EPP Europe P1.2024

Issue 05 | 2024 

www.epp-europe.eu 

Electronics 

Production & 

Test 

Trade Shows + Events 

Synergy promised for Nuremberg 

expos SMTconnect & PCIM Europe 

» Page 16 

W 

PCB + Assembly 

Tolerating tolerances with 

intelligent software 

» Page 24 

Test + Quality 

Assurance 

Efficiently ensuring THT quality 

» Page 42 

Interview 

“Our technology is very 

sticky – people get addicted 

to it,” Oshri Cohen, 

CEO, Cybord 

» Page 6 

COVER STORY 

Unlock 

potential with 

intelligent 

planning 

» Page 18 

SMT at its best

Industrie 

Das Kompetenznetzwerk der Industrie 

Forum: Power electronics production 

12. June 2024 in Nuremberg 

10:00 a.m. - 03:00 p.m. 

Trade fair forum: Hall 4 Stand 115 

The forum comprises a detailed programme of presentations by leading 

industry experts on current trends and challenges in the field of power 

electronics manufacturing. 

Programme 

More 

Information: 

https://epp.industrie.de/ 

forum-fertigung-vonleistungselektronik 

10:00 a.m. – 10:05 a.m. Welcome 

Markus Strehlitz, Editor, EPP / EPP Europe 

10:05 a.m. – 10:35 a.m. Keynote: Industry trends from a research perspective 

M.Sc. Nils Thielen, Research Area Leader, Electronics Manufacturing Chair of Manufacturing 

Automation and Production Systems, University of Erlangen-Nuremberg 

10:35 a.m. – 10:55 a.m. Error-free power electronics: Employing AOI and AXI systems in 

THT processes 

Andreas Türk, Product Manager, X-ray Inspection, Göpel electronic 

Jens Kokott, Product Manager, AOI, Göpel electronic 

10:55 a.m. – 11:15 a.m. Failure criteria in Sinter Paste Printing - and how to check them 

Axel Lindloff, Senior Process Specialist Pre-Sales, Koh Young Europe 

11:15 a.m. – 11:35 a.m. HAST testing of epoxy molding compounds based on iodine 

vapour testing and impedance spectroscopy (EIS) 

Dr. Markus Meier, Group Leader, Reliability & Surfaces, ZESTRON Europe 

11:35 a.m. – 01:00 p.m. Break 

01:00 p.m. – 01:30 p.m. Keynote: Topic coming soon 

01:30 p.m. – 01:50 p.m. New application for lasers in electronics production - lasering 

cables onto printed circuit boards 

Uwe Kriegshäuser, CEO, Schnaidt 

01:50 p.m. – 02:10 p.m. Thermal management in power electronics 

Robert Art, Director of Technical Sales, Ventec 

02:10 p.m. – 02:30 p.m. Topic coming soon 

02:30 p.m. – 03:00 p.m. Panel discussion

» EDITORIAL 

Dear readers, 

A soft(ware) revolution 

We’ve long heard that software will revolutionise electronics manufacturing 

– and, as this issue of EPP Europe confirms, this transformation is well 

underway. In the interview on page 6, Cybord CEO, Oshri Cohen, explains 

how visual component inspection – once seen as an almost unsurmountable 

task – is now not only possible, but positively easy - thanks to software 

powered by AI and Big Data. Likewise, our cover story on page 18 

details the exponential benefits manufacturers can reap by automating 

production planning using intelligent software. 

Zero operators, zero admin 

With fewer skilled workers in the sector, manual tasks need to be kept to a 

minimum. The article on page 28 details how a new smart logistics concept 

can stop intralogistics, which is often carried out by humans, from 

becoming the weakest link in the production chain. If you’re interested in 

automation solutions in overlooked areas, check out the article on page 

36 which reveals how power semiconductor modules can now be manufactured 

via a process entirely free of human contact. 

Say ’Servus’ to more synergy 

Software, AI and power electronics are all on the agenda at SMTconnect & 

PCIM Europe taking place in Nuremberg in June. Hoping to promote better 

cross-industry cooperation, organisers have created a zone in which electronics 

manufacturing and power electronics will overlap (PCIM Europe, 

Hall 5) – see page 16 for details. 

FUTURE SERVICES 

& ADDED VALUES 

AS EASY AS 1,2,3: 

1. Digital Services 

& Solutions 

2. MES Integration 

3. Machine-to-Machine 

Communication 

Swing by our stand (SMTconnect, 

Stand 4.215) to say Servus – and 

don’t forget to visit the EPP / EPP 

Europe Power Electronics Production 

Forum taking place on 

12 June in Hall 4, Stand 115. 

Sophie Siegmund 

Online Editor EPP Europe 

redaktion.eppe@konradin.de 

Digitization by Ersa: 

perfectly explained 

and realized. 

You can rely on that! 

Contact us today 

GLOBAL. AHEAD. SUSTAINABLE. 

EPP Europe » 05 | 2024 3

» CONTENTS 05 | 2024 29. YEAR OF PUBLICATION 

COVER FEATURE 

Unlock potential 

ASMPT reveals with intelligent 

how its WORKS planning 

Planning software 

reconciles 

» Page 18 

customers’ requirements 

with production operations 

Source: ASMPT 

NEWS & HIGHLIGHTS 

Interview 

Oshri Cohen, CEO of Cybord 

“Our technology is very sticky – people get addicted to it” 6 

White paper tackles skilled worker shortage 

IPC publishes strategy to address industry labour shortage 10 

Top 5 robot trends 2024 

Number of operational robots worldwide hits new record 10 

EMS industry in Europe grows 11% in 2023 

European PCBA production achieves record revenues 11 

TRADE SHOWS & EVENTS 

IPC Apex Expo 2024 

The return to Anaheim 12 

3D & Systems Summit 

Dresden event to spotlight hybrid bonding, chiplet design 15 

SMTconnect & PCIM Europe 2024 

Synergy between production & power in Nuremberg 16 

COVER STORY 

ASMPT on improving productivity in SMT manufacturing 

Unlock potential with intelligent planning 18 

PCB & ASSEMBLY 

Automating high-tolerance production processes 

Tolerating tolerances with intelligent software (ArtiMinds) 24 

Product updates – PCB + Assembly 27 

Automation of intralogistics in electronics production 

Smart logistics for the smart factory (cts) 28 


Faster, more sustainable manufacturing of power modules 

Optimising flow in power electronics production (Sinergo) 36 


PACKAGING 

Product updates – Semiconductor Packaging 40 

TEST & QUALITY ASSURANCE 

Technologies for optimal use of AOI & AXI 

Efficiently ensuring THT quality (Göpel) 42 

Product updates – Test + Quality Assurance 45 

COLUMNS 

Editorial 3 

Imprint/List of advertisers 50 

4 EPP Europe » 05 | 2024

Industrie 

Automate high-tolerance production processes 

with intelligent robot programming software 

» Page 24 

Source: ArtiMinds 

The 

network of 

expertise 

for industry 

Electronica 2024 

12-15 November, 

Munich 

The bi-annual expo held in Munich 

embraces the entire spectrum of technologies, 

products and solutions from 

the electronics sector, covering topics 

from Automotive to Wireless. 

16 media brands for all major sectors 

of industry 

Information, inspiration and networking 

for professionals and industry executives 

Practical knowledge spanning all media 

channels: Trade journals, websites, events, 

newsletters, whitepapers, webinars 

FOLLOW US: 

LinkedIn: 

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Discover the appropriate media for 

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media.industrie.de 


NEWS & HIGHLIGHTS » Interview 

Interview with Oshri Cohen, CEO of Cybord 

“Our technology is very sticky – 

people get addicted to it” 

After working for 15 years at Mellanox and then Nvidia, Oshri Cohen wanted to take a 

year-long holiday. An offer to become CEO of Cybord, an AI-based software company offering 

the seemingly impossible: visual inspection of 100% of electronics components, proved too 

tempting to resist however. And he hasn’t looked back since. Here, Oshri discusses the disruptive 

nature of the company’s technology and explains why many in the industry still think it 

sounds too good to be true… 

Hi Oshri, could you start by telling us 

how Cybord founded, and how you came 

to be CEO? 

Our CTO Dr. Eyal Weiss founded the company 

in 2019. Before that, he was leading 

a multi-million-dollar defence project 

here in Israel. After 15 years’ work on the 

project, they eventually began to deploy 

the system out in the field, but suddenly 

found that a lot of the units were failing. 

When they investigated this, they discovered 

there was one particular capacitor 

that was defective – that had cost just 

one cent – that was causing all these 

units to fail. And he realized that nobody 

was testing or even looking at the components 

before the boards were being assembled. 

This made Eyal think, “OK with 

my knowledge of AI and big data, I’m 

going to change the world – I’m going to 

change the way supply chain works.” 

That’s how he came to found Cybord. 

When I joined the company in 2022, my 

back was also figuratively covered in 

scars because of defective components 

getting into products. In my previous role 

as VP Supply Chain at Mellanox and then 

Nvidia, I had had to deal with a lot of very 

painful recalls and reworks. It was a disaster. 

I thought that getting into something 

new involving AI and Big Data and, 

at the same time, actually resolving a real 

problem in the supply chain was a great 

idea. 

Oshri Cohen, CEO of Cybord 

Source: Cybord 

“Cybord is purely a 

software company. 

If we tried to sell a 

hardware-based 

solution, nobody would 

adopt it. This is a very 

conservative industry. 

Most are not willing to 

change their line 

layouts.” 

Can you explain a bit about the technology 

you use, exactly how it works 

and what it involves… 

Yes, but first I’ll explain the problem that 

we are addressing. Today when you try to 

assemble a PCB, there are two main challenges. 

The first is controlling the assembly 

process. This, as we know, is 

something already well covered by great 

companies like ASM, Fuji, Vitrox and Koh 

Young. The other is controlling the materials 

used – the actual electronic components. 

This is something that has been 

almost completely neglected over the last 

10–15 years – not because people didn’t 

want to tackle it, but because it was almost 

impossible to resolve. There are 

hundreds of millions of different types of 

components available on the market. A 

single production line assembles on average 

around a million components per day. 

How can you track all of them? A whole 

factory in a month produces a few billion 

components. There wasn’t a database capable 

of dealing with this. This has now 

changed. We now have artificial intelligence 

– meaning we are able to train 

models to learn hundreds of millions of 

different types of components. And we 

have Big Data. So finally we are able to 

collect data on hundreds of millions of 

components in the same database and 

the system will continue to run smoothly. 

