 2.692 2.019 4.038750 1.442 2.885 2.163 4.327800 1.538 3.077 2.308 4.615850 1.635 3.269 2.452 4.904900 1.731 3.462 2.596 5.192950 1.827 3.654 2.740 5.4811000 1.923 3.846 2.885 5.7691050 2.019 4.038 3.029 6.0581100 2.115 4.231 3.173 6.3461150 2.212 4.423 3.317 6.6351200 2.308 4.615 3.462 6.9231250 2.404 4.808 3.606 7.2121300 2.500 5.000 3.750 7.5001350 2.596 5.192 3.894 7.7881400 2.692 5.385 4.038 8.077Suggested Wet Flux Weight (micrograms/cm2)Single WaveDual WaveCoverage Suggested Suggested Suggested SuggestedArea* Lower Limit Upper Limit Lower Limit Upper Limit(100µg/cm 2) (200µg/cm 2) (150µg/cm 2) (300µg/cm 2)cm2 grams grams grams grams1450 2.788 5.577 4.183 8.3651500 2.885 5.769 4.327 8.6541550 2.981 5.962 4.471 8.9421600 3.077 6.154 4.615 9.2311650 3.173 6.346 4.760 9.5191700 3.269 6.538 4.904 9.8081750 3.365 6.731 5.048 10.0961800 3.462 6.923 5.192 10.3851850 3.558 7.115 5.337 10.6731900 3.654 7.308 5.481 10.9621950 3.750 7.500 5.625 11.2502000 3.846 7.692 5.769 11.5382050 3.942 7.885 5.913 11.8272100 4.038 8.077 6.058 12.1152150 4.135 8.269 6.202 12.4042200 4.231 8.462 6.346 12.692* Surface area of board and any pallet used that has flux applied to it.Note: If the process uses multipleboards with open areas on a singlepallet, the open areas must be deductedfrom the total coverage area.The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regardingthe accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of this information or use of any materials designated.PalletBoardFlux coverage area(diagonal hatching)
A L P H AT E C H N I C A L B U L L E T I N<strong>ALPHA</strong> <strong>EF</strong>-<strong>3001</strong> VOC-Free, N0-Clean FluxGENERAL DESCRIPTION<strong>ALPHA</strong> <strong>EF</strong>-<strong>3001</strong> is a resin/rosin containing, VOC-free, lowsolids, no-clean flux which provides the highest activity of anyVOC-free Bellcore compliant flux for defect-free soldering. It isformulated with a proprietary mixture of resin/rosin andorganic activators. <strong>EF</strong>-<strong>3001</strong> delivers excellent wetting andtopside hole fill, even with OSP coated bare copper boards andsuperior reliability. Several proprietary additives are alsoformulated into <strong>EF</strong>-<strong>3001</strong>, which act to reduce the surfacetension between the solder mask and the solder; thereby,dramatically reducing the tendency of solderball generation.The formulation of <strong>EF</strong>-<strong>3001</strong> is also designed to be morethermally stable; thereby, reducing the occurrence of solderbridging.FEATURES & BEN<strong>EF</strong>ITS• Contains resin/rosin, which encapsulates the activatorresidues to produce assemblies with high reliability.• Bellcore compliant for assemblies requiring this standard.• VOC-free to help meet air quality regulations.• Exceptional wetting for excellent hole-fill even with organicallycoated bare copper boards.• Thermally stable activators provide low solder bridging.• Reduces the surface tension between solder mask and solderto provide low solderball frequency.• Very low level of non-tacky residue to reduce interference withpin testing and good board cosmetics.• Suitable for use with lead-free alloys such as 99.3Sn/0.7Cuand 96.5Sn/3.5Ag.• Residues compatible with thermal and/or UV curableconformal coatings.APPLICATION GUIDELINESPREPARATION – In order to maintain consistent solderingperformance and electrical reliability, it is important to beginthe process with circuit boards and components that meetestablished requirements for solderability and ionic cleanliness.It is suggested that assemblers establish specifications onthese items with their suppliers and that suppliers provideCertificates of Analysis with shipments and/or assemblersperform incoming inspection. A common specification forthe ionic cleanliness of incoming boards and components is5mg/in 