Materials Challenges for the MEMS Revolution - Advanced ...

AMPTIACA D VA N C E D M AT E R I A L S A N D P R O C E S S E S T E C H N O L O G YThe AMPTIAC News l et te r, Wi n ter 2001Materials Challengesfor the MEMS RevolutionBy Wade Babcock and David RoseReducing the size of an engineered system is a challenge often faced by designers and nowhere is thismore evident than in the field of electronics. The first digital computer known as the ElectronicNumerical Intergrator and Computer (ENIAC) was an enormous system constructed from over18,000 vacuum tubes, 1,500 relays, and hundreds of thousands of resistors, capacitors, and inductors.ENIAC weighed 30 tons and required 1800 ft 2 of floor space, all to provide a computationalcapability that was rapidly eclipsed by personal computers and even hand-held calculators.Soon after ENIAC was completed, researchers began to investigate ways to build computers withsmaller, faster, and more capable devices. Computer speeds increased markedly but they were stilldependent upon components that were relatively large and bulky. The invention of the integratedcircuit and the utilization of lithography enabled numerous discrete devices to be combined andinterconnected with one another on a single chip. These technologies also brought about true massproduction on a scale not seen before, dramatically lowering the unit cost of devices.Lithographic processes utilize a printed mask that locally protects the conductive top layer of thecircuit board or device. The board or device with the mask applied to its surface is then immersed inan acid that attacks and removes (etches) all surfaces not protected by the mask. The mask is laterremoved with a suitable solvent. The result of this etching process is a network of electrically conductivetraces that form the circuitry formerly provided by wires. As a result, electronic equipmenthas generally became smaller and faster, and requires far less time to manufacture.Lithographic techniques have improved dramatically over the past forty years. For instance, duringthe late 60’s, linewidths of 5 microns were being produced experimentally. Today’s linewidths areover 90% smaller, dramatically reducing the size of electronic devices. Additionally, many differenttypes of materials can be etched, not just the conductive top layer of a circuit board.Researchers now realize that the same processes used to fabricate electronic devices may also beemployed to miniaturize and mass produce mechanical systems. By integrating these miniaturemechanical devices with existing electronic capabilities on the same chip, a new class of devicesknown as MicroElectroMechanical systems or MEMS is emerging.continues, page 2The preform is the backbone or skeleton of acomposite material. Because of this, many ofthe composite system’s properties are stronglyinfluenced, if not dictated, by the properties ofthe preform. Much of the cost associated withthe production of a composite componentinvolves the preform’s raw material cost as wellas the labor required to manufacture the preform.A preform could be made of yarn orsingle fibers of fiberglass, aramid, carbon orceramic, with many configurations and variationsavailable. These options cover the spectrumof cost and performance from utilitarian,low cost applications to very specialized, highp e rformance applications. The compositesindustry prides itself on being able to tailor theSpotlight on Technology: Composite Preformsproperties of a component. Much of this tailorabilityis achieved by adjusting the variousparameters of the preform.The primary goal of tailoring performance isto maximize properties (usually mechanical)where they need to be maximized and to allowfor reduced properties where they might not beas critical. To accomplish this, designers canadjust a multitude of preform pro p e rt i e s .Starting with the base fiber, going on to strandcharacteristics and weave design, a huge arrayof options are possible. As with most aspects ofcomponent manufacture, composite system ornot, the cost/performance ratio is the criticaldriver in deciding what preform technology touse.continues, page 7Volume 5, Number 1Spotlight on Technology … 1Ballistic Armor: An Overview … 9Biodegradable Lubricants … 12NAMIS … 15Dr. Paul MunafoNamed Manager … 16Standard ReferenceMaterial 2100 … 16John W. Lincoln Award … 16Calendar … 17Recent US Patents … 18AMPTIAC Directory … 19MaterialEASE 13Accelerated Degradationcenter insertAMPTIAC201 Mill StreetRome, New York 13440-6916P HON E: 315.3 39.71 17FAX: 315.3 39.71 07E M A I L: a mp t i a c @ i i t ri . o rgA M P T I AC is a DoD Info rmation Analysis Center Ad m i n i s te red by the Defense Info rmation Systems Ag e n c y, Defense Te chnical Info r mation Center and Opera ted by IIT Re s e a rch Inst i t u te

fabricated on silicon wafers. The evolution picked up steamin the late 80’s when the first simple spring-supported structureswere utilized as accelerometers. This application beganto reach fruition in the early 90’s when accelerometers fabricatedin conjunction with control circuitry were integratedon a chip and batch processed as airbag initiators for theautomobile industry.Figure 2: SEM image of pressure-actuated lock from a prototype Navy safe and armingdevice. The long thin beam is a lever anchored in the background (upper left) and able tomove upward, out of plane in the foreground (lower right). Image courtesy of the WeaponsDepartment, Indian Head Division, Naval Surface Warfare Center.The current so-called “killer ap” (high growth potentialapplication) for MEMS appears to be the fiber optic switch.MEMS technology may be the best and most effective wayof switching fiber optic signals within the optical domain,eliminating the current need to convert optical signals toelectrical signals and back to optical in order to route networktraffic. This would allow increases in speed and bandwidthby eliminating the cumbersome and time-consumingprocess of converting and re-converting all signals numeroustimes during their journey.MEMS technology is finding its way into other areas outsideof your automobile and computer network. Military scientistsare working on devices to directly support thewarfighter. Examples of the technologies being examinedinclude infrared, chemical, and biological agent sensors. Alsobeing considered are MEMs for GPS mapping, radio telemetryfor identify-friend-or-foe (IFF), and smart weapons. Aneffort is currently underway to develop the capability to generatepower from a very tiny package. DARPA is fundingwork on a postage-stamp sized gas turbine intended to generateas much as 50 Watts of electricity for a week to powerall the electronic gear that the future soldier will carry intobattle.The military services are also working on applying MEMStechnology to the fuzing and safeing devices integrated intotomorrow’s weaponry. In Figure 2, a prototype MEMS safeand arming device is shown. A diaphragm is etched into theunderside of the silicon wafer, allowing pressure to push thediaphragm and lever upward to disengage a lock. The deviceis one of seven MEMS technologies that the Naval SurfaceWarfare Center, Indian Head Division is integrating onto asingle-chip MEMS safe and arming device. Smaller electronicsystems allow more volume in existing weapons for energetics(both fuel and explosives). Next generation systemsincorporating improved guidance and control circ u i t ry,smaller fuzing, and enhanced energetic solutions, will besmaller overall meaning that launch platforms may carrymore ordnance or more kinds of ordnance systems toi m p rove multi-mission deployment capability. Im p rove delectronics will assure that pinpoint accuracy and precisionwill allow weaponry to be smaller but just as, if not more,effective.MEMS may also enable better inventory control by allowingsensors to be imbedded in all types of equipment toaccount for degradation and aging of