So what exactly does Cybord offer customers? 

And how is your technology integrated 

into existing machinery in SMT 

lines? 

Cybord is purely a software company. If 

we tried to sell a hardware-based solution, 

nobody would adopt it. This is a 

very conservative industry. Most are not 

willing to change their line layouts. They 


Detection of body defects by Aquila 


are not willing to spend money, nor do 

they want to add additional processes to 

lines as it would reduce throughput. So 

we integrate our software into existing 

lines. And we do this in two positions: 

pick-and-place machines and AOI systems. 

We integrate our software through 

API into these machines. Pick and place 

machines already automatically take a 

picture of each and every component 

from the bottom side. We connect to 

these systems using APIs to get all the 

images – including the metadata – from 

the machine. Then ultimately we utilize 

all this information to run very sophisticated, 

smart and fast AI algorithms to 

analyse every component in order to tell 

the system, “this one is a good one”, “this 

one is a bad one,” “this is an anomaly because 

there is corrosion or there is 

mould,” and so on. This software capability 

we have is called ’Aquila’. 

We also work with AOI system manufacturers 

to analyse images of components 

from the top in order to provide a different 

kind of analysis. Using images taken 

from above, we decode the marking with 

our NLP technology. We are able to collect 

and visually verify traceability information 

in order to see which component 

was assembled into which board. 

Then we can provide this very accurate 

traceability data to the customer. This capability 

we have is called Osprey. 

Can you integrate your software into 

any brand of machinery, or are there 

only specific companies you work with? 

That’s an excellent question. As I explained, 

we base our technology on the 

data obtained from a machine API. So, for 

example, we partner with ASMPT, with 

Fuji, with Yamaha. On the AOI side, we 

Visit us at 

SMTconnect: 

SmartRep booth 

4A.225 


NEWS & HIGHLIGHTS » Interview 

partner with Koh Young, Vitrox and Holly. 

So the biggest ones we are already connected 

to, but there are some that we are 

not yet connected to. Of course, we 

would like to expand to everyone, but we 

prefer to wait until there is a case with a 

specific customer for another brand and 

then we will build the interface tailored 

to that system. 

What happens if the software comes 

across a new component that the AI is 

not familiar with? 

Yeah, it happens. We need between 1000 

and 5000 components to build a model. 

Building a model doesn’t mean that 

people are sitting here and building models. 

The AI builds the model by itself. It 

just needs a lot of information to do it. To 

give you a sense of the speed – 5000 

components of the same type can run in 

30 minutes. Once the AI has seen 5000, it 

can build a very accurate model. If anything 

is wrong with the model, we have 

people here providing annotations to it, 

so it improves and improves until we have 

a good stable model. Once we have this – 

let’s say it takes half a day to build – we 

are, from that point, able to scan that 

component. 

So you build the model centrally and 

then it gets automatically integrated 

into your software so that everybody 

using your solution has access to it? 

Exactly. 

Traceability verification 

And does the AI keep learning about 

that component? After you’ve got 5000 

images, does it keep adding new ones to 

the model? 

Yes – but only until we get to an accuracy 

level of 99.9%. After that we stop training 

the AI because it’s not efficient. 

How big is your database now? 

We have 4 billion components in our database. 

There are a few hundreds of millions 

of different components out there, 

so we have a way to go. We are now integrated 

into 60 lines across the globe. This 

means we see new components every day 

and we are increasing our database exponentially. 

We are connected to these facilities, 

collect information and monitor it 

live. At the end of the day, everything that 

has been collected from one customer 

can be used by others. 

If you are using photographs rather 

than x-rays, how can you see inside the 

component if there’s anything wrong? 

We don’t need to see anything inside. In 

80% of cases, the component will contain 

some marking outside of it. Sometimes it 

is bent legs, sometimes corrosion, sometimes 

a small crack. Often customers say, 

“OK, you guys see corrosion. I don’t care 

about corrosion.” But although the corrosion 

may not be a problem, it often indicates 

a problem inside the component – 

delamination, for instance, or a cracked 


“It sounds like it’s a 

great situation that 

we don’t have 

competition. Well, 

honestly, I would prefer 

to have competition. 

Then I wouldn’t be the 

one that needed to 

educate the market.” 

die. Corrosion cracks, chipped terminals, 

whatever signs we see outside, we cover 

more than 80% of the defects that can 

happen inside. 

Are there any blind spots because you 

can’t see inside? Do you miss things? 

Almost none. In fact, sometimes, when 

the model is still young, we overshoot. It 

can happen that we say there is a problem 

and there isn’t a problem, but that’s 

OK because once we have trained the 

model to attain 99.9% accuracy then we 

get almost no false positives. 

You call Cybord’s technology “industrydisrupting”. 

Can you elaborate on this? 

Today, companies often budget 2.5–3.5% 

of their cost of goods sold for warranty 

expenses. If we are able to see and react 

to issues with components on the line 

during assembly, these companies do not 

need to keep spending this capital. Up 

until now, if there is a failure in their 

boards, they find out – in the best case – 

at the end of the process. In the worst 

case, they don’t find the failure at all. 

They deliver the product to market and 

then they get a failure in the field – leading 

to a painful recall. The automotive industry, 

for instance, has USD 50 billion of 

warranty claims every year. Not all of this 

is related to electronics, but 22% of it is. 

Now, if you assume just 80% of these issues 

can be resolved by our software, 

then USD 8 billion can be saved in this industry 

every year. This is why our technology 

is so disruptive. We don’t ask you to 


invest capital. We don’t ask you to hold 

your line or to reduce your throughput. 

We don’t ask you to cause any delays. We 

just ask you to buy a subscription – which 

is fairly cheap. We don’t even ask you to 

employ people to look at the results. We 

connect directly to the shop floor management 

system and we communicate 

with the system to flag up suspect boards 

which can then be removed from the line 

and dealt with later. That’s where we are 

taking the industry and that’s just a revolution. 

So do you think that everybody in the 

industry needs to adopt this technology? 


You know – it depends what you’re doing. 

If you are producing toys and reliability is 

not very important, then you shouldn’t. If 

you’re running an aerospace business, 

automotive, medical, data centre, storage 

– you name it – you need to have this capability 

inside your lines, otherwise you 

will keep spending on recalls and reworks 

and product reliability will be low. 

You said that nobody’s done this before 

because the technology didn’t exist. 

How easy was it for you to develop? Is 

anyone else doing something similar? 

It took two years to build the algorithm. 

But the name of the game here is not just 

the algorithm. The name of the game is 

the size of your database. AI has a lot of 

advantages, but the main disadvantage is, 

if you don’t have humongous database, it 

doesn’t work. You need time to build your 

database and until you do this, you cannot 

begin running these algorithms. Even 

if someone decided today they would like 

to start competing with us, they will need 

some time to build their database. It took 

us 2.5 years to build our database. 

I have to tell you that as great as it sounds 

that we don’t have competition – actually 

I would prefer to have competition. 

Why is that? 

Because that way I wouldn’t be the one 

that needed to educate the market. So 

many customers think what we are offering 

must be too good to be true. I’m saying, 

“hey guys, this is what you’re getting” 

and they all say, “Huh? I don’t believe you 

– you need to prove that this dream 

you’re selling is real.” They think – how 

can it not cost me very much and prevent 

all these failures? It’s something so new 

and so innovative that they can’t accept 

it – so it takes some time to convince 

them. The beauty is, though, once you 

sign the agreement, the technology is 

very sticky. People get addicted to its capabilities 

and say, “I can’t believe I 

couldn’t see this up until today.” 

What can you tell us about your newest 

product – real-time quality assurance? 

How does this work and how will it 

benefit the industry? 

Our newest product is called Peregrine. 

The peregrine is the fastest bird in the 

world. Until now, we have taken all the 

images and uploaded them to the cloud, 

and our software is able to react within 

10 seconds to a problematic component 

in the line. With this new product, which 

we released recently, we are moving the 

computing power from the cloud to the 

edge. The server where the computer runs 

all the algorithms is going be in the factory 

itself, not on the cloud. This means it 

will be able to react within six milliseconds, 

rather than 10 seconds, to an issue. 

The program can analyze the images so 

rapidly that it can tell the machine to 

dump faulty components before they are 

even placed on the board. 

Can this be integrated into any machine? 

The beauty here is that we provide this 

capability through an open API system, so 

every manufacturer just gets the API, and 

they integrate it to their software themselves. 

The incentive for our partners is 

their assembly machines are gaining, for 

the first time ever, the capability to sort 

components. 

How do you see the future of electronics 

manufacturing? And how do you 

see the future of Cybord? 

Well, I tie one to the other. The future of 

electronics manufacturing is going to be 

unbelievably bright because the world is 

becoming more and more technological. 

The electronics industry is already growing 

3 to 4% every year and it will grow 

more. This means that if we keep deploying 

in the field with our customers, you 

will also see Cybord growing proportionally. 

You cannot deploy technology without 

assembling boards, without assembling 

hardware. No matter how great 

your software is, you will still have to rely 

on some hardware, right? As long as you 

build hardware, you will need Cybord. 

cybord.ai 


» NEWS & HIGHLIGHTS 

White paper sets out plan to tackle shortage of skilled workers 

IPC publishes strategy to address electronics industry labour shortage 

Strategy breakdown 

Source: Pixabay 

Electronics manufacturers 

across the globe 

are facing challenges 

recruiting, onboarding, 

upskilling and retaining 

skilled workers 

Written by David Hernandez, IPC vice president of 

education, Carlos Plaza, IPC senior director of education 

and Dr. John W. Mitchell, IPC president and 

CEO, the paper targets immediate labour market 

needs and long-term industry growth by building a 

skilled, adaptable, and motivated workforce. “Significant 

challenges, including the lack of a well-defined 

school-to-industry pipeline, have contributed to industry 

workforce shortages that constrain the industry’s 

growth and lead to increased production costs,” 

said Hernandez. “IPC is delivering a multifaceted approach 

to recruitment and training. This is essential 

... to turn current socioeconomic, demographic, and 

cultural trends into opportunities for growth.” 

Source: IPC 

Key elements of the plan include: 

• Establishing partnerships between educational institutions, 

businesses, government agencies, and 

non-profit organizations to ensure a steady flow 

of skilled workers into the electronics manufacturing 

industry. 

• Developing clear and structured career pathways 

that outline progression from entry-level positions 

to advanced roles, enhancing the visibility of career 

advancement opportunities. 

• Prioritizing the development of industry-defined 

training programmes that equip individuals with 

the necessary knowledge, including both technical 

and soft skills. 

