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GLOSSARY /TIMING CONVENTIONS/DATA SHEET STRUCTUREVoltageHigh-level input voltage, VIHAn input voltage within the more positive (less negative) of the two ranges of values used to represent the binaryvariables.NOTE:A minimum is specified that is the least positive value of high-level input voltage for which operation of thelogic element within specification limits is guaranteed.High-level output voltage, VOHThe voltage at an output terminal with input conditions applied that according to the product specification willestablish a high level at the output.C')5"C/)C/)Q)..'
GLOSSARY!TIMING CONVENTIONS/DATA SHEET STRUCTUREThe hyphen between the Band C subscripts is omitted when no confusion is likely to occur.For examples of symbols of this type, see TMS 4116 (e.g., tpLCU.Classified time Intervals (general comments, specific times follow)Because of the information contained in the definitions, frequently the identification of one or both of the two signalevents that begin and end the intervals can be significantly shortened compared to the unclassified forms. For example,it is not necessary to indicate in the symbol that an access time ends with valid data at the output. However, ifboth signals are named (e.g., in a hold time), the from-to sequence is maintained.Access timeThe time interval between the application of a specific input pulse and the availability of valid signals at an output.Example symbology:ClassifiedUnclassifiedDescriptiontalA)·tatS), ta(CS)Cycle timetAVOVtSLOVAccess time from addressAccess time from chip select (low)The time interval between the start and end of a cycle.NOTE:Example symbology:NOTE:ClassifiedThe cycle time is the actual time interval between two signal events and is determined by the system inwhich the digital circuit operates. A minimum value is specified that is the shortest interval that must beallowed for the digital circuit to perform a specified function (e.g., read, write, etc.) correctly.tc(RI, tc(rd)tc(WIUnclassifiedtAVAV(R)tAVAV(W)DescriptionRead cycle timeWrite cycle timeR is usually used as the abbreviation for "read"; however, in the case of dynamic memories, "rd" is usedto permit R to stand for RAS.Disable time (of a three-state output)The time interval between the specified reference points on the input and output voltage waveforms, with the threestateoutput changing from either of the defined active levels (high or lowl to a high-impedance (offl state.Example symbology:Classifiedtdis(S)tdis(W)UnclassifiedtSHOZtWLOZThese symbols supersede the older forms tpvz or tpXZ.Enable time (of a three-state outputlDescriptionOutput disable time after chip select (high)Output disable time after write enable (low)The time interval between the specified reference points on the input and output voltage waveforms, with the threestateoutput changing from a high-impedance (off) state to either of the defined active levels (high or low).NOTE: For memories these intervals are often classified as access times.Example symbology:Classifiedten(SL)UnclassifiedtSLOVDescriptionOutput enable time after chip select low...(1)(1).cen~...~C-t/)Co'';::;c(1)>CoUC)c'si=->...~t/)t/)o(5These symbols supercede the older form tpZV.TEXAS INSTRUMENTSINCORPORATED3-5POST OFFICE BOX 225012 • DALLAS. TEXAS 75265
Page 1: SMYOOO2.,MOS MemoryData Book1984II