components.Additionally, inexpensive imbedded sensors may enable therange of ballistic projectile weapons to be better controlled“on-the-fly” by providing barrel and energetic material temperatureinformation to a fire control system the momentthat a round is loaded into a weapon. This way, the fire controlsystem could account for expansion of gun barrels (dueto heating during rapid firing) and adjust trajectories accordingto predicted performance of the round.In the medical sciences, MEMS may provide portable, lowcost, hand-held tools that will be able to sample and analyzetissue or blood samples quickly. There also exists the capabilitythat sensors or actuators could be implanted in the bodyto send telemetry or stimulate tissue when queried by externalsystems. For a diabetic, this could allow an implantedFigure 3: Spring supported structure utilized for testing the elastic responseof MEMS structures. For reference, the springs are about 100 microns tall and30 microns thick. Image courtesy of the Weapons Department, Indian HeadDivision, Naval Surface Warfare Center.device to monitor blood sugar levels and react on that data.Other possibilities include systems that could send signals tomuscle-stimulation implants, giving paralyzed victims limitedmuscle control. MEMS also show promise as sensingdevices to monitor exposure to potential chemical or biologicalagents during wartime.In addition to the above applications, MEMS devicesmust also be developed to test and verify the response ofMEMS components. Figure 3 shows a device used to test thecontinues, page 4The AMPTIAC Newsletter, Volume 5, Number 1 3

elastic response of MEMS structures. Here the beam visiblein the center of the structure is free to move in-planeand is supported about 4 microns off the wafer’s surface byfour folded springs.Materials ChallengesOf concern to the materials community is the simple factthat MEMS devices must do mechanical things. Microstructureslike springs, actuators, guides, gears, axles andstops behave and interact with one another in unique ways.The fundamental problem is these structures are fabricatedusing the materials and processes originally developed forelectronic devices. As such, the knowledge base on howelectronic materials behave when used for micromechanicalapplications is limited. Only recently has the communitybegun to study the necessary mechanical propertiesneeded to mature MEMS applications.Micro Materials Issues in MEMSMaterials CharacterizationThe materials routinely used to fabricate MEMS devicesare the same ones developed for use in the manufacture ofintegrated circuits. In fact, most of the organizations makingMEMS are using the “obsolete” 100mm wafer equipmentthat companies like Motorola, Texas Instruments,Intel and others have surplused to upgrade to 150 and200mm wafer equipment. This is not meant to imply thatthe equipment is sub-par in any way, just to emphasize thatthe fabrication techniques and materials used are indeed“hand-me-downs” from the IC industry.In the last thirty years, much work has been done tocharacterize the electrical and thermal properties of electronicmaterials, and how these properties interact to makereliable electrical components. Since electronic devices donot have mechanical functions, the materials used to constructthem were not well characterized at the micro-level.Now that these materials are being used to make beams,springs, gears, or wear surfaces, the knowledge base of processing-dependentmechanical properties must be developed.As a result, the materials in question are being reexaminedto develop the data necessary to address theneeds of design engineers. This work is still very much inthe early stages.Macro vs. Micro Materials PropertiesResearchers have discovered that material properties measuredat the scale of MEMS are not necessarily equal to theproperties measured for the same bulk, macro-scale materials.For instance, the Young’s Modulus of bulk nickel hasbeen measured as 207 GPa. But measurements of Young’sModulus for various nickel structures fabricated by depositionand micromachining techniques range from 150 toabout 200 GPa. This discrepancy could have drastic effectsif an engineer designs a structure in a critical device torespond to input based on the macroscopically measuredmodulus, and the structure responds in an unexpected way.Many devices are fabricated from single crystal silicon,poly-crystalline silicon (polysilicon) or thin-film, polycrystallinemetals such as aluminum, titanium, nickel andsome ferrous alloys. The mechanical properties are obviouslywell understood and characterized for single crystalsilicon, even accounting for properties dependent on crystallographicdirections. Poly-crystalline materials behave ina very different manner and their mechanical properties areusually dependent on their processing history.Some of the legacy techniques used to deposit uniformlayers of polymers, insulators (nitrides or oxides of silicon)or metals include epitaxy, sputtering, chemical vapor deposition,evaporation, spin-on methods and electroplating.All of these present unique material challenges and opportunitiesto fine-tune various aspects of material properties.Some create radially dependent microstructures, othersyield columnar or spherical microstructures. The net effectis that a material that would normally possess isotropicproperties at the macroscopic scale may indeed have localizedprocessing-related anisotropic properties.Understanding intrinsic material properties at the microscale is only part of the problem. MEMS fabrication techniquesoften utilize plasma or wet-chemical etching toremove unwanted material. These processes can lead tosurface imperfections due to damage or contaminationfrom the etchants.Grain SizeThe dimensions of some structures are often within thesame order of magnitude as the crystal grain size of thematerial used to fabricate it. For example, typical grainsizes for an electroplated nickel will be about 0.5 to 2microns and a spring found on a MEMS device may beabout 20 to 30 microns across at its smallest dimension.That spring may have only 10 to 20 grains across its width.Classical assumptions regarding grain boundaries andtheir effects on mechanical properties may not hold at themicroscale. Just consider the possibility that the height of acolumnar grain might be 1/2 to 3/4 the total thickness ofa deposited film. How this effects the structural stiffness oryield behavior of a structure fabricated in that film is notreadily understood.Properties Depend on ProcessingProcessing history, which evolves specific microstructuralcharacteristics, will have impact on the resultant physicalproperties of the material. Much of the field of materialsscience is based on the study of the processing-propertyrelationship. In MEMS, the processing techniques ofteninvolve exposure to temperature variations, chemical baths,gaseous chemicals, ultra-violet light and in some cases x-ray radiation. Incorporation of impurities into the materialsduring processing can modify their mechanical properties.With a thorough knowledge of the processing-propertieslink, this aspect may be used to the advantage of theresulting devices.Property Dependence on Storage/Environmental ExposureAgain, the materials heritage in MEMS is a legacy from theIC industry and the countless hours of research and developmentover the last four decades to tailor those materialsto stand up to the rigors of the electrical environment. Thecontinues, page 6MaterialsChallengesfor theMEMSRevolutioncontinuedfrompage 34The AMPTIAC Newsletter, Volume 5, Number 1