• Launching outreach efforts to improve the perception 

of manufacturing careers, highlighting the 

innovative aspects of the industry, and addressing 

misconceptions about manufacturing jobs. 

• Encouraging collaboration between government, 

academia, and industry to speed the transition of 

students and trainees into the workforce, including 

internships, apprenticeships, and mentorship 

programs. 

• Supporting the adoption of universally recognized 

credentials that validate the competencies of 

qualified candidates. 

www.ipc.org 

Top 5 robot trends 2024 

Number of operational robots worldwide hits new record – IFR 

The stock of operational robots around 

the globe has hit a new record of about 

3.9 million units, the International Federation 

of Robotics (IFR) has reported. This 

demand is driven by a number of technological 

innovations. “The five mutually reinforcing 

automation trends in 2024 

show that robotics is a multidisciplinary 

field where technologies are converging 

to create intelligent solutions for a wide 

range of tasks,” said Marina Bill, President 

of the IFR. “These advances continue to 

shape the merging industrial and service 

robotics sectors and the future of work.” 

The five trends are: 

• AI & machine learning - especially 

generative AI and predictive AI for 

analyzing robot performance 

data 

• Cobots expansion- the 

range of collaborative applications 

offered by robot 

manufacturers continues to 

expand. Cobots offer tools 

to relieve and support 

human workers. 

• Mobile manipulators - the 

combination of collaborative 

robot arms and mobile robots 

(AMRs) offers new use cases that 

could expand the demand for cobots. 

• Digital twins - because the twin exists 

purely as a computer model, it can be 

stress-tested and modified with no 

Humanoids perform a wide range of tasks in various 

environments. This shows the social robot known as ARI 

safety implications while saving costs. 

• Humanoid robots - these can be used 

flexibly in work environments that 

were actually created for humans. 

ifr.org 

Source: PAL Robotics 


EMS industry in Europe grows 11% in 2023 

European PCBA production achieves record revenues in 2023 

The European electronics manufacturing 

services (EMS) industry experienced 11% 

growth last year, according to a survey 

conducted by in4ma and sponsored by 

IPC Electronics Europe. Printed circuit 

board assembly (PCBA) production by 

EMS companies achieved record revenues 

of EUR 57.3 billion in 2023 - a figure 

which IPC says underscores electronics 

manufacturing’s vital role in the European 

economy and industrial base. 

Dieter Weiss, founder and president of 

in4ma, and lead architect of the survey, 

stated that 306 legal entities contributed 

data to this year’s survey - a 50 percent 

expansion in participants in just three 

years. 

Key year-over-year takeaways included: 

• Eighty-one percent of EMS companies 

had higher revenues than the previous 

year. 

• Employment in the EMS industry 

increased by approximately 

14,000 to just 

over 254,000 total, an employment 

growth of 5.9 

percent. 

• EMS production of PCBAs 

represented only 43 percent 

of the total market of European 

PCBA production in 

Europe, so long-term 

growth potential still exists. 

• The market remained top 


heavy. Less than 4% of the total EMS 

companies in Europe represented over 

70% of revenue. 

• Excessive raw materials in inventory 

were calculated to be 5.2 billion Euros. 

• Market consolidation will continue in 

2024 as witnessed by 12 merger and 

acquisition (M&A) deals completed just 

Despite the positive results for 2023, the survey showed that 

the overall prognosis for 2024 is that the European EMS market 

could contract by up to 1%. 

in the first two months of the new year. 

Challenges in 2024? 

Despite positive results for 2023, the survey 

showed that the overall prognosis for 

2024 is that the European EMS market 

could contract by up to one percent. 

www.ipc.org 

PIEK Training & Certification 

IPC Training & Certification 

Consultancy 

Test Center PB’s & PBA’s 

Audit services 

IPC Validation Services 

PIEKTRAINING.com 


IPC Apex Expo 2024 – what’s next becomes now 

Labour struggles, sustainability, 

and the return to Anaheim 

The last time Apex Expo was held in the home of Disneyland, the iPhone had not yet been 

invented. The intervening 18 years have transformed electronics manufacturing from an 

industry like any other into a crucial component of the global economy. The unmatched scope 

of the 2024 event, which included a prodigious technical conference, over 100 standards 

committee meetings, and an extensive professional development programme, reflected this. 

On its return to the cozy resort atmosphere of 

Anaheim in early April, the electronics manufacturing 

industry proved it is anything but sleepy. 

Over 3 days, 412 exhibitors and 3,723 attendees (a 

total of 7,245 visitors) from 57 countries gathered 

across 13,000 m 2 to network, exhibit the newest 

technologies, and discuss the sector’s most pressing 

issues. Among these, of course: skilled labour shortages, 

AI, sustainability, and advanced packaging. 

Foot traffic 

Most will want to know how traffic was in the exhibition 

halls - particularly owing to concerns about 

the change in venue. Feedback was mixed - with 

some claiming stands were busier than 2023, and 

others suggesting leads were slightly down. Overall, 

IPC says, numbers were up by 5.1% on 2023. 

“Something that we found very encouraging is that 

the content of the conversations from the attendees 

was much more focused,” said Joe Clure, Head of Application/Demo 

Center, Kurtz Ersa after being surveyed 

by IPC. “It was obvious that there had been a 

good deal of research done before they traveled to 

the show, so they were able to identify the key items 

of interest and ask much more specific questions 

about those topics. And as a result of their preparedness, 

the quality of our leads was so strong that the 

show was very successful for us.” 

Workforce challenges 

The 2024 show was certainly more comprehensive 

than ever before in terms of accompanying programme. 

Reflecting its long-standing commitment 

to advancing the global workforce, IPC had organized 

an extensive schedule of professional development 

lectures beginning on Sunday 7 April. These 

covered topics such as artificial intelligence, PWB 

design engineering, 3D printing and li-ion battery 


TRADE SHOWS & EVENTS « 

Source: IPC 

IPC Apex 2024 took 

place in early April in 

Anaheim, Orange County, 

California. Its first return 

to this venue since 2006. 

Here, participants in the 

Emerging Engineers reception 

pose in front of 

the venue 

technology. As skilled labour shortages continue to 

threaten the US industry (there are more jobs vacancies 

in the manufacturing sector than there are unemployed 

workers), the need to attract new talent as 

well as invest in existing employees was a central 

theme throughout the expo. In November last year, 

IPC celebrated its approval by the US Department of 

Labour as the first Registered Apprenticeship Program 

for the US electronics manufacturing industry. 

The potential business advantages of embracing diversity 

were also widely discussed – with new initiatives 

to support neurodiverse individuals, among 

others, being launched in the sector. 

In his keynote address, IPC CEO Dr. John W. Mitchell 

allayed concerns about the future of human 

workers amid the advent of AI. He remarked that, although 

some repetitive operational jobs may be supplanted, 

if workers continue to actively develop their 

own skillset, these new technologies will only empower 

them to become even more valuable members 

of the workforce. 

ECWC16 

International representation was greater than 

usual thanks to the Electronic Circuits World Convention 

(ECWC16) international PCB symposium held 

in conjunction with the Apex event this year. Formed 

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EPP Europe » 05 | 2024 13 

smt.yamaha-motor-robotics.eu

Source: IPC 

Visitors stream onto the show floor after the ribbon cutting ceremony 

in 1998, the World Electronics Circuits Council 

(WECC) is a strategic partnership of ten international 

trade organizations for PCBs representing the U.S., 

China, Hong Kong, Europe, Taiwan, India, Korea and 

Thailand. Catering for this, the technical conference 

programme was of a higher standard than usual – 

boasting nine topic tracks, 26 sessions and 84 

papers, with peer-reviewed content from 14 countries. 

“From attendees, I received positive feedback 

on the quality of technical programme offerings, 

many stating that sessions covering sustainability, 

next generation packaging and EV electronics were 

welcome additions,” said IPC’s Mitchell. “The paper 

presenters, international subject matter experts, 

eagerly shared their knowledge and expertise and 

provided attendees with quality technical content 

not found or presented anywhere else. We are very 

proud of the technical conference and set the bar 

high for paper submissions.” 

Sustainability 

As the expo made clear, the shift towards sustainability 

will be responsible for huge upheaval in the 

industry in the next few years, and the decades to 

come. Within the past year, IPC has scaled up activities 

and advocacy in this area, including by founding 

the Sustainability for Electronics Leadership Council, 

as well as by clearly identifying four key focus areas 

in which the industry will need the most help in 

terms of strategic planning - namely: value chain resiliency, 

workforce development, natural resources 

and waste, and reporting and disclosure. By 2025, 

John Mitchell, 

President and CEO 

at IPC, discusses the future 

of human workers during 

his keynote address 

major European companies will be required to publish 

their first sustainability statement under the 

European Sustainability Reporting Standards. In 

2026, US companies will be required under the new 

SEC rule to report scope 1 and 2 greenhouse gas 

emissions. The topic was thus given ample airtime in 

Anaheim. The expo hosted more standards development 

activities in the area of sustainability than ever 

before - surrounding issues like materials declaration, 

supply chain transparency, reporting and the 

communication of information. An executive panel 

discussion hosted by Global SMT TV’s Trevor Galbraith, 

entitled ’ESG and sustainability in an EMS 

world’ shed light on the key priorities for companies 

across the board. 

Next year, IPC Apex Expo will be held on 15-20 

March 2025 in the Anaheim Convention Center. 

www.ipcapexexpo.org 

Source: IPC 


« TRADE SHOWS & EVENTS 

Dresden event to feature a broader scope of topics 

Hybrid bonding, chiplet design to take centre stage at 3D & Systems Summit 

Experts in 3D integration and systems for 

semiconductor manufacturing applications 

will gather at the annual SEMI 3D 

& Systems Summit, 12–14 June, 2024, in 

Dresden, Germany for insights into the latest 

heterogeneous integration innovations 

for semiconductor applications. 

Themed Heterogeneous Systems for the 

Intelligently Connected Era, this year’s 

Summit will feature a broader scope of 

topics including market trends, chiplet 

design, hybrid bonding, Co-Packaged Optics 

(CPO), high-bandwidth computing 

and environmental sustainability. 

“We look forward to hosting the most 

prominent names in 3D integration 

microelectronics manufacturing to showcase 

their latest products and technologies 

at the 3D & Systems Summit,” said 

Laith Altimime, President of SEMI Europe. 

