High Speed Digital - SMTA

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CAF CouponWall to Wall Spacing0.48mm0.68mm0.53mm0.74mmFX-2 passed all 4 conditions shown above thru 600 hours (for Servers and Storage)testing following IBM test requirements
Thermal AnalysisTest Description Unit Method ResultsFX-2 Cycle 1 Cycle 2T G (TMA) °C IPC TM 650 2.4.41 191.15 193.7CTE Z (TMA), pre-Tg ppm/°C IPC TM 650 2.4.41 73.26 72.21CTE Z (TMA), post-Tg ppm/°C IPC TM 650 2.4.41 130.6 127.8CTE Z (TMA), 50 – 260C % IPC TM 650 2.4.41 2.177 2.126T260 (with external copper) min IPC TM 650 2.4.24.1 Pass PassT288 (with external copper) min IPC TM 650 2.4.24.1 12.39 10.64
Page 6 and 7: Market SegmentationIPInfrastructure
Page 11 and 12: Relative PriceMid-Loss Lead-Free As
Page 13 and 14: Product Line PropertiesMid Loss Low
Page 15 and 16: Product Line PropertiesMid Loss Low
Page 17 and 18: CAF Failure Mode• Dendritic failu
Page 19 and 20: CAF Test Results (Two Glass Supplie
Page 21 and 22: Theta(MCL-HE-679G)
Page 23 and 24: Product OverviewFeaturesHalogen Fre
Page 25 and 26: Transmission Line Characterization3
Page 27 and 28: Laminate Electrical Properties
Page 29 and 30: APPLICATIONS
Page 31 and 32: 26-Layer PCB TV26-Layer Server Clas
Page 33 and 34: 18-Layer, 3+N+3 IST OEM Coupon (Adv
Page 35 and 36: Eye Brow Crack Test VehicleThermal
Page 37 and 38: 1+N+1 Blind-Buried Stacked Microvia
Page 39 and 40: Processing• Prepreg Shelf-Life/St
Page 41 and 42: Lamination Process of HE-679GLamina
Page 43 and 44: Desmearing processDesmearProcessChe
Page 45 and 46: FX-2
Page 47 and 48: Product OverviewFeaturesHigh Tg (17
Page 49 and 50: Product Line-Up of GFA-2 (Prepreg)P
Page 51 and 52: SPP methodShort Pulse Propagation (
Page 53: Heat resistance of high layer count
Page 57 and 58: Emerging Market Needs• We are see

High Speed Digital - SMTA

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