How to Make a MEMS Structure: The Oversimplified VersionStart with a silicon wafer. These are typically about 300 to 400 microns thick (that’s 0.3 to 0.4 mm.)The silicon wafer is then heated and reacted with a nitrogen-rich gas such that its surface gets a thinlayer of silicon nitride, typically less than one micron thick.The silicon nitride layer is then patterned.There are various ways of accomplishing this and for our purposes a simple example is used. Aphotoresist is applied over the entire surface. The resist is then exposed to radiation, typically UV,which causes it to become more soluble to an etchant in the exposed areas than in the unexposedareas. (This is said to be a “positive” resist; if the resist becomes less soluble upon exposure it iscalled a “negative” resist.) The wafer is then etched with a solvent and the areas of resist that wereexposed are removed. Then the wafer is etched with a solvent that will attack the silicon nitride. Butonly the areas that are exposed, most of it is under a coating of resist. Then the remaining photoresistis removed with some other etchant, leaving behind a patterned silicon nitride layer.In all cases, materials and solvents are chosen specifically so that the solvent etches a specificmaterial much faster than it attacks any of the other materials. In fact, most of the materials are chosenbecause they etch much faster (>10 times) in one direction than they do in any other.A sacrificial layer is applied to the entire surface. These are chosen specifically to fill all areas andform a smooth surface.The sacrificial layer is then patterned through an etching process very similar to that discussedabove.Now a structural material is applied. The material varies from process to process; sometimes it ispolycrystalline silicon, other times it is a thin polymer. And the thickness varies depending on devicebeing made. Typical devices are either a few microns thick or about 30 to 80 microns thick.The structural layer is patterned, once again using an etching process similar to that describedpreviously.The entire sacrificial layer is etched away.As a final step, a solvent is used that will etch the silicon wafer where it is exposed under the beam.The sidewalls of the etch pit are sloped because the wafer is a single crystal of silicon and it etchespreferentially down crystal faces. The depth of the pit is controlled either by etching for a specificperiod of time (silicon etch rates are well documented in various solvents for almost any temperature,)or by allowing the etch to continue until the sidewalls meet.The finished product, a singly supported beam. Or a MEMS diving board, over a very small pool.The AMPTIAC Newsletter, Volume 5, Number 1 5

challenge in MEMS is to further characterize the effects ofstorage and exposure on mechanical devices at this scale.Some of the questions that arise are:• Do the classical mechanics of annealing, recrystallizationand grain growth apply at this scale?• Will kinetic processes involving impurities (both intendedand unintended) be changed by the relative proximityof exposed surfaces in some of the very small structures?• Are contaminants from the environment more or lessaggressive due to increased free surface areas on the verytiny structures?Concerns over FrictionOne technology that has seen significant friction-relatedresearch over the past 20 years is development of the computerhard drive. This device requires a read-write head toskim about 50 nanometers (millionths of a meter) over aspinning disk and “skid” to a soft landing each time thedisk comes to a stop. The sliding action during spin-upand spin-down have been the subject of millions of dollarsin micro- and nanotribological research over the past fewdecades. This technology represents a multi-billion dollarper year industry, so it is no wonder the investment in itsimprovement has been so great.Now the study of friction, or tribology, on the microandnano-scale has extended into the arena of MEMSdevices and materials. As one can see, when a relativelynew engineering technology comes along with the capabilityto produce machines with gears, sliding contactsand rotors, all on a micro scale, it would follow that awhole new lubrication technology should be considered.When confronted with the materials and devices beingfabricated, some of the nation’s most respected researchersin the fields of micro- and nanotribology differ in theirbasic opinions on what is “good” and what is “bad” interms of friction for machines. Just the case of electroplatednickel being used as a structural material sparks controversywhen one brings up the issue of sealing a devicefrom humidity. Some say humidity will cause very highinterfacial friction between nickel parts, others believethat it would lubricate (or possibly passivate) the interface,lessening friction.Current commercial MEMS devices are mostly noncontactlight-signal interrupters or accelerometers. Butapplications for mirror devices that rotate or “tip” fromside to side (in fiber optic signal routers or display paneltechnology) are beginning to see demand. Friction, stiction(the tendency of very small parts to stick togetherthrough something similar to electro-static attraction) andwear will soon become very important issues to the micromaterialscommunity.ConclusionsMEMS devices have the potential to revolutionize the waywe currently do many things. Building upon the legacy ofelectronic device miniaturization and cost reduction, westand upon the cusp of an explosion in new applicationsfor MEMS technologies. However, much work remains.The variation of material properties away from acceptedvalues at the scale of MEMS devices is one of the fundamentalproblems to be understood. Fabricating waferscale,thin materials that may have anisotropic behaviorand then employing micromachining techniques to fashionmechanical devices results in unknowns that couldimpact device performance. Also, issues related to frictionand stiction of micro- and nano-scale materials must beaddressed fully.It is clear that more research is necessary to address theproblems now faced by MEMS designers. However, theinvestments needed to fully characterize the performanceand behavior of materials used for MEMS are warranted.Further maturation of these processing technologies anddevelopment of the associated materials knowledge willenable accurate and predictable device performance. Thisin turn will allow future applications that could have adramatic and profound influence on many facets of life. ■MaterialsChallengesfor theMEMSRevolutioncontinuedfrompage 4AMPTIAC Mailing List Updates WantedThe AMPTIAC Newsletter is currently mailed to over 23,000 customers. It is our policy to provide a free subscription toanyone who has a use for it, and to refrain from sending copies to anyone who does not want or cannot use the publication.To keep our mailing list current, we need the help of our readers. If any of the following situations apply, pleaselet us hear from you:• If you are reading a borrowed copy and would like your own free subscription, please ask for one.• If you receive the newsletter and have no use for it, please request removal from our list of subscribers.• If you are getting a copy under the wrong name or wrong address, please provide a correction.Your help in keeping our records current will be greatly appreciated. Additions, deletions and corrections may besent by e-mail to amptiac@iitri.org, telephoned to (315) 339-7092, faxed to (315) 339-7107, or mailed to AMPTIAC,201 Mill Street, Rome, NY 13440-6916. ■6The AMPTIAC Newsletter, Volume 5, Number 1