“With advanced packaging innovations 

critical to enabling environmental sustainability 

while increasing chip performance, 

we look forward to hosting experts 

who will discuss the microelectronics industry’s 

work to explore more eco-friendly 

alternatives to conventional materials.” 

3D Summit sessions will be titled: Semiconductor 

Market Trends and European 

Impact; Chiplet System Architectures – 

Design and Technologies; Hybrid Bonding 

Technologies for Advanced 3D Integration; 

Manufacturing Innovation for 3D 

Integration; Co-Packaged Optics (CPO) – 

Innovations for High Bandwidth Computing; 

and Materials and Processes Supporting 

Environmental Sustainability. 

Presenters include experts from: 

• CARIAD 

• imec 

SEMI Europe President Laith Altimime presents 

at the 2023 event 

• KLA Corporation 

• MKS-Atotech 

• NVIDIA 

• STMicroelectronics 

semi.org/eu/connect/events/3d-and-systems-summit 

Source: SEMI Europe 

Visit us at 

SMTconnect: 

SmartRep booth 

4A.225 


Source: Mesago / Mathias Kutt 

The Future Packagaing Line as presented at SMTconnect 2023 

SMTconnect & PCIM Europe 2024 

Nuremberg expo promises synergy 

between electronics manufacturing 

& power electronics 

From 11–13 June, European industry representatives will converge upon Nuremberg 

for SMTconnect and PCIM Europe. While the events are distinct – the former 

focusing on electronics manufacturing, the latter on power electronics – 

organizers are promoting a more intensive exchange between the two in the 

hope of advancing cross-industry products and solutions. 

This year, the topic of power electronics production 

will be further integrated into the trade fair 

concept to meet the growing demand from visitors in 

this area,“ Jeannette Meyer, Deputy Vice President, 

SMTconnect, explains. “To address the increasing interaction... 

Hall 5 of PCIM Europe (Smart Power System 

Integration) will focus on the specific requirements 

of power electronics manufacturing, and provide 

more opportunities for professional exchange in 

both fields.” 

System integration 

Interconnectivity and integration will be dominant 

themes across the gamut of products and solutions 

at this year’s event. “Advancing miniaturization and 

complexity in the electronics industry is leading to 

increasing demands on assembly and connection 

technologies,” adds Meyer. “Processes and process 

technologies are merging, and the focus is shifting to 

system integration.” For those wishing to find out 

more about technologies in this area – Smart Power 


TRADE SHOWS & EVENTS « 

Embedding to Integrated Smart Power Circuits., the 

Smart Power Systems Integration Stage at PCIM Europe 

is worth a visit. 

Hands-free future 

A consistent highlight of the SMTconnect expo, 

the Future Packaging Production Line, put together 

by the Fraunhofer Institute for Reliability and Microintegration, 

will once again provide a unique view of 

the manufacturing process. Located in Hall 4, Stand 

331, the 2024 line which simulates real production 

conditions, will comprise 135 products and technologies 

provided by 34 exhibitors. These include research 

institutes, machine manufacturers and component 

suppliers. This year’s showcase will demonstrate 

specifically how a higher degree of automation 

can make manufacturing processes more robust 

against disruptions and external influences such 

as skilled labour shortages. 

Contributor to the line, Fuji Europe Corporation 

(SMTconnect, Hall 4, Stand 321), will also debut 

automation solutions designed to reduce manual intervention. 

Incorporating various placement machines 

and newly developed RH placement heads, 

the ultimate goal of its Fuji Smart Factory 2.0 is to 

achieve zero placement errors, zero machine operators, 

and zero machine stops. “At SMTconnect, [we] 

will demonstrate further automation solutions that 

minimize manual tasks, thereby addressing the 

growing shortage of skilled labour,” said Stefan 

Janssen, Managing Director of Fuji Europe Corporation 

in a statement. “At the same time, alongside 

flexibility, high-speed, and high-precision placement, 

we are increasingly focusing our machines on energy 

efficiency in line with the urgent need for an industrial 

energy transition.” 

Exhibitors at SMTconnect will as ever span the 

gamut of SMT-related products and solutions, from 

materials and components to coating and test systems. 

Some of the big names include Asys, Essemtec, 

Göpel electronic, SmartRep, Viscom and Techvalley. 

Forum programme 

As usual, a varied programme of lectures at 

SMTconnect will cover well-trodden ground including 

AI, Industry 4.0 and sustainable electronics production. 

The full forum agenda will be available on 

the SMTconnect website from mid-April onwards. 

PCIM Europe to set records 

With over 600 exhibitors and around 500 presentations 

from industry and academia lined up, PCIM 

Europe 2024 is aiming to set new records. Organisers 

say visitors can expect an even more extensive range 

of products along the entire power electronics value 

chain this year. For the first time, the exhibition area 

will span four, rather than three, exhibition halls. 

40% of exhibitors registered come from Germany; 

60% are international, and represent 33 countries. 

Among those present are Infineon Technologies, 

Mitsubishi Electric Europe, onsemi, SEMIKRON Danfoss, 

ROHM Semiconductor, STMicroelectronics, 

Volkswagen and Wolfspeed. An overview of all exhibiting 

companies can be found in the online exhibitor 

list. 

Accompanying conference 

The conference entitled ’Power Electronics, Intelligent 

Motion, Renewable Energy and Energy Management’ 

will feature keynote speakers from 

Siemens, Fraunhofer ISI and Infineon. The event will 

also host specialist presentations across thematic 

stages: the Smart Power Systems Integration Stage 

the Technology Stage (whose agenda includes topics 

such as SiC and GaN and the Future of Power); the 

E-Mobility & Energy Storage Stage and the Exhibitor 

Stage. 

Over 16,500 trade visitors filled 3 Halls at PCIM Europe 2023 

New university research zone 

At the new University Research Zone, different 

national and international universities and institutes 

will provide in-depth insights into the power electronics 

research landscape. Research projects will be 

presented by the Technical University of Denmark, 

the Bundeswehr University Germany and RWTH 

Aachen University, among others. 

For more information, full agenda and exhibitor 

lists, visit: 

smtconnect.com | pcim.mesago.com 

Source: Mesago / Mathias Kutt 


COVER STORY » Intelligent Planning 

Source: ASMPT 

In WORKS Planning, ASMPT has integrated 

the complex planning functionality under a user 

interface that’s ergonomic and easy to use 

Improving productivity in SMT manufacturing 

Unlock potential with 

intelligent planning 


AT A GLANCE 

ASMPT explains how its 

WORKS Planning and WORKS 

Logistics software can help 

manufacturers keep track 

of highly complex production 

matrices, and ultimately 

save them time, money and 

resources. 

Delivering both on time and cost-effectively is 

ever more challenging in the highly-competitive 

industry that is SMT manufacturing. Despite delivery 

within a week having been common not so 

long ago, customers are now stipulating that deliveries 

take place on specific days – and at the same 

time ordering multiple different products in small lot 

sizes. Meeting these new demands requires exceptional 

flexibility and efficiency - particularly as costrelated 

pressures are also rising. 

To maintain efficient production operations 

and ensure punctual delivery, it 

is important to balance priorities such 

as orders, customer specifications and 

resources with the practical requirements 

of SMT lines. A two-stage system 

has proved particularly useful for this 

purpose, and WORKS Planning and 

WORKS Logistics - both part of ASMPT’s 

WORKS Software Suite - can help you 

implement this flawlessly. 

Production planning – a highly 

complex task 

Now more than ever, success depends on intelligent 

and networked production planning that considers 

the requirements of both the customer and the 

manufacturing line. The goal is to maximize utilization 

of existing production capacities while 

minimizing interruptions and setup changeovers. By 

this point, the planning process has become a highly 

complex task in which order production sequence 

plays a vital role. A simply switch from lead-containing 

to lead-free solder paste, for instance, will interrupt 

production for up to 30 minutes while the 



reflow oven heats up or cools down to cater for different 

melting points. For this reason, it makes sense 

to run orders requiring the same type of solder paste 

consecutively on a line. Moreover, some lots require 

X-ray inspection for ball grid arrays while others involve 

odd-shaped components (OSCs) that must be 

placed with the TWIN placement head – requiring 

special equipment not necessarily available on every 

line. Even this relatively simple example which considers 

just three critical factors demonstrates the 

central problem: namely, that individual requirements 

overlap and influence one other. Add to this 

the fact that there may be line clearances for certain 

products, as well as other factors, and you are left 

with a highly complex, multidimensional matrix with 

countless possible variations - and only one optimal 

solution. 

Dependency on individual 

specialists 

In factories that plan manually, the quality of 

scheduling still depends largely on individual employees. 

These are usually specialists with years of 

experience who know both the products and customers 

very well. This fundamental dependence on 

specific employees often becomes a problem, particularly 

in locations where the company-employee 

bond is less pronounced than in Germany. When a 

qualified scheduler leaves the company, there is a 

WORKS Planning provides 

production planners with optimal 

support in the planning, logistics, preparation and 

operations workflows. Automating a large part of the 

complex planning process shortens it considerably 

while improving the factory’s productivity 

loss of very specific know-how that can affect the 

whole production. The shortage of skilled labour also 

makes it difficult to find suitable replacements. 

Software developed by 

practitioners for practitioners 

When new products are introduced, even longterm 

and highly experienced employees can no longer 

keep track of the entire process matrix. It thus 

makes sense to automate the planning process. This 

is easier said than done however. To develop a new 

software product, you need to be familiar with the 

Source: ASMPT 

After importing the order data from the ERP system, 

WORKS Planning reconciles the customers’ requirements 

with those of the production operations 

Source: ASMPT 


Executing the rough planning process with WORKS Planning optimizes the use of all available resources in order to meet the deadlines in the best possible way 

Source: ASMPT 

conditions and processes of modern SMT production 

while also taking individual freedoms into account – 

after all, no two factories are alike. Those who are 

purely software developers often fail to do this because 

they lack the necessary experience. 

But ASMPT is different. The renowned global 

player covers almost the entire SMT production process 

with its product portfolio and is intimately 

familiar with the requirements of modern production 

lines as a result of its close customer relationships. 

After defining the functional specifications in minute 

detail, the technology leader opted for a two-stage 

planning concept and implemented it in the workflow 

planning of its WORKS Software Suite. 

Workflow for rough and detailed 

planning 

WORKS Planning elegantly reconciles the requirements 

of customers and production specialists. The 

software initially creates a rough plan three to five 

days before production begins. First, the order data is 

imported from the ERP system. The rough planning 

routine adopts defined priorities by considering the 

resulting orders in a precise order. It starts by looking 

backwards from the promised delivery date. If this 

date cannot be met due to resources being already 

occupied, the system searches automatically for alternative 

resources that are available, and creates a 

forward-looking plan which maximizes setup efficiency. 