2 maximum, as measured by an Omegameter withheated solution.Care should be taken in handling the circuit boards throughoutthe process. Boards should always be held at the edges. Theuse of clean, lint-free gloves is also recommended.FLUX CHANGEOVER PROCEDURE – The flux system (sprayhead, storage tanks & lines) should be clean and dry of anysolvents or residues from previously used product. If thechangeover is from alcohol based product to <strong>EF</strong>-<strong>3001</strong> thenthe system should be purged first with IPA, followed by a DIwater rinse to remove the IPA completely. Failure to complywith this recommendation will result in the clogging of thespray system and specially the spray head.FLUX APPLICATION – <strong>EF</strong>-<strong>3001</strong> is formulated to be appliedby spray method. When spray fluxing, the uniformity ofthe coating can be visually checked by running a piece ofcardboard over the spray fluxer or by processing a board-sizedpiece of tempered glass through the spray and then throughthe preheat sectionThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of thisdata. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.600 Route 440, Jersey City, New Jersey 07304, 800-638-7942, www.alphametals.com➜RETURN TO PRODUCT MANUAL
<strong>ALPHA</strong> <strong>EF</strong>-<strong>3001</strong> VOC-Free, N0-Clean FluxTECHNICAL SPECIFICATIONSPARAMETERS TYPICAL VALUES PARAMETERS/TEST METHOD TYPICAL VALUESAppearance Milky-white Liquid pH, typical 2.55Solids Content, wt/wt 4.2% Recommended Thinner DI WaterSpecific Gravity @ 25°C (77°C) 1.010 ± 0.003 Shelf Life 12 monthsAcid Number (mg KOH/g) 17.8 ± 1.0 VOC Content % 0.6Flash Point (T.C.C.) NONE IPC J-STD-004 Designation ORL0CORROSION AND ELECTRICAL TESTINGCORROSION TESTINGTEST REQUIREMENTS FOR ORL0 RESULTSSilver Chromate Paper 1 IPC-TM 650 Test Method 2.3.33 No detection of halide PassCopper Mirror Tests 1 (Modified IPC/Bellcore Method) No complete removal of copper PassCopper Corrosion Test IPC-TM 650 Test Method 2.6.15 No evidence of corrosion PassJ-STD-004 SURFACE INSULATION RESISTANCETEST CONDITION REQUIREMENTS 2 RESULTS 2“Comb-Down” Uncleaned 85°C/85% RH, 7 days 1.0 x 10 8 minimum 2.1 x 10 10“Comb-Up” Uncleaned 85°C/85% RH, 7 days 1.0 x 10 8 minimum 1.4 x 10 10Control Boards 85°C/85% RH, 7 days 2.0 x 10 8 minimum 2.5 x 10 10IPC Test Condition (per J-STD-004): -50V, measurement @ 100V/IPC B-24 board (0.4mm lines, 0.5mm spacing).BELLCORE SURFACE INSULATION RESISTANCETEST CONDITION REQUIREMENTS 2 RESULTS 2“Comb-Down” Un-cleaned 35°C/85% RH, 5 days 1.0 x 10 11 minimum 9.5 x 10 11“Comb-Up” Uncleaned 35°C/85% RH, 5 days 1.0 x 10 11 minimum 7.0 x 10 11Control Boards 35°C/85% RH, 5 days 2.0 x 10 11 minimum 3.0 x 10 11Bellcore Test Condition (per GR 78-CORE, Issue 1): 48 Volts, measurement @ 100V/25 mil lines/50 mil spacing.BELLCORE ELECTROMIGRATIONTEST CONDITION SIR (INITIAL) 2 SIR (FINAL) 2 REQUIREMENT RESULT VISUAL RESULT“Comb-Down” Uncleaned 1.2 x 10 11 1.4 x 10 11 SIR (Initial)/SIR (Final)
A L P H AM A T E R I A L S A F E T Y D A T A S H E E T<strong>ALPHA</strong> <strong>EF</strong>-<strong>3001</strong> FLUXThe information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of thisdata. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.600 Route 440, Jersey City, New Jersey 07304, 800-638-7942, www.alphametals.com➜RETURN TO PRODUCT MANUAL
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of thisdata. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.➜➜RETURN TO PRODUCT MANUAL
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of thisdata. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.➜➜RETURN TO PRODUCT MANUAL
The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of thisdata. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.➜RETURN TO PRODUCT MANUAL
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