Manufacturing Effects on Data Retention of Non-Volatile Memory ...
Manufacturing Effects on Data Retention of Non-Volatile Memory ...
Manufacturing Effects on Data Retention of Non-Volatile Memory ...
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The T-Model is used because it takes into account both temperature and voltage effects. Thisis appropriate because the semic<strong>on</strong>ductor manufacturer is trying to determine the dataretenti<strong>on</strong> for NVM used in an applicati<strong>on</strong> where heat and power are applied at the same time.(An automotive applicati<strong>on</strong> is a good example where a NVM device is used at elevatedtemperatures.)The T-Model is defined as follows:⎡Tt−TAf = exp ⎢⎣ Tou⎤⎥⎦where A f is the accelerati<strong>on</strong> factor, T u is the temperature <strong>of</strong> the “normal” envir<strong>on</strong>ment, and T tis the elevated temperature where failures are induced at an accelerated rate. (Note both <strong>of</strong>these temperatures are in degrees Kelvin.) To is the characteristic temperature for dataretenti<strong>on</strong> that embodies dielectric, field strength, and charge loss effects. For EPROMs usingan oxide-nitride-oxide process, <strong>on</strong>e manufacturer empirically determined To to be 21°K forthe floating gate.To c<strong>on</strong>tinue the example, let's say we are trying to determine the data retenti<strong>on</strong> for anautomotive applicati<strong>on</strong> where a microc<strong>on</strong>troller (with embedded EPROM) sees a juncti<strong>on</strong>temperature <strong>of</strong> 125°C. For <strong>on</strong>e <strong>of</strong> the tests, we might measure data retenti<strong>on</strong> for over 450hours at 250°C. (Obviously, this is at wafer burn-in; the plastic encapsulent use in SMTpackages cannot withstand this temperature.) Using the T-Model, we would calculate theaccelerati<strong>on</strong> factor as follows:Af⎡523− 398⎤= exp⎢= 384⎣ 21 ⎥⎦An accelerati<strong>on</strong> factor <strong>of</strong> 384 means that if it lasted for 450 hours at 250°C, it will last 384times l<strong>on</strong>ger at 125°C, or about 20 years. This is certainly sufficient for any automotiveapplicati<strong>on</strong>.But when we think about our perennial questi<strong>on</strong> “Does the heat from reflow hurt the data?”,there is no voltage applied to the embedded Flash; the device is “<strong>of</strong>f.” So how do we modelthis?Well, if temperature effects al<strong>on</strong>e are what we are trying to model, then we can use thefamous Arrhenius relati<strong>on</strong>ship. This model describes the effect that temperature has <strong>on</strong> achemical process with a certain “activati<strong>on</strong> energy.” Like the T-Model, it produces anaccelerati<strong>on</strong> factor for a system exposed to an elevated temperature. The relati<strong>on</strong> is asfollows:Af⎡ E= exp ⎢⎣ ka⎛ 1⎜⎝ Tu1 ⎞⎤−⎟⎥Tt⎠⎦where A f is the accelerati<strong>on</strong> factor, E a is the activati<strong>on</strong> energy (in eV), k is Boltzman’sc<strong>on</strong>stant (in eV), T u is the temperature <strong>of</strong> the “normal” envir<strong>on</strong>ment, and T t is again theelevated temperature. (Again, these temperatures are in degrees Kelvin.)But in order to use the Arrhenius relati<strong>on</strong>ship, we need to empirically determine the“activati<strong>on</strong> energy” by fitting a curve to some experimental results at different temperatures.The activati<strong>on</strong> energy is a critical parameter for getting meaningful results. A typicalactivati<strong>on</strong> energy is 0.8 eV for effects related to charge loss when no voltage is applied to thedevice.So, for another example, say there is a guided muniti<strong>on</strong>s applicati<strong>on</strong> where an electr<strong>on</strong>icmodule might sit in storage in the desert. Assuming the internal temperature <strong>of</strong> the shellreaches 125°C, the customer wants to know if this will compromise the data retenti<strong>on</strong> in theArrhenius rev B.doc 7/23/2004 Page 2 <strong>of</strong> 3