This rough planning process focuses exclusively 

on customer requirements. 

“In practice, the advantages of the new 

system become apparent very quickly ... 

Electronics manufacturers are 

often amazed at the untapped potential 

slumbering in their equipment,” 

Mathias Heinz, Product Manager at ASMPT 

From the factory‘s perspective, however, planning 

that is purely customer-oriented is not always feasible 

as material bottlenecks or resource shortfalls 

may necessitate last-minute changes in the production 

sequence. This is where the detailed planning 

stage comes into play. This begins roughly one to two 

shifts in advance of the planned production start. 

Here, production tasks are assigned to specific lines 



Source: ASMPT 

For the detailed plan, the WORKS Logistics application determines a solution that combines the production requirements and deadlines in a way that 

optimizes the utilization of the existing equipment while taking setup sequences and production-relevant aspects into account 

Zusammenfassung 

Die Works Software Suite zielt darauf ab, durch 

eine intelligente Planung in Form von vereinfachten 

sowie optimierten Arbeitsprozessen Potenziale 

freizusetzen und so eine Produktivitätssteigerung 

in der SMT-Fertigung zu erhalten. 

Résumé 

La suite de logiciels Works a pour objectif de 

libérer des potentiels grâce à une planification 

intelligente revêtant la forme de processus de 

travail simplifiés et optimisés afin d’accroître la 

productivité de la fabrication SMT. 

Резюме 

Комплекс программного обеспечения Works 

направлен на раскрытие потенциала за счет 

интеллектуального планирования в виде 

упрощенных и оптимизированных рабочих 

процессов, что повышает продуктивность 

SMT-производства. 

and corresponding processes such as inventory retrievals 

and setups are scheduled to ensure the next 

production round begins on time. The WORKS Logistics 

application develops a plan that optimally combines 

production specifications and deadlines to 

make the best possible use of existing production 

equipment. When the lots are finished, they can even 

be automatically reported back to the ERP system. 

Intelligent factory 

as overarching concept 

That all this works so well is thanks to ASMPT’s holistic 

and data-driven intelligent factory concept, 

which relies on data from lines spanning the entire 

factory. All the information that is generated in the 

factory is collected, processed and linked via standardized 

interfaces in order for it to be put to targeted 

use in various applications including quality management, 

fault analysis, effective staff deployment, 

seamless material flow control, and optimized workflows 

(such as the planning process described above). 

ASMPT has integrated this complex planning functionality 

within an easy-to-use, ergonomic user interface 

in which even newcomers can achieve optimal 

results. WORKS Planning and WORKS Logistics 

achieve an important goal: namely, removing 

planning tasks from a dependence on specific people, 


Source: ASMPT 

Since WORKS applications and factory solutions from ASMPT are highly integrated, they deliver planning results that 

are based on real-time data. Automatic component commonality analyses and the creation of family setups minimize the 

efforts required in post-planning processes and keep the production lines as productive as possible 

and thus allowing them to be easily scaled up to new 

locations. The implementation of the suite is usually 

rapid and glitch-free. If any functional gaps are discovered, 

the ASMPT team can quickly close them 

with software extensions. 

Faster, easier, more efficient 

“In practice, the advantages of the new system become 

apparent very quickly,” says Mathias Heinz, 

Product Manager at ASMPT. “The software optimally 

supports the planner in the needs-based alignment 

and pooling of orders, for example into family setups. 

The automated workflow makes it possible to simulate 

and analyze multiple combinations much more 

quickly than before. Electronics manufacturers are 

often amazed at the untapped potential slumbering 

in their equipment,” 

Considering a modern SMT factory changes the setups 

on each line five to six times a day, it quickly 

becomes apparent just how much time can be saved 

simply by taking a process attribute like lead-free or 

lead-containing solder paste into account. Experience 

shows that the number of setup processes can 

be reduced by 20% or more. Data-driven planning 

alone can accommodate additional orders without 

requiring an investment in new hardware. 

There are also significant savings to be made in the 

area of human resources. The planning of 150 to 200 

orders per week was once a full-time job; now, the 

person who was responsible for this can focus on 

other duties. 

“It is the first software that has 

managed to map and optimize the 

complex planning process in 

SMT manufacturing. 

Put simply: WORKS Planning makes our 

customers’ lives much easier,” 

Last but not least, more accurate planning improves 

the adherence to deadlines, which benefits 

subsequent workflows and ultimately the customer. 

“With WORKS Planning, ASMPT raises electronic 

planning and scheduling to a whole new level. It is 

the first software that has managed to map and optimize 

the complex planning process in SMT manufacturing. 

Put simply: WORKS Planning makes our 

customers’ lives much easier,” says Heinz. 

PCIM Europe, Stand 6.450 

asmpt.com 

Mathias Heinz, Product Manager at ASMPT 


Source: ArtiMinds Robotics 

Intelligent robot programming software enables automation of high-tolerance production processes 

Automating high-tolerance production processes 

Tolerating tolerances with 

intelligent software 

Automating production processes that involve tolerances remains, in many cases, a challenge 

– at least when using conventional approaches. Intelligent software products, like those 

offered by Artiminds, can make it easier to develop reliable automation solutions. In this 

article, the robotics expert highlights several case studies in which its solutions have been 

successfully implemented to illustrate their wide-ranging applications. 

» Silke Glasstetter, Head of Marketing, ArtiMinds Robotics 

There are many processes that utilize tolerances 

in industrial manufacturing and assembly that 

present significant challenges for users – even when 

performed manually. These include: assembly of 

components with incremental tolerances; handling 

of flexible parts; as well as end-of-line inspection of 

complete components. 

Production processes in the above-mentioned 

areas usually require the calculation of tolerances in 

several dimensions, meaning simple measuring 

methods or mechanical solutions are not sufficient 

to automate them reliably. Few suppliers in the market 

offer the development of special solutions for 

these more complex measuring methods. And, as a 

result, automation potential remains untapped – 

despite a reasonable ROI. This is where intelligent 

software solutions, such as those offered by Arti- 

Minds Robotics, can really come into their own. 

Using a two-step process, these solutions ensure 

multidimensional tolerances are not a problem. 

• The first step determines the relevant tolerances. 

The company’s software tools can be used with 

many different sensor methods to measure these 

tolerances. 

• In the second step, data-driven improvement 

of the automation system ensures better performance 

by reusing the measured tolerances. 

Connector assembly 

Since mid-2023, EBM-Papst has been using 

ArtiMinds’ software with three robotic solutions to 

manufacture blowers at its plant in Landshut, Germany. 

The assembly robots place printed circuit 

boards on a floating housing. The high tolerance process 

is performed reliably and promptly using the 

tolerance compensation features carried out via 

force-torque sensors. During commissioning, automatic 

data acquisition and analysis ensures that the 

results of this tolerance compensation can be assigned 

to individual workpiece carriers to improve 


« PCB & ASSEMBLY 


ArtiMinds RPS allows 2D and 3D cameras and profile laser scanners to be used in the robot program 


Profile laser scanners provide fast, highly-accurate 3D 

measurement with a comparatively simple setup 

them specifically – and benefitting other process 

steps in the system at the same time. 

After the assembly process, two robots carry out 

an end-of-line test in which several connectors on 

the assembled floating board are contacted automatically. 

Tolerance compensation is also performed 

at this stage using the software tools, increasing 

process reliability. Due to the freely configurable 

connector position on the PCB, the robots must cover 

all angular positions across a possible 360 degrees, 

as well as different component variants. Cycle time 

requirements are met thanks to the TPO (Teach Point 

Optimization) software function. Based on the tolerance 

compensation carried out beforehand, this calculates 

a suitable teach-in point for each variant and 

angular position and makes this available to the 

robot via a PLC. In this way, the process automatically 

adapts to the tolerances of each variant and 

angular position after a few passes. Over the course 

of production, tolerances from other batches can 

also be integrated into the database. This learning 

process results in a robust production which avoids 

time-consuming readjustments when conditions 

change. 

Cable handling 

Automatic cable picking illustrates the challenges 

faced when handling flexible components. The software 

template library can be used to determine the 

gripping point and orientation of the gripper relative 

to the cable quickly and reliably based on a scan of 

the cable end. This allows for the implementation of 

a wide range of feeding types. To simplify such applications, 

the software allows standard sensors, such 

as 2D and 3D cameras as well as profile laser 

scanners, to be used in the robot program to automatically 

determine and compensate for tolerances. 

In processes with high tolerances, such as cable 

handling, it is often necessary to conduct not just 

one but several measurements to determine all the 

tolerances. With a comparatively simple setup and 

low cost, profile laser scanners provide fast, highlyaccurate 

3D measurement along a line. Using the ArtiMinds 

library, profile laser scanner results can be 

processed directly on the robot controller without 

the need for an additional evaluation computer. In 

addition to data collection (i.e. triggering of detectors, 

received result and multiple result storage), the 

library also supports data processing. The latter 

covers a wide range of possibilities for novel automation 

solutions: from simple operators (like safety 

checks) to more complex operators (such as creating 

a scan from many measurements). 

Force-controlled assembly 

Thanks to the LAR analysis tool, the software can 

also retrieve and store process data from the robot 

controller during operation. This is timed to the pro- 

The intelligent function blocks allow force-controlled, precise insertion of flexible cables 



» PCB & ASSEMBLY 

With ArtiMinds` software tools, even processes with tolerances can be automated 

without expert knowledge or extensive programming 


When implementing robots, Primus` focus was not on optimizing 

cycle times but on increasing process and repeatability accuracy. 


grammed sub-processes, making analysis and monitoring 

easy. For processes with high tolerances, however, 

it is worth going one step further, and utilising 

automatic Teach Point Optimization (TPO). Here user 

interfaces mean data processing is standardized and 

access is simple. One of the greatest strengths of this 

feature is the wide range of filtering options offered. 


Der Artikel zeigt vielfältige Fallbeispiele, wie intelligente 

Softwareprodukte die Entwicklung zuverlässiger 

Automatisierungslösungen erleichtern 

können. 

Résumé 

Cet article présente toutes sortes d’études de cas 

montrant comment les logiciels intelligents peuvent 

faciliter le développement de solutions d’automatisation 

fiables. 

Резюме 

В статье приводится множество примеров 

того, как интеллектуальные 

программные продукты могут способствовать 

разработке надежных решений 

для автоматизации. 