Page 9 and 10: ALPHANUMERIC INDEX TO DATA SHEETSSM
Page 11 and 12: TABLE OF CONTENTSALPHANUMERIC INDEX
Page 13 and 14: MOSLSIRAMs, ROMs, EPROMsSELECTION G
Page 15 and 16: If you want to give it a try for yo
Page 17 and 18: INTERCHANGEABILITY GUIDEPART 1 -ALT
Page 19 and 20: INTERCHANGEABILITY GUIDEFUJITSUMB 8
Page 21 and 22: INTERCHANGEABILITY GUIDEMOTOROLAMCM
Page 23 and 24: INTERCHANGEABILITY GUIDETOSHIBATMM
Page 25 and 26: INTERCHANGEABILITY GUIDESTATIC RAMS
Page 27 and 28: Alphanumeric Index, Table of Conten
Page 29 and 30: GLOSSARY fTIMING CONVENTIONS/DATA S
Page 31: GLOSSARY/TIMING CONVENTIONS/DATA SH
Page 35 and 36: GLOSSARY/TIMING CONVENTIONS/DATA SH
Page 37 and 38: GLOSSARY/TIMING CONVENTIONS/DATA SH
Page 39 and 40: Alphanumeric Index, Table of Conten
Page 41 and 42: MOSLSITMS411616,384-811 DYNAMIC RAN
Page 43 and 44: TMS411616,384·811 DYNAMIC RANDOM·
Page 45 and 46: 1MS411616,384-811 DYNAMIC RANDOM-AC
Page 47 and 48: TMS411616.384·81T DYNAMIC RANDOM·
Page 49 and 50: TMS411616,384·811 DYNAMIC RANDOM·
Page 51 and 52: zIiADDRESSES~!.....RASCASwDO"*. i,*
Page 53 and 54: TMS411616,384-81T DYNAMIC RANDOM-AC
Page 55 and 56: MOSLSITMS416165,536-81T MULTIPORT M
Page 57 and 58: TMS416165,536-811 MULTIPORT MEMORYf
Page 59 and 60: TMS416165,536-BIT MULTIPORT MEMORYs
Page 61 and 62: TMS416165,536-0IT MULTIPORT MEMORYc
Page 63 and 64: TMS416165,536·BIT MUL TIPORT MEMOR
Page 65 and 66: TMS416165,536 o BIT MUL TIPORT MEMO
Page 67 and 68: TMS416165,536·811 MULTIPORT MEMORY
Page 69 and 70: zI[~~~co,.. twiRL) _,RAS:::~ SI l L
Page 71 and 72: TMS416165,536·BIT MULTIPORT MEMORY
Page 73 and 74: ~ ___TMS416165.536-BIT MUL TIPORT M
Page 75 and 76: 0>~a~~i'i_';:;Z~~~d~c:::• s:~lTl~
Page 77 and 78: TMS416165,536-8IT MULTIPORT MEMORY1
Page 79 and 80: MOSLSITMS4164, SMJ416465,536-8IT DY
Page 81 and 82: TMS4164, SMJ416465,536-811. DYNAMIC
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TMS416465,536-811 DYNAMIC RANDOM-AC
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TMS416465,536·811 DYNAMIC RANDOM·
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TMS416465,536-811 DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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SMJ416465,536-81T DYNAMIC RANDOM-AC
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SMJ416465,536-011 DYNAMIC RANDOM-AC
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TMS4164, SMJ416465,536·81T DYNAMIC
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TMS4164, SMJ416465,536·8IT DYNAMIC
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z~~gz~.J:>.c1J
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Z~d~~~~0,'...."CIIICCCD:3of. twIRL)
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MOSLSITMS4256. TMS4257262.144·8IT
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TMS4256, TMS4257262,144·8IT DYNAMI
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TMS4256, TMS4257262,144-8IT DYNAMIC
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TMS4257262.144·8IT DYNAMIC RANDOM
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TMS4256, TMS4257262,144·BIT DYNAMI
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TMS4257262,144·81T DYNAMIC RANDOM
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Z~d~~~~.!..JcoNOTE:'CIIICO(1),- twI
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i:Z~d~~z~+:>0Co ......"CCICCCD:3og.