Biodegradable LubricantsThroughout the industrial age, natural resources have beenturned into products that are no longer recognizable by themicroorganisms and enzymes that convert these substances intheir natural state into their basic building blocks. For example,oil degrades when it exists in its original state but becomes hazardousonce turned into different compounds.“Degradable” entails the decomposition of a product into itsbasic components by any means. “Biodegradable” more specifically,is decomposition through biological means, and the disappearanceinto the environment without harmful effects. However,disposal of biodegradable products must be done correctly inorder for its components to properly decompose. It is importantto note that a product’s active ingredients are biodegradable whilethe inactive ingredients are not. The Federal Toxic SubstancesControl Act defines biodegradability as the breakdown of organiccompounds, both natural and synthetic, to carbon dioxide,water, the oxides or mineral salts of other elements as well asproducts associated with normal metabolic processes of microorganisms.Scientific Certification Systems (SCS) defines as“biodegradable” only the products that are entirely biodegradableunder aerobic and anaerobic conditions, into carbon dioxide,w a t e r, and minerals. Products considered “c o m p o s t a b l e ,”although similar to “biodegradable,” undergo natural degradationof their solid materials only.[1]The Resource Conservation and Recovery Act (RCRA) establishedfederal authority, through the Environmental ProtectionAgency, to control hazardous waste from “cradle to grave.” Thisincludes the generation, transportation, treatment, storage anddisposal of hazardous waste. On September 14, 1998, ExecutiveOrder 13101, “Greening the Government through Wa s t ePrevention, Recycling, and Federal Acquisition”, was signed. ThisExecutive Order is currently directing federal agencies to procurerecycled and environmentally friendly products. The DoD-issuedHazardous Waste Minimization (HAZMIN) and RCRA policiesare mandating that all DoD installations must reduce the amountof toxicity and hazardous waste generated by petroleum oil lubricant(POL) products whenever it is economically viable.[2]The US Department of Defense has used jeeps, trucks, selfpropelledartillery, bulldozers, mobile bridges, watercraft, ships,submarines, cranes, planes and tanks for decades. All these vehicleshave caused contamination due to petroleum and its relatedproducts – gasoline, diesel fuel, aviation fuel, lubricating oils andgreases – from accidental spills, improper storage of fluids, malfunctioningof equipment, failure of components, etc.[3] As aresult, the Defense Supply Center in Richmond, Virginia, whichdistributes packaged petroleum, oil and lubricant products for theDefense Department, has gathered data on industrially availablefluids and generated a catalog for environmentally safe products.“FY 99 Environmental Products Catalog” is the latest edition.Biodegradation StandardsASTM Standard D 5864-95 is a standard method for determiningaerobic aquatic biodegradation of lubricants or their components.ASTM defines biodegradation as “The process of chemicalbreakdown or transformation of a material caused by organismsor their enzymes.” Accordingly,Lubricant + O 2 + Microorganisms → CO 2 +H 2 O + More MicroorganismsASTM biodegradation testing identifies two types of test regimes:• The primary test measures only the disappearance of the originalmaterial and includes chemical changes detected by measurableproperties such as variations in the infrared (IR) band.• The ultimate test measures the percent of the material convertedto carbon dioxide and water. The oxidation of the lubricantis directly measurable through the evolution of CO 2 (or consumptionof O 2 ).The United States Air Force definition of biodegradability dividesbiodegradable materials into four classes, according to the timerequired for complete biodegradation:• Class I – 60% degradation after 28 days of testing• Class II – 40% in 28 days and 60% in 84 days• Class II – 40% in 84 days• Class IV – none of the above[4]DoD Efforts in BiodegradationThe US Navy is seeking a biodegradable fluid that is compatiblewith existing fluids, prevents corrosion due to seawater, andpreferably does not leave a sheen on the water. The Navy is alsoconcerned about possible pollution hazard from lubricants andhydraulic fluids from machinery that is susceptible to release of oiloverboard through seawater wash off, incidental leakage due todamaged seals, or discharges from failed equipment. T h ePollution Prevention and Material Safety Branch of the Navy isassessing commercially available lubricants and hydraulic fluidsthat can replace the conventional petroleum products. Theseproducts, also entitled “environmentally preferable lubricants”(EPLs), are usually made from vegetable oils such as rapeseed,corn, sunflower or soybean oil, synthetic esters, polyalkylene glycols(PAGs), or severely hydrotreated petroleum based oils. EPLsvary in their performance. For example, vegetable oil-based fluidshave good lubricity and their viscosity is less dependant on temperaturethan the petroleum oils; nevertheless, they freeze at temperatureson the order of -15°C and begin to degrade at temperaturesabove 90°C. Synthetic esters are more stable and can operatewithin a wide range of temperatures. Current fluids used aswire rope lubricants (MIL-G-18458) are petroleum-based, containlead and in one case, asphalt. Certain EPLs have been identifiedfrom a database of commercially available lubricants, builtby the Navy’s Pollution Prevention and Material Safety Branch asreplacement candidates for these lubricants. The products exceedingperformance criteria for corrosion protection, lubrication andstability will be tested by the ultimate type standard ASTM aquaticbiodegradation and toxicity tests.[5]The Fuels and Lubricants Technology Team of the Army Ta n k -Au t o m o t i ve Re s e a rch, De velopment, and Engineering Centers(TARDEC) is developing two parallel programs: (1) hyd r a u l i cfluid re c ycling, and (2) development of environmentally safeh ydraulic fluids and greases. Ac c o rd i n g l y, the Army is using inaddition to ASTM D5864-95 method, a recently deve l o p e dASTM test called St a n d a rd Classification for Hydraulic Fluids forEn v i ronmental Impact (ASTM D6046-98a). These test methodswe re developed by the ASTM D-12 Subcommittee onEn v i ronmental St a n d a rd of Lubricants. This organization hasd e veloped new biodegradation test methods based on acute tox i c-ity tests established by the Organization for Economic Co-12The AMPTIAC Newsletter, Volume 5, Number 1

Operation and De velopment (OECD). The Army initiallyfocused on hydraulic fluids, the rationale being that the technologywould be applicable also to grease. Twenty-six biodegradablefluids, mostly designated as industrial hydraulic fluids, we re studiedand evaluated against MIL-H-46001, the military’s own industrialfluid specification.[3] The re q u i rement for biodegradablefluids that could function within military specs, made it necessaryto put together additional evaluations against MIL-PRF-6083 andMIL-H-46170, two military hydraulic fluids used in tanks andother armored vehicles and equipment. The initial re q u i re m e n t simposed on biodegradable hydraulic fluids included:• A wide temperature range (-54°C to 125°C)• Ability to protect against wear, corrosion, and cope withheavy weight• Compatibility with elastomers• High temperature oxidation stability• Low volatility• High biodegradability.These preliminary tests resulted in the formulationof 11 fluids that were tested against rigorousmilitary specifications. Five hydraulic fluids, four ofthem being vegetable fluids such as rapeseed andsoybean, and one of them a synthetic polyester type,were ultimately selected for field demonstration,based on their performance in laboratory testing.The next step – formulation of biodegradablelubricating greases or BLGs for the Army – proved a much hardertask. An Army biodegradable grease has to perform in accordancewith MIL-G-10924F Grease, Automotive and Artillery(also known as “GAA”), a grease required for all Army groundvehicles and equipment. It is important to note that GAA hasbeen replaced by MIL-PRF-10924G, which carries the new designationfor specification purposes.Major problems with the development of BLG products stemfrom the lack of criteria that would accurately define biodegradabilityand lubrication properties. Also, the difficulty with liquefyinggreases impedes the re-cycling of these materials. For thatreason, most military greases do not meet the DoD HAZMINgoals. Extensive research to generate greases with quantifiablebiodegradability and lubrication properties has been conducted asa result of new DoD requirements.