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Chip Resistor Surface MountPackingProduct specification47LEADER/TRAILER TAPE SPECIFICATIONtrailer endempty compartmentswith cover tape(min. 200 mm)leader endcover tape onlytrailer (max. 260 mm)leader ≥ 350 mmCCB325Fig. 3 Leader/trailer tapeTAPING REQUIREMENTS•Resistance side faces up.•Component is free and not sticking to top and/or bottom tape.•Component should be easy to remove from carrier tape and the chip cavity should have no mechanicaldamage.PEEL-OFF FORCEPeel-off forces of both paper/PE and embossed/blister tapes are in accordance with “IEC 60286-3”; that is, at apeel-off speed of 300 ±10 mm/minute, 0.1 N to 1.0 N for 8 mm tape and 0.1 N to 1.3 N for tape larger than 8mm. The peel-off angle should be between 165° and 180°.peeling direction10°top cover tapecarrier tapeCCB289Fig. 4 Peel-off forceJan 20, 2011 V.8www.yageo.com

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