This makes it easy for the user to decide, for example, 

whether he wants to carry out optimizations per 

workpiece carrier, workpiece variant, or by batch. 

An example of the LAR analysis tool in action can 

be seen in the automatic assembly of gears as implemented 

by Primus Präzisionstechnik using ArtiMinds’ 

software. This involves the production of small 

gearwheels from several individual parts: three 

shafts and five gearwheels within a gear housing. All 

parts are greased prior to assembly. This is a complex 

application with many process steps and different 

components and thus a high number of variants. It is 

important to note that Primus’ focus was not on optimizing 

cycle times during automation, but on increasing 

process and repeatability accuracy. The LAR 

analysis software provides detailed evaluations and 

data about the production process, based on robot 

movements, force-torque measurements, vision results 

or error codes. This makes it easy to identify potential 

improvements not visible to the naked eye. As 

a result, the manufacturer was able to adjust the accuracy 

of the application down to a one-hundredth 

of a millimeter and, after a few runs, re-evaluate 

whether the changes had the desired positive effect. 

The advantages of these intelligent software tools 

when it comes to automating processes with tolerances 

are obvious. Even processes with high tolerances 

can be automated economically and without 

expert knowledge or extensive programming. The 

centralized use of tools and standard components 

means the resulting system concepts are very flexible 

and can be easily adapted to new requirements. 

www.artiminds.com 


Product Updates « PCB & ASSEMBLY 

Industrial cybersecurity 

Siemens develops software to identify vulnerable production assets 

Today, industrial operators are tasked with continuously 

safeguarding production assets on the shop 

floor. They must analyze vendor security advisories, 

manually match them to the asset inventory and 

prioritize mitigation measures. Because this is timeconsuming 

and error-prone, factories run the risk of 

missing critical vulnerabilities in their assets or producing 

false-positives. 

To address the need to identify cybersecurity vulnerabilities 

on the shop floor, Siemens has launched a 

cybersecurity software-as-a-service. The cloud-based 

SINEC Security Guard offers automated vulnerability 

mapping and security management optimized for industrial 

operators with no in-depth cybersecurity 

knowledge. The software automatically assigns 

known cybersecurity vulnerabilities to production 

0189½assets - allowing operators and automation 

experts to identify risks among their OT assets on the 

shop floor and receive a risk-based threat analysis. 

The software then recommends and prioritizes miti- 

gation measures. These 

can be planned and tracked 

by the task management 

tool. 

“[The software] is unique 

because it takes the specific 

situation of the customer’s 

operational environment 

into consideration 

while providing a 

single pane of glass for 

security-relevant information 

in the OT area,” said Dirk Didascalou, CTO 

of Siemens Digital Industries. “When developing [it], 

we drew on our extensive experience with cybersecurity 

in our own factories.” 

The software is available in July 2024 on the Xcelerator 

Marketplace and Digital Exchange. 


xcelerator.siemens.com 

The cloud-based SINEC 

Security Guard offers 

automated vulnerability 

mapping and security 

management optimized 

for industrial operators in 

OT environments 

Source: Siemens 

VAPOUR PHASE 

SOLDERING 

#opentochange 

CondensoXS smart – Flexibility from start to finish 

When soldering high-mass or large boards, a particularly effective and 

easily controlled soldering process is of great importance. With the vapour 

phase soldering systems of the Condenso series, you will succeed in 

achieving the best soldering results even with these requirements – for a 

good take-off and a safe landing. 

11 – 12 Sept. 2024 

Technology Days 

www.rehm-group.com 



Source: cts 

Highly-networked warehouses, buffer and 

transport systems relieve employees of 

routine tasks, thereby increasing productivity 

and reducing running costs 

Automation of intralogistics in electronics production 

Smart logistics for the smart factory 

Cost and efficiency pressures, as well as demographic change, are driving automation in 

electronics production. When it comes to intralogistics processes, individual, integrated 

solutions are more in demand than ever before. System integrator cts has developed a new 

smart logistics concept which, it says, offers safer, more efficient and more cost-effective 

material flow – and prevents intralogistics from becoming the weakest link in the production 

chain. 

The demands placed upon intralogistics systems 

and processes are becoming ever larger. Highmix, 

low-volume orders pose a particular challenge 

as frequent changeovers keep production staff on 

their toes. The workforce is thinning out as the 

boomer generation retires, and many vacancies remain 

unfilled. It is thus more important than ever to 

deploy the remaining workforce where it is really 

needed. “When humans are used to transport goods 

from A to B, storage, transportation and delivery can 

account for a significant proportion of total production 

costs,” explains Alfred Pammer, Head of Sales 

and Marketing at cts. 

Intralogistics: often a weak point 

The highly networked production chains used in 

modern electronics production are only as strong as 

their weakest link. And in many cases, this is intralogistics. 

Only those who automate standard tasks in 

this area can make optimum use of employees and 

expensive production equipment to achieve maximum 

ROI. Implementation of a new logistics concept 

requires a system integrator who, together with the 

customer, carries the project through from A to Z: 

from initial meeting to turnkey handover. 

The disrupted supply chains seen in recent years 

have caused production planning to become a risky 

undertaking if sufficient storage and buffer capacities 

are not planned and accommodated for. Moreover, no 

two electronics production facilities are the same. 

The extent to which it makes sense to replace human 

labour with machines is something that must be assessed 

on a case-by-case basis. Implementation, too, 

must be tailored to suit a customer’s individual needs. 

Taking all this into account, we can conclude that 

any new intralogistics automation concept in the 

electronics manufacturing sector must meet the following 

requirements: 

• It must have a modular structure and be easily 

scalable. 


• It must integrate technology from different 

manufacturers. 

• It must be customizable. 

• It must take into account the space available 

in the production facilities. 

It is rarely worthwhile for electronics manufacturers 

to plan and implement automation in intralogistics 

themselves. As there is a wide range of hardware 

and software on offer, comprehensive knowhow 

is required to make the right purchasing decision. 

Ensuring system-to-system networking is even 

more difficult. “This requires a great deal of experience,” 

Pammer points out, ”because the devil is in 

“The solution ultimately 

handed over to the client 

is by no means fixed. 

Each project is unique. 

Recent years, in particular, 

have shown how quickly 

conditions can change” 

Alfred Pammer, 

Head of Sales and Marketing, cts 

the detail. There are highly complex compatibility 

problems to solve, but also very trivial things to consider 

– not every industrial floor is suitable for heavy 

storage systems or autonomous vehicles, for 

example. There is also usually a problem with space: 

storage space is both scarce and expensive and must, 

therefore, be optimally utilized.” 

One system integrator, 

one point of contact 

cts says its ’Smart Intralogistics for the Smart Factory’ 

concept, developed on the basis of numerous 

successfully implemented projects, provides the solution 

to these challenges. “We provide electronics 

manufacturers with a stringent, automated intralogistics 

infrastructure from a single source,” assures 

Pammer. “With our Smart Logistics concept, we provide 

collection, storage, buffering, transport and 

quality assurance systems for the Smart Factory, as 

well as comprehensive software integration. Everything 

comes from a single source which means we 

take care of everything, from planning, installation 

and commissioning to ongoing maintenance. And if 

the floor is too uneven for driverless transport systems, 

we also arrange the necessary construction work. 

”The customer thus obtains a solution from just 

one system partner and has a single point of contact 

for both planning and implementation. They are free 

to decide at any time which automation step they 

want to implement and which solutions they want to 

use. Thanks to the individual configuration and 

modular structure, the concept is also very effective 

for small and medium-sized companies and usually 

pays for itself surprisingly quickly.” 

’Everything from a single source’ does not, however, 

mean that all hardware and software components 

used come from one and the same manufacturer,” 

emphasizes Pammer. ”Rather, the challenge is 

to ’select the best of each and combine them to create 

a customized system solution that precisely 

meets the customer’s needs.” 

The solution ultimately handed over to the client is 

by no means fixed. Each project is unique. “Recent 

years, in particular, have shown how quickly conditions 

can change,” says Pammer, “and cts can react 

just as quickly. Everything is neatly documented so 

that we can expand or modify the Smart Factory solution 

quickly and easily. The customer can be sure 

that the new system will work just as smoothly as 

the previous one. We only leave when everything is 

up and running and he has given his OK.” 

Manufacturer-neutral advice 

and conception 

When putting together its modular solutions, cts 

draws on a large pool of mature systems from a wide 

range of manufacturers. Internal material flow begins 

with the recording of delivered materials. This is 

done by the Gigaflex FlyScan WE 12P scanner. With a 

large reading field of up to 540mm x 400mm, the 

system registers deliveries based on the container ID 

with just one scan. The packs are pulled under the 

camera using the FlyScan process. The system works 

without adjustments or teach-ins and can read 1D, 

2D, PDF or special codes. 

Smart warehouse: fully automated storage and retrieval with maximum flexibility and 

floorspace performance over a length of up to 20 metres 

Source: cts 



Source: cts 

Automated guided vehicle system (AMR): 

reliable material transfer without complex 

conveyor or control technology 

An inline X-ray counter ensures fast, precise and 

non-contact component detection. The most suitable 

brand is selected together with the customer. Almost 

all devices available on the market use AI-based algorithms 

to provide the planning system with up-todate 

data on component stock. 


Intra- und Produktionslogistik ist eine zentrale Aufgabe, 

um in Zukunft wirtschaftlich arbeiten und weiter konkurrenzfähig 

produzieren zu können, wobei Mensch 

und Maschine in der digitalen Fabrik verbunden sind 

und Material- und Warenflüsse optimiert werden. 

Résumé 

Reliant l’humain et la machine dans l’usine numérique 

et optimisant les flux de matériaux et de marchandises, 

les tâches de logistique interne et logistique de production 

jouent un rôle central pour garantir la rentabilité 

du travail et une production toujours aussi concurrentielle 

à l’avenir. 

Резюме 

Внутренняя и производственная логистика – это 

главная задача, которая позволит в будущем 

достичь рентабельности в работе и продолжать 

производить конкурентоспособную продукцию, что 

предполагает взаимосвязь человека и машины на 

цифровой фабрике, а также оптимизацию потоков 

материалов и товаров. 

The storage and retrieval of PCBs, SMT-reels or 

consumables is automated throughout thanks to the 

cts Smart Warehouse storage system. It is available 

in sizes starting from a footprint of 9m x 4.5m and a 

height of 4.3m. The warehouse structure can be customized. 