[6][7][8]The original MIL-G-10924 greases consist of a blend of 65%in weight Polyalphaolefin (PAO), 10% petroleum oil, 15% oflithium-complex thickener, and 10% additives. MIL-G-10924greases can operate within a wide temperature range (-54°C to180°C), have excellent water, storage, shear and oxidation stability,possess good anti-wear and load-carrying capacity, and offeradequate saltwater corrosion protection, but have low biodegradability.[2]Table 1 tabulates the three BLGs that were formulatedwith a grease manufacturer. BLG-1 and BLG-2 were formulatedon the basis of the nonbiodegradable MIL-G-10924F grease specifications,while BLG-3 has been produced from a low viscosityblend of ester oils. Each grease contained 15% lithium complexthickener and 10% other additives.Examination of biodegradability for the three BLGs, using MIL-G-10924F as a base grease shows that the 28 days biodegradabilitya c c o rding to OECD Modified Sturn Test (that defines biodegradationas the maximum carbon conversion or carbon dioxide generationunder we l l - c o n t rolled conditions for a period of 28 days)ranges from 28% for MIL-G-10924F grease to 64% for BLG - 3 .The test results indicate that a small amount of biodegradabilityi m p rover (in this case, rapeseed oil) may significantly improve thebiodegradability of the lubricating grease. This is attributable to thefact that bacteria like to eat natural ester flavo r.Military greases, as a whole, are designed for open lubricationsystems such as automobile wheel bearings, chassis systems, gearboxes,etc. Experimental BLG greases considered by the Armyhave to respond to the aforesaid applications. Table 2 tabulatesthe test protocols and data obtained from testing performancecharacteristics of BLG.So far, results indicate that hydraulic fluids and greases can satisfyenvironmental requirements and meet military specifications.Due to initial success in tests of biodegradable replacements forcurrent fluids such as GAA greases and MIL-H-46170 (FRH)Composition* MIL-G-10924F BLG-1 BLG-2 BLG-3Base oil 75% PAO + 65% PAO 55% PAO 75% Polyol ester +MineralDiester + PAOBiodegradation None 10% 20% Noneimprover(rapeseed oil)*All compositions contain 15% lithium complex thickener and 10% other additivesTable 1: Experimental biodegradable lubricating greases (BLG)[2]hydraulics, military performance specifications will be developedin the near future to cover the biodegradable lubricating greasesand biodegradable hydraulic fluids.It is worth mentioning that in addition to producing biodegradablefluids as replacement for the current fluids, the US Army, incooperation with the industry is developing a method for re - c yc l i n gh ydraulic fluids.[9][10] The Army has entered into CooperativeRe s e a rch & De velopment Agreements (CRDAs) with commerc i a lcompanies that manufacture certified equipment to re c yc l eh ydraulic oils. As a result of these agreements, industry has deve l-oped technologies that automate the process of on-site re c ycling offluids. The methodology is based on re m oval of contaminants fro mthe fluids and revitalization of fluid additives. Implementation ofh ydraulic fluid re c ycling will enable the US military to meet pollutionpre vention re q u i rements, conserve natural re s o u rces, andreduce cost. For example, disposal cost for MIL-H-46170 (FRH)can escalate to $3.00 per gallon depending on site conditions, fluidcontamination, and availability of work f o rc e .ConclusionThe need for biodegradable fluids and nontoxic lubricants inenvironmentally sensitive areas has been recognized in Europe.Certain European countries have adopted rapeseed oil lubricantsto substitute for mineral oil-based hydraulic fluids. In the UnitedStates, new regulations will be forthcoming in the next few years,to substitute lubricants with soybean-based lubricants.Nevertheless, problems related to lack of thermal, hydrolytic andoxidation stability of these fluids will have to be addressed.Lubricants made from rapeseed oil have been used in Europesince the beginning of the 1980s. Rapeseed oil has better stabilitythan soybean oil but in the United States soybean oil is muchless expensive and more likely to win acceptance.continues, page 14The AMPTIAC Newsletter, Volume 5, Number 1 13

Test method Target requirement Rapeseed BLG BLG-3 MIL-10924F (GAA)Dropping point, °C ASTM D2265 240 (minutes) 178 272 278Worked penetration (1/10) mm ASTM D217 265-295 250 289 282Work stability, 100,000 strokes ASTM D217 -25 to 60 > 61 > 32 > 18Roll stability ASTM D1831 -25 to 60 > 22 > 15 > 9Evaporation loss (in % at 180°C, for 1 hr) TGA 15, max 2.67 12.1 25.0Oil separation (in %) FED.791.321 10, max 2.5 2.79 1.6Centrifuge, oil separation (in %, 2 hrs at 40°C) Mod, ASTM D4425 18, max 3.8 17.2 8.8Four ball EP, Load Wear Index (LWI), in kgf ASTM D2596 30 minutes 27 38.5 42.2Four ball wear scar diameter, mm ASTM D2264 0.6 max. 0.58 0.53 0.48Copper corrosion ASTM D4048 1b 1b 1a 1bWater stability, (1/10) mm Mod. ASTM D217 -25 to 60 > 100 -8 > 41Saltwater corrosion, 1% NaCl Mod. ASTM D1743 No corrosion Medium corrosion No corrosion No corrosionLow temperature torque (-54°C), Nm Army method Breakaway: 7 31.6 (B) 3.1 (B) 4.2 (B)Running at 4.63 (R) 1.5 (R) 2.2 (R)5min: 5, maxPDSC*, min ASTM D5483 10, min 14.3 (155°C) 23.6 (210°C) 12.9 (210°C)Elastomer compatibility, % ASTM D4289 10, max ND** ND NDBiodegradability, % ASTM D5864 60, min 48.9 64 28Toxicity OECD >1000 ND ND NDGrease life, min, hr ASTM D3527 100, min 30 100 130*Pressure Differential Scanning Calorimeter, **Not DeterminedTable 2: Laboratory test results for biodegradable greases[2]Various attempts to establish standards for the behavior ofbiodegradable fluids are under way. ASTM has developed aprocedure to measure biodegradability of lubricants (StandardBiodegradation of Lubricants or their Components, ASTMD5864-95). Accordingly, a product is labeled as biodegradableif at least 60% of the material is converted to carbon dioxidewithin 28 days under the prescribed test conditions. TheASTM biodegradability test entitled Standard Classificationfor Hydraulic Fluids for En v i ronmental Impact (ASTMD6046-98a) provides criteria for assessing potential toxicity.The US Army has adopted both ASTM tests for determiningthe level of safety in using lubricants.The US Navy is participating in a Phase II SBIR to determineif the fluids developed in a Phase I SBIR monitored bythe Air Force, would be beneficial for submarine externalhydraulic systems. The Navy requires a fluid that would notdegrade easily in the presence of seawater and would not causevalve sticking or affect acoustic properties. Other biodegradabilityprograms with potential applications for the Navyinclude NAWCAD Lakehurst working with Union Carbideand the Applied Research Laboratory at Penn State Universityto develop a lubricant based on polyalkylene glycols. NAVSEAis evaluating a Union Carbide hydraulic fluid with water,diethylene glycol, and polyalkylene glycols (PAGs) inhydraulic power units for diver tools.