High Speed Digital - SMTA

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3+N+3 Liquid-Liquid Thermal Shock (B)Thermal Analysis Unit ResultsT G (TMA) °C 171.70CTE Z (TMA), pre-Tg ppm/°C 55.8CTE Z (TMA), post-Tg ppm/°C 278.6CTE Z (TMA), 50 – 260C % 3.096%T260 min 16.33
1+N+1 Blind-Buried Stacked Microvia TV• 18 Layers• Thickness: 0.085” (2.16mm)• 2 lamination cycles• Stacked via over Buried Via• Passed Test Parameters:– IST coupons (150C + 190C)– 10x 260̊C JEDEC LFA Reflow18-Layer, 0.085” (2.16mm) thicknessThermal Analysis Unit ResultsT G (TMA) °C 174.42IST @ 150C +IST @190CLead-Free AssemblyJEDEC STDCTF 1000+/100+# of Pass 10X+Solder Floats (no bake) # of Pass 10X
Page 6 and 7: Market SegmentationIPInfrastructure
Page 11 and 12: Relative PriceMid-Loss Lead-Free As
Page 13 and 14: Product Line PropertiesMid Loss Low
Page 15 and 16: Product Line PropertiesMid Loss Low
Page 17 and 18: CAF Failure Mode• Dendritic failu
Page 19 and 20: CAF Test Results (Two Glass Supplie
Page 21 and 22: Theta(MCL-HE-679G)
Page 23 and 24: Product OverviewFeaturesHalogen Fre
Page 25 and 26: Transmission Line Characterization3
Page 27 and 28: Laminate Electrical Properties
Page 29 and 30: APPLICATIONS
Page 31 and 32: 26-Layer PCB TV26-Layer Server Clas
Page 33 and 34: 18-Layer, 3+N+3 IST OEM Coupon (Adv
Page 35: Eye Brow Crack Test VehicleThermal
Page 39 and 40: Processing• Prepreg Shelf-Life/St
Page 41 and 42: Lamination Process of HE-679GLamina
Page 43 and 44: Desmearing processDesmearProcessChe
Page 45 and 46: FX-2
Page 47 and 48: Product OverviewFeaturesHigh Tg (17
Page 49 and 50: Product Line-Up of GFA-2 (Prepreg)P
Page 51 and 52: SPP methodShort Pulse Propagation (
Page 53 and 54: Heat resistance of high layer count
Page 55 and 56: Thermal AnalysisTest Description Un
Page 57 and 58: Emerging Market Needs• We are see

High Speed Digital - SMTA

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