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Fluent Newsletter Summer 2005

Fluent Newsletter Summer 2005

Fluent Newsletter Summer 2005

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CUSTOMIZED SOLUTIONSHeat SinkDesign PortalBy Michael Engelman and Scott Del Porte, Enductive Solutions, Lebanon, NH; and Bhavin Desai, <strong>Fluent</strong> IndiaCFD analysis of a bonded finheat sink design using IcepakDURING THE LAST 20 YEARS, the electronicscooling industry has made widespread use of CAEtechnology for design. Today, it is one of the fastestchanging industries, because of rapid hardwareadvances, ever shorter design cycles, and a constantdrive to cut costs and improve unit productivity.Moreover, as computer speed and memory capacitycontinue to increase, there is a need to remove moreheat from computers in the same or less space thanbefore. Hence, heat sink manufacturers like AavidThermalloy Inc., a sister company of <strong>Fluent</strong>, havebecome commodity suppliers, outsourcing some oftheir manufacturing offshore to Asia. Unfortunately,the design expertise in such companies resides in theheads of a few senior engineers back in their base<strong>Fluent</strong> News · <strong>Summer</strong> <strong>2005</strong> 7

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