[5]All branches of the US Military are searching for directreplacement of present lubricants in order to meet biodegradabilityand performance requirements. Recycling programs toreduce pollution from lubricants may provide further solutionsto increasingly stringent regulations.References[1]Degradable, Biodegradable, Photodegradable, Compostable,http://www.gsgs.com/enviro/envirospeak/degrade.html[2]In- Sik Rhee (US Army Ta n k - Au t o m o t i ve Re s e a rc h ,Development, and Engineering Center), 21st Century MilitaryBiodegradable Greases, Presented at the National LubricatingGrease Institute (NLGI) 66th Annual Meeting, October,1999, Tucson, Arizona[3]In-Sik Rhee, LePera, M.E., Promoting a Greener Army,Lubes & Greases, Vol. 6 Issue 9, August 1999, pp. 16-19[4]METSS Corporation, Biodegradable, Direct ReplacementHydraulic Fluids for MIL-H-5606 and MIL-H-8382, SBIRAF96-161, Military Aerospace Hydraulic Fluids WorkshopProceedings, August 2000[5] Klinkhammer, M.D., Assessing Environmentally FriendlyLubricants for Shipboard Use, http://www.dt.navy.mil/mz/lubes.html, August 1997[6] Ei c h e n b e r g e r, H.F., Bi o d e g radable Hyd raulic Lu b r i c a n t sand Overview of Current Developments in Central Europe, 42ndAnnual SAE Earthmoving Industry Conference, SAE PaperSeries No. 910962, April 1991[7]Wain, J., The Development of Environmentally AcceptableHydraulic Oil Formulations, 42nd Annual SAE EarthmovingIndustry Conference, SAE Paper Series No. 910965, April1991[8]Sukys, D., Camino, C., Natural Ester Biodegradable Fluidsand Lubrication Trends for the Future, Journal of NationalLubricating Grease Institute, Vol. 58, No. 6, pp. 23-25, 1994[9]Mowery, R.B., (US Army Tank Automotive & ArmamentsCommand, Wa r ren, MI 48937-5000), Hydraulic Oi lRe c ycling, http://aec.army. m i l : 8080 / p ro d / u s a e c / e t / p p /fluidrec.htm[10 ] Pu rd y, E.M., Us e r’s Guide for Re c ycling Mi l i t a ryHydraulic Fluid, October 1996 ■BiodegradableLubricantscontinuedfrompage 1314The AMPTIAC Newsletter, Volume 5, Number 1

NAMISNational Materials Information SystemThe Defi n i t i ve Source for Mate rials Re l a ted informion and te ch n o l o g yThis article is the first of a series discussing one of AMPTIAC’snewest and more innovative offerings to the materials community;the National Materials Information System, or NAMIS.The first of its kind, NAMIS is a fully interactive web-basedinformation system exclusively devoted to the material needs ofthe DOD and its extended community. This initial installmentof ‘News from NAMIS’ provides an overview of the system, itsfunctions, and current features. Future installments in laterissues of the AMPTIAC Newsletter will cover the specifics ofthe individual databases resident within NAMIS.What is NAMIS?In 1998, AMPTIAC began a major technology initiative toconceive and build the definitive materials information systemto support the DoD. T h eNAMIS program is an effort tod e velop and field a secureinformation system for use bydesign engineers and materialsp rofessionals invo l ved withmaterials development andselection for defense systems.NAMIS is a strategic longtermproject to develop apanoramic, web-based databasesystem replete with materials information of the highestintegrity and utility. The information contained in this systemincludes numerical material properties, graphical information,conference proceedings, and several ‘Virtual Libraries’ (see figure),covering the spectrum of materials to include metals,ceramics, electro-optical materials, organics, and special functionmaterials. The architecture of NAMIS is modular, beingcomprised of a central web/user interface, with data sets residingin a series of data modules.Conference& WorkshopModules• Proceedings• Index of Papers(including citations)• Keyword Search• Individual Full-textPapersUserInterfaceMaterialPropertyDatabaseModules• Material ID• Material Properities• Data QualityIndicators• Data Sources• Reference CitationsNAMIS General ArchitectureOn-Line HelpUtilityVirtualLibraryModules• Bibliographic dB• Graphical Data• Data Sources• Electronic SourceDocumentation• Full-text TechnicalReportsWhat is available on NAMIS?NAMIS is a growing information system, with new modulescoming online periodically. A listing of currently availablemodules can be seen below.How do I access NAMIS?NAMIS may be accessedat http://namis.iitri.org. Most papersand citations may bedownloaded by author i zed subscribers.The open pages of thesite are available to the generalpublic. Examples of suchinformation are confere n c epoints of contact, meetinglocations, agendas, etc. Accessto data and papers is limited to authorized subscribers.Subscriptions are on an annual basis. Information on subscribingis available on the NAMIS home page. ■Conferences & WorkshopsHIGH TEMPLEThe complete proceedings of the 20+ yearhistory of the Joint DoD/NASA conference onhigh temperature polymersMaterial Property DatabasesIR Windows & DomesA numeric properties database of materialsfor Infrared Sensor Window and DomeApplicationsVirtual LibrariesNASPA database containing 430 full-text documentswritten in support of the National AerospacePlane (NASP) Program.EWSA complete compilation of the biennialproceedings of the DoD ElectromagneticWindows SymposiumIHPTETA database containing full-text documents of 55reports written in support of the Integrated HighPerformance Turbine Engine Technology ProgramASIPA compilation of the proceedings of the annualconference of the Aircraft Structural IntegrityProgramNew modules are being developed in each area.The AMPTIAC Newsletter, Volume 5, Number 1 15

Dr. Paul Munafo Named Manager Of NASA Program To Develop New Space MaterialsDr. Paul Munafo has been appointed manager of the MaterialsProcesses and Manufacturing Department in the EngineeringDi rectorate at NASA’s Marshall Space Flight Center inHuntsville, Alabama.In his new position, Munafo supervises approximately 550scientists, technicians and support personnel responsible fordeveloping new materials and manufacturing techniques used inthe design of spacecraft and payloads for launch into space.Munafo joined the Marshall Center in 1975 as a materialsresearch engineer. He is a three-time recipient of the NASAExceptional Achievement Medal as well as numerous otherNASA awards and commendations.Among his accomplishments in the Materials Processes andManufacturing Department, Munafo helped develop a metalwith the unique and valuable property of being stronger whenhot than when cold. It plays a vital role in the Space Shuttle primaryrocket engines. Other projects his department has workedon include development of ball bearings that are 30 percentlighter than steel but 40 percent stronger; and perfecting frictionstir welding — a process that allows metals to be joined togetherin a stronger bond than with conventional fusion welding.A native of Boston, Massachusetts, Munafo graduated fromBoston Technical High School in 1957. He earned a bachelor’sd e g ree in mechanical engineering from the Ma s s a c h u s e t t sInstitute of Technology in Cambridge in 1962, and a master’sdegree in mechanical engineering from Tulane University in NewOrleans in1971. Munafo later earned a doctorate degree in materialsscience from Auburn University in Auburn, Alabama. ■Standard Reference Material 2100: Fracture Toughness of CeramicsA new Standard Reference Material (SRM) is now available fromthe National Institute of Standards and Technology for fracturetoughness of ceramics. It is the first reference material in theworld for any class material for the fracture toughness property.The SRM may be used to verify fracture toughness testing proceduresand complements the new American Society for Testingand Materials (ASTM) Standard Test Method C 1421-99 as wellas two International Organization for Standards (ISO) standardsnow under development. This SRM, for which the fracturetoughness (K c = 4.57 MPa√m) is known with a high accuracyand precision, should dramatically improve fracture toughnesstesting of brittle materials.SRM 2100 consists of five hot-pressed silicon nitride flexurespecimens cut from a single master billet. The SRM may be usedwith any credible fracture toughness test method, but has beenoptimized for beam bending type tests. ASTM C 1421 featuresthree such tests: the surface crack in flexure (SCF), precrackedbeam (PB) {also known as single-edged precracked beam(SEPB)}, and chevron notch in bending (CNB) methods. TheSRM specimens are common 3 mm x 