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Page 125 and 126:
MOSLSITMS4416. SMJ441616.384·WORD
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TMS4416, SMJ441616,384·WORD BY 4·
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TMS441616,384-WORD BY 4-BI1 DYNAMIC
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TMS441616,384-WORD BY 4-BIT DYNAMIC
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SMJ441616,384·WORD BY 4·BIT DYNAM
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SMJ441616,384-WORD BY 4-B11 DYNAMIC
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1MS4416, SMJ441616,384·WORD BY 4·
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TMS4416, SMJ441616,384·WORD BY 4·
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z~~~z@towRAs-{rCASAO·A7wDQG:::'.!A
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1:'QltC(()3oc..(()C3~~n_:::Z~~~;;;
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MOSLSITMS446465,536-WORD BY 4-BIT D
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TMS446465,536-WORD 8Y 4-81T DYNAMIC
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TMS446465,536·WORD BY 4·BIT DYNAM
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1MS446465,536·WORD BY 4·B11 DYNAM
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TMS446465,536·WORD BY 4·BIT DYNAM
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RASCAS----{! '.,ReIVIH i~VIL I tRLC
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~~~n_;;;z~~. ~~tTlg ;O~d ;;;t::=z~@
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~Z~~iZ~tw '"[:;-~~~~~:TCDCO ".;:r0~
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MEMORY SUPPORTLSITMS4500ADYNAMIC RA
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TMS4500ADYNAMIC RAM CONTROLLERpin d
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TMS4500ADYNAMIC RAM CONTROLLERarbit
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TMS4500ADYNAMIC RAM CONTROLLERswitc
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TMS4500ADYNAMIC RAM CONTROLLERacces
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TMS4500ADYNAMIC RAM CONTROLLERoutpu
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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TMS4500ADYNAMIC RAM CONTROLLERtypic
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Alphanumeric Index, Table of Conten
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•••••MOSLSI65,536 X 4 Org
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TM4164EC465,536 BY 4·BIT DYNAMIC R
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MOSLSITM4164EL965,536 BY 9·BIT DYN
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TM4164EL965,536 BY 9-BIT DYNAMIC RA
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••••••••0MOSLSI65,5
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TM4164FL865,536 BY 8·BIT DYNAMIC R
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MOSLSITMS2516. SMJ251616.384-BIT ER
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TMS2516, SMJ251616,384-BIT ERASABLE
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TMS251616,384·BIT ERASABLE PROGRAM
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SMJ251616,384-BIT ERASABLE PROGRAMM
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o 441MS2516, SMJ251616,384·B11 ERA
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MOSLSITMS2532, SMJ253232,768·BIT E
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TMS253232,768-BI1 ERASABLE PROGRAMM
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MOSLSITMS2564, SMJ256465,536-BIT ER
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TMS256465,536-BIT ERASABLE PROGRAMM
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TMS2564 r SMJ256465 r536-BIT ERASAB
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MOSLSITMS2708, TMS27L08, SMJ2708, S
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TMS270B, TMS27LOBSMJ270B, SMJ27LOB1
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TMS2708. TMS27L081024·WORD BY 8·B
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SMJ2708, SMJ27L081024·WORD BY 8·B
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TMS2708, TMS27L08SMJ2708, SMJ27L081
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MOSLSITMS27162048·WORD BY 8·BIT E
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TMS27162048·WORD BY 8·BIT ERASABL
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TMS27162048-WORD BY 8-BIT ERASABLEP
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TMS2732A32,76B-BIT ERASABLE PROGRAM
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TMS2732A32,768-BIT ERASABLE PROGRAM
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TMS2732A32,768·BIT ERASABLE PROGRA
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MOSLSITMS276465,536-BI1 ERASABLE PR
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TMS276465,536·BIT ERASABLE PROGRAM
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MOSLSITMS27128131,072·BIT ERASABLE
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TMS27128131,072·BI1 ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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TMS27128131,072·BIT ERASABLE PROGR
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MOSLSITMS46648192·WORD BY 8·BIT R
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TMS46648192·WORD BY 8·BIT READ·O
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Page 273 and 274:
MOSLSITMS47324096~WORD BY B·BIT RE
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MOSLSITMS47648192·WORD BY 8·BIT R
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MOSLSI, TMS49648192·WORD BY 8·BIT
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MOSLSITMS4712816,384·WORD BY 8·BI
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TMS4712816,384·WORD BY 8·BIT READ
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TMS4712816,384-WORD BY 8-BIT READ-O
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Page 301 and 302:
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MOSLSITMS4725632.768·WORD BY 8·BI
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TMS4725632.768·WORD BY 8·BIT READ
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MOSLSITMS2114, TMS2114L1024·WORD B
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TMS2114, TMS2114L1024·WDRD BY 4·B