Shelves can store between 400 and 1100 

PCB magazines. Alternatively, KLT boxes, trays or 

other workpiece carriers can also be stored. Individual 

adjustments in length and height are also possible 

to optimise use of the available space. The company 

also offers a more compact version of the 

modular storage system in the form of an octagon. 

With a footprint of 4.2m x 4.2m or 4.8m x 4.8m, the 

Mini Smart Warehouse is extremely space-efficient 

and can hold 80 to 280 PCB magazines. With the appropriate 

room height, a higher capacity can be 

achieved. Using both systems, it is also possible to 

connect across floors. 

Transfer stations which are available from cts in 

various designs, ensure buffering directly on the production 

line. These include gravity systems on one or 

more levels as well as motor-driven versions which 

come with the option of sensors. 

The Gigaflex Storage Center offers a completely 

new material, logistics and picking system for all 

SMT component reels across electronics production. 

It offers an enormous storage volume in a very small 

space. More than 50,000 7” reels can be stored on a 

floor area of approx. 50m2. It also offers full transparency 

and traceability. The Storage Center consists 

of a complete climate zone with a relative humidity 

of

Autonomous transport systems (AMR/AIV) are 

much more efficient and cost-effective than employees 

when it comes to transporting the required 

materials into the warehouse or to the line. The cts 

portfolio comprises a wide variety of designs which 

can be used immediately and requiring no structural 

measures, such as induction loops, for orientation. 

Fleet operation can include up to 100 vehicles. The 

transport infrastructure can be rescaled at any time 

and is always configured centrally. 

To complement the transport system, the company 

also offers the sloXis middleware, which can be used 

to control and manage heterogeneous AMR fleets 

(which comprise systems from different manufacturers). 

The modular solution supports native interfaces 

and the integration of open VDA5050 fleet 

managers. Operation is web-based and, thanks to its 

modular structure, the software can be expanded 

and adapted quickly and easily – catering for everything 

from the automatic generation of transport 

orders to role-based configurations, tracking solutions 

and extensions to communication options, 

Mini Smart Warehouse: compact version from a footprint 

of 4.2m x 4.2m with capacity from 80 to 280 PCB magazines 

through to door and elevator control. True to the 

open Industry 4.0 concept, the middleware also supports 

modern interfaces such as REST and MQTT. 

SMTconnect, Stand 4.213 

www.group-cts.de 

Source: cts 

FUJI Smart Factory 2.0 

The Next Step in Automation 

Automatic check out of parts 

Guidance for setup and Automated feeder exchange 

Transport via AMRs 

Automatic changeover 

Operator notification system 

Inform now: SMTconnect 2024 

June 11 th –13 th , 2024 in Nuremberg 

Visit us: Hall 4, Booth 321 

FUJI EUROPE CORPORATION GmbH 

+49 (0)6107 6842-0 

fec_info@fuji-euro.de 

www.fuji-euro.de 


PCB & ASSEMBLY » Product Updates 

Easy change of gripper fingers during ongoing processes 

Schunk introduces new robot jaw quick-change system 

Source: Schunk 

The automatic jaw 

quick-change system 

BSWS-R enables fast 

and automatic finger 

change on the gripper 

Gripping technology specialist 

Schunk has introduced the 

BSWS-R jaw quick-change 

system, which enables robots 

to change their gripper fingers 

automatically during ongoing 

processes in under three seconds. 

The system consists of 

just a few components and is 

compatible with all grippers 

with PGN-plus-P screw connection 

diagram. 

As production increasingly 

moves towards high mix, low 

volume, it is a a major advantage to be able to produce 

a wide range of variants, even in the smallest 

batch sizes, without needing any manual setup. 

Easy application 

Up to now, automated changing has only been possible 

by replacing the entire gripper. The new system 

accomplishes this with minimal use of components: 

all that is needed for each gripper finger is a jaw 

quick-change base, two adapter pins and a storage 

station. The base is screwed to the workpiece-specific 

gripper finger and the adapter pins are attached to 

the base jaw of the gripper. When the base moves into 

the storage station, the locking pin is actuated, and 

the form-fit locking mechanism is unlocked. The robot 

moves upwards out of the jaw quick-change system, 

and the fingers and the base remain in the storage 

station. No additional effort is required as the robot 

performs the change with its own force. The new system 

design eliminates the need to drill through the 

finger, and only threaded holes are required - giving 

users more freedom when designing fingers. 

The new system is available in nine sizes. In smaller 

versions up to size 100, the storage stations are designed 

with elastomer bearings and makes them 

ideal for applications with cobots. For greater process 

reliability, an optional inductive proximity 

switch is available to control whether the finger is in 

the storage station. The base is also prepared for installation 

of an RFID data carrier for finger coding. 


schunk.com 

Connect, control and monitor jetting functions 

Nordson develops industry 4.0 jetting system 

Nordson EFD, precision fluid dispensing 

systems manufacturer, has introduced the 

PICO Nexμs Jetting System. While standard 

jetting controllers are panelmounted 

away from the point of dispense, 

making adjustment and monitoring of the 

dispensing parameters inconvenient to 

the user, the PICO Nexμs jetting controller 

has a compact 24V DIN-rail construction 

which makes it easy to mount inside an 

existing machine cabinet. It is thus well 

suited in multi-valve installations where 

machine real estate is limited. 

The controller uses standard Industrial 

Ethernet protocols such as PROFINET and 

EtherNet/IP to communicate with your 

programmable logic controller (PLC) or 

other plant controllers. This allows manufacturers 

to control multiple jetting systems 

through a human machine interface 

(HMI) at the point of dispense. Its web interface 

simplifies setup, programming, 

and monitoring. Users can adjust cycle, 

pulse, frequency, and more for real-time 

control. A history of dispensing parameters 

can be stored for optimal quality 

control. 

“PICO Nexμs is the Core of Connectivity. 

It is all about connections … It connects 

to the Pμlse jet valve. It connects to 

factory automation. It connects to the 

jetting process controls. It connects to 

the machine. And it connects the machine 

operator via HMI for real time 

manufacturing information, enabling a 

data-driven production process and 

greater production yields and efficiencies,” 

said Claude Bergeron, PICO Product 

Line Manager, Nordson EFD. 


Source: Nordson EFD 

The jetting controller has 

a compact 24V DIN-rail 

construction which makes 

it easy to mount inside an 

existing machine cabinet 


Soldering technology 

Sasinno unveils new precision soldering system 

Sasinno Americas has introduced its latest 

advancement in soldering technology 

– the iBot-i1/2s - which offers features 

designed to elevate efficiency and performance 

in electronics manufacturing 

processes. These include: 

• PC Control for Enhanced Precision: the 

PC-based control system, offers an 

intuitive user interface compared to 

traditional teaching pad-based 

controls. 

• Advanced Camera Integration: the 

series integrates advanced cameras for 

both programming and fiducial checking, 

ensuring accuracy and efficiency. 

• Superior Drive Mechanism: utilizing 

servo motors and ball screws, the 

system delivers unmatched precision 

and reliability, eliminating the need for 

regular tension adjustments common 

with timing belt-driven stepper 

motors. 

• High-Performance JBC Solder Stations: 

featuring original JBC solder stations, 

the company says the iBot-i1/2s offers 

exceptional heat recovery and durability, 

guaranteeing seamless soldering 

experiences. 

Dual-tip soldering 

The system addresses a common challenge 

in electronics manufacturing by offering 

dual-tip soldering capabilities on a 

single table. With distinct solder irons 

featuring different tip models, the company 

says it streamlines the soldering 

process without compromising precision, 

eliminating the need for multiple machines 

and reducing costs. 

As the demand for versatility in soldering 

processes continues to grow, the new system 

is tailored to the complexity of modern 

PCB designs. With joints varying in 

size and thermal requirements, it can 

adapt seamlessly to diverse manufacturing 

needs. 

www.sasinnoamericas.com 

Refurbishment for separator plates 

Ventec to offer refurbishment 

service for PCB lamination plates 

Source: Cardel 

This new service is available 

from Ventec Giga 

Solutions through the 

company’s exclusive 

agreement with Cardel 

Group and its German 

subsidiary VTT GmbH 

Ventec Giga Solutions is offering a refurbishment 

service for separator plates 

used in PCB lamination processes. The 

service includes plate examination and 

production of a detailed condition report 

with assessment of reworking 

costs. Refurbishment includes removal 

of unwanted material and restoration 

of the original surface finish. 

“Lamination plates are exposed repeatedly 

to high stresses during PCB 

production yet have a profound effect 

on the surface quality of the PCB,” explained 

Ramesh Dhokia of Ventec Giga 

Solutions. “Renewing these plates 

sooner than necessary, incurs unnecessary 

costs, and can be time consuming 

... [we are] now able to offer this innovative and 

cost-effective alternative that delivers a quality refurbished 

plate with a fast turnaround.” 

This service is available from Ventec Giga Solutions through 

the company’s exclusive agreement with Cardel Group and 

its German subsidiary VTT GmbH. 

www.ventec-group.com/services/ventec-giga-solutions 

VISIT US 

from June 11th - 13th 


PCB & ASSEMBLY » Product Updates 

High speed marking of moving objects 

Panasonic presents new laser marking system 

Panasonic Industry Europe has introduced 

new LP-RH CO2 laser marking systems 

specially designed for industries with 

high demands regarding speed and functionality. 

These are available with 10 W, 

20 W, and 30 W output. 

Thanks to the ultra-fast galvanometer 

scanner, the systems can mark moving 

objects on-the-fly up to a conveyor speed 

of 240 m/min. With their small laser beam 

diameter, some models are particularly 

suitable for marking small components 

with extremely fine markings. Due to 

their shorter wavelength of 9.3μm, they 

are ideal for marking transparent plastics 

such as PET or PC. The CO2 laser also 

makes it possible to mark organic materials 

such as paper and wood. 

The start-up time has been significantly 

reduced from 90 to 15 seconds to increase 

work efficiency and avoid unwanted 

production interruptions. Thanks 

to the newly integrated motor, engraving 

achieves impressive homogeneity, speed, 

and precision compared to the previous 

series. The marking field of this series is 

up to 160 x 160 mm, and a new scanning 

method for Data Matrix Codes reduces 

cycle times by up to 40 %. 

The working distance can be easily adjusted 

from ±3 mm without moving the 

laser head. This function guarantees precise 

alignment and makes fine adjustment 

much easier, making work processes 

more efficient. 