4 mm x 47 mm bend barsthat must be precracked by the users.For more information, contact Mr. George Quinn, CeramicsDivision, NIST, Gaithersburg, MD 20899, geoq@nist.gov, or theSRM program office: telephone 301 975 6776, or visit the SRMWebsite: ois.nist.gov/srmcatalog. ■John W. Lincoln Award PresentedDr. Alten F. Grandt Jr., Raisbeck Engineering DistinguishedProfessor of Engineering and Technology Integration at theSchool of Aeronautics and Astronautics at Purdue Universtity,West Lafayette, Indiana was presented the 2000 John W. LincolnAward. It was given in recognition of his outstanding work overmany years in advancing the technology of fatigue and fracturemechanics and applying it to aircraft structural integrity. TheAward was presented at the 2000 USAF Aircraft StructuralIntegrity Program (ASIP) Conference in San Antonio, Texas on5 December 2000. The Award, which consists of a gold medaland a certificate of recognition, was named in honor of Dr. JohnW. (Jack) Lincoln of the USAF Aeronautical Systems Center,Wright-Patterson Air Force Base, Ohio. Dr. Lincoln is a pioneerand major contributor to the development and application ofdurability and damage tolerance technology to insure the safetyand longevity of aircraft. The Award has been presented previouslyto Dr. Lincoln (1996), to Mr. Charles Tiffany (1997), toMr. Thomas Swift (1998) and to Professor Jaap Schijve (1999).A plaque with the names of the recipients is on display at Wright-Patterson Air Force Base, Ohio. ■16The AMPTIAC Newsletter, Volume 5, Number 1

Mark Your CalendarNortheast Regional Mtg. onOptoelectronics, Photonic, & ImagingApril 10 – 11, 2001Rochester, NYContact: A. MitchellSPIEPO Box 10Bellingham, WA 98227-0010 USAPhone: (360) 676-3290Fax: (360) 647-1445Email: alexm@spie.orgWeb Link: www.spie.org23rd Intl. High Technology Safety,Industrial Hygiene & Environ SympApril 10 – 13, 2001New Orleans, LASemiconductor Safety Association1313 Dolley Madison Blvd, Ste. 402McLean, VA 22101 USAPhone: (703) 790-1745Fax: (703) 790-2672Email: SSA@BurkInc.comWeb Link: www.semiconductorsafety.orgWindow & Dome Technologies &Materials VIIApril 16 – 20, 2001Orlando, FLSPIEPO Box 10Bellingham, WA 98225 USAPhone: (360) 676-3290Fax: (360) 647-1445Email: spie@spie.orgWeb Link: www.spie.org2001 MRS Spring MeetingApril 16 – 20, 2001San Francisco, CAMaterials Research Society506 Keystone DriveWarrendale, PA 15086-7573 USAPhone: (724) 779-3003Fax: (724) 779-8313Email: info@mrs.orgWeb Link: www.mrs.org.MRSIMAPS Advanced Technology Workshopon Thermal Mgmt. for High PerformanceComputing & ApplicationsApril 20 – 21, 2001Palo Alto, CAIntl. Microelectronics & Pkgng. Society1850 Centennial Park Dr, Ste. 105Reston, VA 20191-1517 USAPhone: (703)-758-1060Fax: (703) 758-1066Email: imaps@imaps.orgWeb Link: www.imaps.org103rd Annual Mtg. of the AmericanCeramic Soc (AcerS)April 22 – 25, 2001Indianapolis, INAmerican Ceramic SocietyPO Box 6136Westerville, OH 43086-6136 USAPhone: (614) 794-5890Fax: (614) 899-6109Email: customersrvc@acers.orgWeb Link: www.ceramics.org27th Annual Mtg. of the Societyfor BiomaterialsApril 24 – 29, 2001St. Paul, MNSociety for Biomaterials13355 10th Ave North, Ste. 108Minneapolis, MN 55441-5510 USAPhone: (763) 543-0908Fax: (763) 545-0335Web Link: www.biomaterials.orgSAMPE 2001 Symp. & ExhibitionMay 6 – 10, 2001Long Beach CASAMPE IBOPO Box 2459Covina, CA 91722-8459 USAPhone: (626) 331-0616 x 610Fax: (626) 332-8929Email: sampereg@aol.comWeb Link: www.sampe.orgSociety of Tribologists & LubricationEngineers’ 2001 Annual Mtg.May 20 – 24, 2001Orlando, FLSTLE840 Busse HighwayPark Ridge, IL 60068-2376 USAPhone: (847) 825-5536Fax: (847) 825-1456Email: information@stle.orgWeb Link: www.stle.orgIntl Thermal Spray Conf. & Expo(ITSC)May 28 – 30, 2001SingaporeContact: Lana ShapowalASM International9639 Kinsman RoadMaterials Park, OH 44073 USAPhone: (440) 338-5151Fax: (440) 338-4634Email: lshapowa@asminternational.orgWeb Link: www.asm-intl.org75th Colloid & Surface ScienceSymposiumJune 10 – 13, 2001Pittsburgh, PAContact: S. GaroffCarnegie Mellon UniversityPhone: (412) 268-6877Fax: (412) 681-0648Email: sg2e@andrew.cmu.eduWeb Link: colloids2001.cheme.cmu.edu12th AeroMat Conf. & Expo(AeroMat 2001)June 11 – 14, 2001Long Beach, CAASM International9639 Kinsman RoadMaterials Park, OH 44073-0002 USAPhone: (400) 338-5151 x 590Fax: (440) 338-4634Email: lshapowa@asminternational.orgWeb Link: www.asm-intl.orgFifth Intl Special Emphasis Symp onSuperalloys 718, 625, 706 & DerivativesJune 17 – 20, 2001Pittsburgh, PATMS184 Thorn Hill RoadWarrendale, PA 15086 USAPhone: (724) 776-9000Fax: (724) 776-3770Email: weissp@tms.orgWeb Link: www.tms.org/cmsNatl. Space & Missile Mtls Symp 2001:A Materials Odyssey from Laboratory toSpaceJune 24 – 28, 2001Monterey, CAAnteon Corporation5100 Springfield St, Ste. 509Dayton, OH 45431Phone: (937) 254-7950Fax: (937) 253-2296Email: tcrews@anteon.comWeb Link: www.usasymposium.com59th Annual Device Research ConferenceJune 25 – 27, 2001Notre Dame INContact: Beate HelselTMS184 Thorn Hill RoadWarrendale, PA 15086-7514 USAPhone: (724) 776-9000Fax: (724) 776-3770Email: tmsgeneral@tms.orgWeb Link: www.tms.orgThe AMPTIAC Newsletter, Volume 5, Number 1 17

Recent US PatentsPatent. No. Title5,537,083 Microelectromechanical Signal Processors5,563,343 Microelectromechanical Lateral Accelerometer5,589,082 Microelectromechanical Signal Processor Fabrication5,589,274 Thermal Control Coating5,594,331 Microelectromechanical Powerline Monitoring Apparatus5,610,335 Microelectromechanical Lateral Accelerometer5,617,020 Microelectromechanical-Based Power Meter5,673,139 Microelectromechanical Television Scanning Device andMethod for Making the Same5,696,312 Accelerated Impact Testing Apparatus5,696,491 Self-Excited Microelectromechanical Device5,717,631 Microelectromechanical Structure And Process Of Making Same5,729,075 Tuneable Microelectromechanical System Resonator5,739,411 Accelerated Impact Testing Apparatus5,757,319 Ultrabroadband, Adaptive Phased Array Antenna SystemsUsing Microelectromechanical Electromagnetic Components5,770,269 Thermal Control Coating5,786,621 Microelectromechanical Integrated Microloading Device5,798,283 Method for Integrating Microelectromechanical Devices withElectronic Circuitry5,808,527 Tunable Microwave Network Using MicroelectromechanicalSwitches5,818,599 Apparatus and Method for Accelerated Testing of Materials5,824,910 Miniature Hydrostat Fabricated Using MultipleMicroelectromechanical Processes5,867,297 Apparatus and Method for Optical Scanning with anOscillatory Microelectromechanical System5,867,302 Bistable Microelectromechanical Actuator5,876,856 Article Having A High-Temperature Thermal Control Coating5,880,921 Monolithically Integrated Switched Capacitor Bank UsingMicro Electro Mechanical System (MEMS) Technology5,884,868 Radiator Using Thermal Control Coating5,903,099 Fabrication System, Method and Apparatus forMicroelectromechanical Devices5,905,007 Method for Aligning and Forming MicroelectromechanicalSystems (MEMS) Contour Surfaces5,909,078 Thermal Arched Beam Microelectromechanical Actuators5,914,801 Microelectromechanical Devices Including Rotating PlatesAnd Related Methods5,919,548 Chemical-Mechanical Polishing of RecessedMicroelectromechanical Devices5,920,417 Microelectromechanical Television Scanning Device andMethod for Making the Same5,923,995 Methods and Apparatuses for Singulation ofMicroelectromechanical Systems5,925,822 Microelectromechanical Cantilever Acoustic Sensor5,927,325 Microelectromechanical Machined Array Valve5,946,176 Electrostatic Discharge Protection UtilizingMicroelectromechanical SwitchPatent. No. Title5,955,817 Thermal Arched Beam Microelectromechanical Switching Array5,959,376 Microelectromechanical Reciprocating-Tooth Indexing Apparatus5,959,516 Tunable-Trimmable Micro Electro Mechanical System (MEMS)Capacitor5,962,949 Microelectromechanical Positioning Apparatus5,963,788 Method