High Speed Digital - SMTA

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Precautions in handlingPrepreg Shelf-Life/Storage• The shelf life of prepreg is 3 months after the date ofshipping with controlled condition in the moisture barrierpacking (aluminum laminated bag).• Storage Recommendations: 20+/-5 o C(68+/-9 o F),
Lamination Process of HE-679GLamination Cycle• The press cycle should be adjusted in order to attain a Tg of175 o C(347 o F) or more (by TMA)• The product temperature should reach 190 o C(374 o F). Theminimum requirement should be that the producttemperature exceeds 180 o C(356 o F) for more than 80minutes. (Must ; ref. Fig.)• Product Heating Rate; 2.5-5.0 o C /min at 60-130 o C• Apply Full Pressure (2.5-4.0 MPa) before product reaches110 o C
Page 6 and 7: Market SegmentationIPInfrastructure
Page 11 and 12: Relative PriceMid-Loss Lead-Free As
Page 13 and 14: Product Line PropertiesMid Loss Low
Page 15 and 16: Product Line PropertiesMid Loss Low
Page 17 and 18: CAF Failure Mode• Dendritic failu
Page 19 and 20: CAF Test Results (Two Glass Supplie
Page 21 and 22: Theta(MCL-HE-679G)
Page 23 and 24: Product OverviewFeaturesHalogen Fre
Page 25 and 26: Transmission Line Characterization3
Page 27 and 28: Laminate Electrical Properties
Page 29 and 30: APPLICATIONS
Page 31 and 32: 26-Layer PCB TV26-Layer Server Clas
Page 33 and 34: 18-Layer, 3+N+3 IST OEM Coupon (Adv
Page 35 and 36: Eye Brow Crack Test VehicleThermal
Page 37 and 38: 1+N+1 Blind-Buried Stacked Microvia
Page 39: Processing• Prepreg Shelf-Life/St
Page 43 and 44: Desmearing processDesmearProcessChe
Page 45 and 46: FX-2
Page 47 and 48: Product OverviewFeaturesHigh Tg (17
Page 49 and 50: Product Line-Up of GFA-2 (Prepreg)P
Page 51 and 52: SPP methodShort Pulse Propagation (
Page 53 and 54: Heat resistance of high layer count
Page 55 and 56: Thermal AnalysisTest Description Un
Page 57 and 58: Emerging Market Needs• We are see

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