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Targeted Design Platform Brochure - Xilinx

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Today’s FPGAs deliver the<br />

performance, cost, powerconsumption,<br />

and capacity that at<br />

one time could only be met by<br />

custom ICs or applicationspecific<br />

standard parts (ASSPs).<br />

SILICON FOUNDATION<br />

The two families help designers stay on top of today’s<br />

system requirements with on-chip transceivers,<br />

���������� ��� ������� ® -compliant hard blocks, DSP<br />

capabilities, embedded memories, and support for<br />

advanced memory technologies.<br />

Virtex-6 FPGA Families<br />

Spartan-6 FPGA Families<br />

The high-performance, high-density Virtex ® -6 FPGA family<br />

comprises three domain-optimized sub-families, delivering<br />

different feature mixes to best address a variety of customer<br />

applications that require either connectivity, DSP, or logic<br />

optimization in the FPGA. Flip-chip packaging technology<br />

ensures the signal integrity requirements for new levels of<br />

���������������������������������������������������<br />

longer requires the Virtex FPGA’s full programmability, use<br />

�����������������������������������������������������<br />

The Spartan ® -6 FPGA family comprises two domainoptimized<br />

sub-families with a mix of features optimized for<br />

cost and connectivity to match the stringent requirements<br />

driven by price-sensitive, high-volume applications. The family<br />

uses a cost-optimized architecture derived from the highperformance<br />

Virtex series, and uses wire-bond packaging to<br />

further drive down costs.<br />

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