for Integrating Microelectromechanical Devices withElectronic Circuitry5,967,660 Accelerated Thermal Fatigue Testing Of Engine CombustionChambers5,970,315 Microelectromechanical Structure And Process Of Making Same5,994,696 MEMS Electrospray Nozzle for Mass Spectroscopy5,994,801 Microelectromechanical Gyroscope5,994,816 Thermal Arched Beam Microelectromechanical Devices andAssociated Fabrication Methods6,035,714 Microelectromechanical Capacitive Accelerometer And MethodOf Making Same6,041,600 Utilization of Quantum Wires in MEMS Actuators6,054,745 Nonvolatile Memory Cell Using Microelectromechanical Device6,060,895 Wafer Level Dielectric Test Structure and Related Method forAccelerated Endurance Testing6,071,819 Flexible Skin Incorporating MEMS Technology6,073,500 Ultra-Accelerated Natural Sunlight Exposure Testing6,082,208 Method for Fabricating Five-Level MicroelectromechanicalStructures and Microelectromechanical Transmission Formed6,087,638 Corrugated MEMS Heater Structure6,087,747 Microelectromechanical Beam for Allowing A Plate to Rotate InRelation To A Frame in A Microelectromechanical Device6,089,534 Fast Variable Flow Microelectromechanical Valves6,094,102 Frequency Synthesizer Using Micro Electro Mechanical Systems(MEMS) Technology And Method6,114,794 Thermal Arched Beam Microelectromechanical Valve6,124,650 Non-Volatile MEMS Micro-Relays Using Magnetic Actuators6,124,663 Fiber Optic Connector Having A MicroelectromechanicalPositioning Apparatus and An Associated Fabrication Method6,126,311 Dew Point Sensor Using MEMS6,128,961 Micro-Electro-Mechanics Systems (MEMS)6,134,042 Reflective MEMS Actuator with A Laser6,135,043 Silicon MEMS-Based Polymer Ejector for Drag Reduction ofUndersea Vehicles6,137,206 Microelectromechanical Rotary Structures6,140,646 Direct View Infrared MEMS Structure6,143,997 Low Actuation Voltage Microelectromechanical Device andMethod of Manufacture6,146,227 Method for Manufacturing Carbon Nanotubes as FunctionalElements of MEMS Devices6,155,490 Microelectromechanical Systems Scanning Mirror For A LaserScanner6,156,652 Post-Process Metallization Interconnects for MicroelectromechanicalSystems ■AMPTIAC Wants Your ContributionsWe hope you find this issue of the AMPTIAC Newsletter useful and interesting. You can help us to better serve you by yourcontributions, such as:• Your comments on what you liked and disliked about the Newsletter• Your suggestions for AMPTIAC data products and services• Technical articles, opinion pieces, tutorials, news releases or letters to the Editor for publication in the newsletterTo contact AMPTIAC, use any of the ways listed on the back cover, or use the feedback form on the AMPTIAC webpage.Your contributions are always welcome.18The AMPTIAC Newsletter, Volume 5, Number 1

AMPTIAC DirectoryG ove rnment Pe rs o n n e lTE CH N I CA L MA NAG E R/ COT RDr. Lewis E. Sloter IIStaff Specialist, Materials & StructuresODUSD(S&T)/Weapons Systems1777 North Kent Street, Suite 9030Arlington, VA 22209-2110(703) 588-7418, Fax: (703) 588-7560Email: sloterle@acq.osd.milAS S O C I AT E COT RSCERAMICS, CERAMIC COMPOSITESDr. S. Carlos SandayNaval Research Laboratory4555 Overlook Ave, S.W. Code 6303Washington, DC 20375-5343(202) 767-2264, Fax: (202) 404-8009Email: sanday@anvil.nrl.navy.milORG A N I C ST RU C T U R A L MAT E R I A L S& ORG A N I C MAT R I X CO M P O S I T E SRoger GriswoldDivision ChiefUS Air ForceAFRL/MLS2179 Twelfth Street, Bldg 652Wright-Patterson AFB, OH 45433-7702(937) 656-6052Email: Griswold@wpafb.af.milME TA L S, ME TA L MAT R I X CO M P O S I T E SDr. Joe WellsArmy Research LaboratoryWeapons & Materials Research DirectorateAMSRL-WM-MC (@CNR Site)APG, MD 21005-5069(410) 306-0752, Fax: (410) 306-0736Email: jwells@arl.milELECTRONICS, ELECTRO-OPTICS,PHOTONICSRobert L. DenisonAFRL/MLPO, Bldg 6513005 P Street, STE 6Wright-Patterson AFB, OH 45433-7707(937) 255-4474 x3250, Fax: (937) 255-4913Email: Robert.Denison@afrl.af.milENVIRONMENTAL PROTECTION& SPECIAL FUNCTION MATERIALSDr. James MurdayNaval Research Laboratory4555 Overlook Ave, S.W. Code 6100Washington, DC 20375-5320(202) 767-3026, Fax: (202) 404-7139Email: murday@ccf.nrl.navy.milDE F E N S E TE C H N I C A L IN F O R M AT I O NCE N T E R (DTIC) POCMelinda Rozga, DTIC-AI8725 John J. Kingman Road, Suite 0944Ft. Belvoir, VA 22060-6218(703) 767-9120, Fax: (703) 767-9119Email: mrozga@dtic.milIITRI Pe rs o n n e lDI R E C TO R, AMPTIACDavid Rose201 Mill StreetRome, NY 13440-6916(315) 339-7023Fax: (315) 339-7107Email: drose@iitri.orgDE P U T Y DI R E C TO R, AMPTIACChristian Grethlein, P.E.201 Mill StreetRome, NY 13440-6916(315) 339-7009Fax: (315) 339-7107Email: cgrethlein@iitri.orgTE CH N I CA L DI R E C TO R SMETALS, ALLOYS, METAL MATRIXCOMPOSITES (ACTING)Edward J. Vesely215 Wynn Drive, Suite 101Huntsville, AL 35805(256) 382-4778Fax: (256) 382-4701Email: evesely@iitri.orgCERAMICS, CERAMIC MATRIX COMPOSITESDr. Lynn Neergaard215 Wynn Drive, Suite 101Huntsville, AL 35805(256) 382-4773Fax: (256) 382-4701Email: lneergaard@iitri.orgTechnical Inquiry ServiceORGANIC STRUCTURA L MAT E R I A L S& ORGANIC MATRIX COMPOSITESJeffrey Guthrie201 Mill StreetRome, NY 13440-6916(315) 339-7058Fax: (315) 339-7107Email: jguthrie@iitri.orgELECTRONICS, ELECTRO-OPTICS,PHOTONICSKent Kogler3160 Presidential DriveFairborn, OH 45433(937) 431-9322Fax: (937) 431-9325Email: kkogler@iitri.orgENVIRONMENTAL PROTECTION & SPECIALFUNCTION MATERIALS (ACTING)Bruce E. Schulte1901 N Beauregard Street, Suite 400Alexandria, VA 22311(703) 382-4778Fax: (703) 998-1648Email: bschulte@iitri.orgReaders of the AMPTIAC Newsletter may not be fully aware of the inquiryservice available to them through the Advanced Materials and ProcessesTechnology Information Analysis Center.A real benefit that is derived from any Information Analysis Center is that ofbeing able to obtain authoritative rapid response to one’s urgent technicalrequests. Because AMPTIAC operates as a full-service center within thestructure of IIT Research Institute, it is able to draw upon the expertise ofa large research organization to provide users of the inquiry service withpertinent information on metals, ceramics, polymers, electronic, optical andphotonic materials technologies, environmental protection, and specialfunction materials, including properties, process information, applications,environmental effects and life extension.The AMPTIAC technical inquiry service is offered free of charge for the firsteight hours of service. AMPTIAC will use all available resources, includingPh.D. level staff members, to ensure that our support is adequate to addressyour needs. Requests that may require additional time are charged toreflect the amount of effort and level of expertise required to provide auseful answer. Under no circumstance will a user be charged for serviceswithout a prior agreement to do so.AMPTIAC’s inquiry service could help save time and money. For moreinformation, contact AMPTIAC by any of the means listed on the backcover of this newsletter.The AMPTIAC Newsletter, Volume 5, Number 1 19

AMPTIACA D VA N C E D M A T E R I A L S A N D P R O C E S S E S T E C H N O L O G YInside this Issue …Materials Challengesfor the MEMS RevolutionSpotlight on Technology:Composite PreformsBallistic Armor: An OverviewBiodegradable LubricantsNAMISAnd more …Please, if you wish tocontact us you may do so at…P HON E: 3 1 5. 3 39 .7 117A D VA N C E D M A T E R I A L S A N D P R O C E S S E S T E C H N O L O G YFA X: 3 15. 3 3 9. 7 10 7E M A I L : a mp t i a c @ i i t ri . o rgh t t p : / / a mp t i a c . i i t ri . o rgA M P T I AC is a DoD Info rmation Analysis Center Ad m i n i ste red by the Defense Info rmation Systems Age n c y, Defense Te chnical Info r mation Center and Opera ted by IIT Re s e a rch Inst i t u t eII T R es e a rc h In s t it u te / AM P TI AC2 0 1 M i ll S tr ee tR o m e, NY 1 3 44 0 -6 9 16Non-Profit OrganizationUS Postage PaidUtica, NYPermit No. 566