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TMS2114. TMS2114L1024·WORD BV 4·B
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ADVANCED MEMORYDEVELOPMENT•Fast A
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TMS2150CACHE ADDRESS COMPARATORabso
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TMS2150CACHE ADDRESS COMPARATORPARA
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MOSLSITMS40162048·WORD BY 8·BIT S
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TMS4016204H-WORD BY H-BIT STATIC RA
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TMS40162048-WDRD BY 8-BIT STATIC RA
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MOSLSITMS4044, TMS40L444096-WORD BY
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TMS4044, TMS40L444096·WORD BY 1·B
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TMS4044, TMS40L444096·WORD BY l·B
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MILITARYCMOSLSISMJ55172048-WORD BY
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SMJ5517204a·WORD BY a·BIT STATIC
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SMJ55172048·WORD BY 8·BIT STATIC
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SMJ55172048-WDRD BY 8-BIT STATIC RA
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SMJ5517204B·WORD BY B·BIT STATIC
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However, the TMS 4164 provides the
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EXPANSION OF 3242 FOR 256-CYCLE REF
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•9-6
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PAD OPENINGIN OVERCOATPADMETALPADME
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Figure 5 shows how the driver outpu
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cpI UO,leWJOJUI suo'le:>!ldd"f\)W(3
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The falling edge of RAS causes R 1
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~--------::~~:~:~~~:--------~~7,34(
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J-Lead AdvantageTexas Instruments P
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Surface Mount Component Availabilit
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fiSECONDARYVAPOR(VAPOR BLANKET)..Fi
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l>'C'2.ri'Q),..o·:::Jen5'....... o
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l>"C'2..(i"Dl...0":=(I)5"....o...3D
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An external refresh counter has bee
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l>'C'CC:)"Q).-+o·::::sen:ro ... ""
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uo!~ew"oJul suo!~ea!ldd"CD .,.., w7
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DOTCLOCKCLOCK ACLOCK C2 xWCLKRAS (A
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B. If dynamic RAM refresh is enable
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•9-38
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The TMS4416/TMS4500A board is arran
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RAS ~CAS \ I2AI \ I '-2BI '-iiD1Ro2
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9-44
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ALEACXRASMAO-MA7CASFIGURE 1 -ALE LE
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The ALE high to ClK low time is giv
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ClKALEACXRASMAO-MA7CASREFREQROY•
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CDinN~1~12 MHzClKINClKOUTWE/iOclKRD
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UO!leWJOJUI SUOlle:ludd"com~'~,i'74
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coen(J)CLOCKWRITEREADROYALEA14-A5MS
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. Access Grant CyclesThe precharge
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whereta(C)tp(BFR)(-103 + tc2 - tp(B
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•9-62
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tt(REH)TCHLLtAEL-RELRAS rise time (
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. Refresh CyclesOn refresh cycles t
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wherethus,fCLKfCLKtCACfCLK[1/2 (tCA
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R/W approach does a normal read-mod
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II(0~""6 MHzI UO!leWJO,ulSUo!le:l!l
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ClKAlE.ACR\ ,----\,\ ,----R/W\ ,---
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4. Row address setup and hold timeT
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CLKrWRITE -------I.~ ..~---REFRESH-
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The read access time on access gran
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implementations in order to relieve
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"C'2..c:rm...o·j(I)....5'o3...mo·
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RELATIVE MEMORY SIZEARCHIVAL STORAG
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increments till satisfied. This pro
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In the example shown in Figure 5, t
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»'C"E..crQ)r+0':::Jtil:;-....o...3
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•9-94
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184LOGIC SYMBOLS1. INTRODUCTIONEXPl
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LOGIC SYMBOLS4.DIAGRAMATIC SUMMARYI
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lOGIC SYMBOLSWhen RAS goes low, it
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MECHANICAL DATAgeneralElectrical ch
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MECHANICAL DATAceramic packages -ce
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MECHANICAL DATAplastic packages (N
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MECHANICAL DATAceramic chip carrier
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Texas InstrumentsSemiconductor Tech
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TI Sales Offices TI DistributorsALA
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Printed in U.S.A.•TEXASINSTRUMENT
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