High performance HBM Known Good Stack Testing

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• Challenges: Probing challenges – Probe without damaging Micro Bumps • No issue with FormFactor MicroSpring® 25µm Bump Diameter 50µm 140µm Passivation 48 µm 44.75 µm Test Pad 240µm Scrub Direction 137.5 µm Non-Scrub Direction Marc Loranger John Oonk 8
UltraFLEX KGS Solution • Test cell configuration: – 36-slot UltraFLEX platform – 24 HPM 2.8Gbps digital instruments (3,480 IO pins) – 10 UVS256 device power instruments (2,560 VS pins) – New high-<strong>performance</strong> direct cable probe interface – no PIB or probe tower in the signal delivery path • Probe card based on proven Magnum 2x “P52” – Mechanical standard already familiar to Form Factor – Digital and power pin assignments unique to UltraFLEX ATE Marc Loranger John Oonk 9
Page 1 and 2: High performance HBM Known Good Sta
Page 3 and 4: High Bandwidth Memory (HBM) • Mar
Page 5 and 6: High Bandwidth Memory (HBM) • Sta
Page 7: HBM Stack Probing • Bottom of SoC
Page 11 and 12: Power Distribution Challenges • V
Page 13 and 14: PDN DUTlet Power Stack-up • The s
Page 15 and 16: PDN simulations vs. Measurements Po
Page 17 and 18: PDN voltage drop across DUT ATE pow
Page 19 and 20: Known Good Stack At Speed Test 1066

High performance HBM Known Good Stack Testing

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