The updated PC software Laser Marker 

NAVI smart presents a user-friendly interface 

that simplifies maintenance history 

Source: Panasonic Industry Europe 

The marking field of this series is up to 160 x 160 mm, 

and a new scanning method for Data Matrix Codes 

reduces cycle times by up to 40 % 

management. The software also informs 

you when maintenance is required so that 

your system remains in optimum condition. 


industry.panasonic.eu 

Manufacturing ESD-safe parts 

Mechnano spotlights electrostatic dissipative (ESD) AM materials 

Source: Mechnano 

Demo parts created 

using PK-ESD powder 

Mechnano highlighted its electrostatic dissipative 

(ESD) additive manufacturing materials at this year’s 

IPC Apex Expo. These included: 

• Formula1B: this is a static-dissipative photopolymer 

resin specifically designed to offer a 

nano-uniform surface resistance and effectively 

eliminate carbon sloughing. This advanced material 

is specifically engineered to manufacture 

high-resolution components with exceptional surface 

finish. The capabilities of the material 

will be demonstrated through its wide 

range of applications, including the 

production of conformal coating caps 

and electronic component carriers. 

By pushing the boundaries of static 

dissipative part fabrication, Formula1B 

has emerged as a gamechanger 

offering both rapid production 

and cost-effectiveness. 

• Formula1µ: this addresses the growing 

need for ESD-safe micro-components 

in various industries. This rigid ESD 

resin is compatible with BMF machines, which 

offer an excellent choice for manufacturing intricate 

ESD-safe parts. The marriage of the BMF 

hardware and Formula1µ serves as a quick and 

cost-effective alternative to the conventional, 

labor-intensive, and expensive micromachining. 

• PK-ESD: This PK-ESD powder redefines expectations 

for ESD materials in 3D printing. Its # 

combination of chemical and mechanical properties 

enables the production of eco-friendly parts 

with high-impact strength, chemical and abrasion 

resistance, as well as improved elongation over 

general-purpose nylons. This AM ESD can withstand 

rigorous conditions, making it ideal for even 

the harshest environments. 

Carbon nanotubes in AM materials 

The company’s technology, known as D’Func, is centered 

around the integration of discrete, dispersed, 

and functionalized carbon nanotubes into AM materials. 

D’Func can be tailored to achieve a wide 

range of material property improvements, enhancing 

the performance of AM materials. 

“Formula1B, Formula1µ and PK-ESD all provide fast, 

affordable, and high-performance solutions for static 

dissipative part fabrication.” said Olga “Dr. O” Ivanova, 

PhD, Director of Applications & Technology at 

the manufacturer. 

mechnano.com 


Improving thermomechanical performance 

MacDermid Alpha introduces alloy for 

enhanced reliability 

Source: MacDermid Alpha 

MacDermid Alpha Electronics Solutions has 

introduced ALPHA Innolot MXE, an alloy engineered 

to address the critical needs of enhanced 

reliability and performance in modern 

electronic assemblies. “As an industry partner, 

we understand the importance of staying at 

the forefront of market trends. With Innolot 

MXE, we provide a groundbreaking solution 

that supports the highest standards of quality 

and performance,” said Ebad Rehman, Product 

Manager, Solder Paste in the Americas, 

and Europe. 

Advancing performance 

The company says the new alloy represents a 

breakthrough in reliability, offering enhanced 

thermomechanical performance to 

meet the increasing rigorous demands 

of electronic assemblies. 

Surpassing traditional options 

like SAC305, it says the new 

alloy delivers exceptional thermal 

cycling, vibration, and drop 

shock performance, and achieves 

high creep-fatigue resistance 

To complement its 

thermomechanical 

performance, the 

new alloy is available 

in combination with 

ALPHA CVP-390V 

solder flux 

through a refined microstructure. This makes 

it ideal for the most demanding ruggedized 

applications. 

Driven by industry demands 

The development of the product was inspired 

by the complex challenges present in sectors 

spanning automotive, aerospace, high-end 

computing, and industrial applications, where 

reliability is critical. Environments with severe 

stress on solder joints underscore the 

need for the new product, as traditional alloy 

options are limited in performance and durability. 

This solution offers a higher margin of 

performance to enhance in-use life and advance 

board level reliability. 

• Innolot MXE addresses new challenges in 

safety-critical systems, miniaturization, 

and harsh operating environments, setting 

a new standard for performance. 

• Enhanced Creep Fatigue toughness inhibits 

crack propagation and improves thermal 

cycling performance as compared to 

SAC305 and other high-reliability alloys. 

Available in solder paste 

The new alloy is available in combination 

with ALPHA CVP-390V solder flux. This offering 

presents an unparalleled blend of highperformance 

alloy and solder paste chemistry, 

ensuring unmatched electrochemical reliability 

even in the most demanding scenarios. 


www.macdermidalpha.com 

The answer to avoid voiding 

The CCS100 Vapour Phase Soldering Machine 

is fast, quick, speedy you name it. An oven 

causing no bottle neck on production lines. 

We are looking forward to your visit at the 

„Future Packaging“ joint booth „The Line“ at 

SMTconnect 2024 Hall 4, Booth 305 

IBL-Löttechnik GmbH Messerschmittring 61-63, D-86343 Königsbrunn Tel.: +49(0)8231/95889-0 www.ibl-tech.com 



Faster and more sustainable manufacturing of power modules 

Optimising flow in power electronics 

production 

Italian industrial equipment manufacturer Sinergo specializes in providing automation 

solutions in overlooked areas. Here, the company details its newest automation and robotics 

solutions for use in the production of power semiconductor modules and electronics, and 

emphasizes the benefits of a production line that runs with no human contact at all. 

When developing automation and robotics solutions 

for use in the manufacturing of power 

semiconductor modules and electronics, the focus 

should be not only on the various processing stages 

but also on process control and parts handling. Often 

processes and production flow can be optimized 

simply by implementing custom transport and storage 

solutions. With this in mind, Sinergo has developed 

a range of customizable machines for use at 

various stages in the production of power modules. 

These solutions can be supplied either as standalone 

or as complete production lines. They cover: 

• Dividing: to divide the DCB Mastercard into single 

DCB modules output 

• Soldering: electromagnetic induction soldering of 

the pins in the DBC module. The use of induction 

instead of the oven saves time and reduces costs. 

• Boxing – gasketing & potting: Casing modules by 

edge sealing, silicon filling mono/bicomponent ... 

• Polymerization: UV and or heat curing; 

Source: Sinergo 

Some of the production steps after the ’wire bonding phase’ covered by Sinergo machines 


• Testing and marking: comprising static testing hot 

& cold, HV insulation testing, laser marking, 

weighting, class sorting, and more 

• AOI quality inspection and measurement 


Producing power modules faster 

The company’s automation technology for the soldering 

of signal and power leads onto ceramic substrates 

differs significantly from traditional methods. 

Thanks to our new technology, this can now be 

achieved without an oven, without the use of 

hundreds of fixtures and without the need to wash 

the modules and the jigs afterwards, enabling an uninterrupted 

production flow – from the first step 

(substrate with die and bonding) to encapsulation, 

test and labelling. The company’s equipment also 

offers several other advantages: 

• The production process is contactless, meaning a 

reduced number of workers are required to run 

the line. This enables a cleaner process, without 

risk of damage caused by operators. 

• The machine is ready to go without any warm-up 

time meaning no time is wasted. 

• The process is energy-saving because the localized 

heating is on the interested part only and the 

“washing phase” has been eliminated 

• Control, traceability and measurement are performed 

on modules that have been manufactured 

using Sinergo’s automation equipment. 

Boxing- gasketing & potting solution 

After the signal & power leads have been soldered 

onto the substrate, the ’boxing’ phase begins. The 

company also offers automation solutions in this 

area, facilitating, among other things, inlet and outlet 

pick & place, AOI and measurement, assembling, 

gasketing, UV curing, mono and bicomponent potting, 

weighing and testing functions. These machines 

are usually specially designed and constructed according 

to a customer’s specific requirements. We 

have also recently introduced standard mono and bicomponent 

automatic dosing cells suitable for various 

applications including in the production of highpower 

inverters for e-mobility. Among the most important 

features of this equipment are: 

• Two independent pumping units and vacuum 

degassing systems which are embedded meaning 

the footprint is greatly reduced 

• Volumetric dosing that is fully programmable via 

a user-friendly HMI 

• Process control 

• Self-adjusting dispensing path due to the laser 

measurement of nozzle position 

Sinergo technology for the selective soldering of power leads on DCBs 

Optimising handling procedures 

One thing all machines of the company have in 

common is their compactness. By optimizing parts 

handling procedures, the company manages to save 

space wherever it can. Based on the needs of each 

customer and sector, different methods are used, and 

hardware is tailored to suit different functions, 

allowing for improvements in transportation and 

storage within each machine. The goal is always to 

save both time and space, and achieve greater 

quality, efficiency and cleanliness overall. Extending 

automation solutions to the handling of parts also 

enables greater control and reduces the number of 

errors that occur during processing. The modular design 

of the equipment allows for different production 

line configurations and helps facilitate future modifications 

or improvements. To optimise handling procedures, 

a wide range of transport systems are deployed 

to improve the flow of the pieces being processed 

on the production line. These include: 

• Compact pallets optimized in terms of size, 

characteristics and circulation modes (for 

instance, external ring, internal ring, internal 

circulation with lifters and lower passage) 

• Handling systems with mechanical feeding with 

circular, linear and jolting vibration 

• Mechanical-optical singulation with roboticpicking 

guided by machine vision system 

• Electronic rotary tables 

• Mixed systems combining cartesian robots with 

robotic arms 

• Working “on fly” pieces that are on the wrist of 

the robot 

• Vacuum gripping systems using force control, 

torque control and profile tracking that interact 

with other actuators 



UV curing 


Robotic arm handling 


• Custom carriers, magazines, connection belts, 

“pilgrim-step” actuators, self-adjusting size 

grippers 

HMI: the man-machine interface 


Der Artikel stellt neueste Automatisierungs- und 

Robotiklösungen für die Produktion von Leistungshalbleitermodulen 

und -elektronik vor und betont 

die Vorteile einer Produktionslinie, die ganz ohne 

menschlichen Kontakt auskommt. 

Résumé 

Cet article présente les solutions d’automatisation et 

solutions robotiques les plus récentes permettant de 

produire des modules et des composants électroniques 

pour semi-conducteurs de puissance et met 

en avant les avantages d’une chaîne de production 

qui se passe complètement de contacts humains. 

Резюме 

В статье представлены новейшие решения в 

области автоматизации и робототехники для 

производства силовых полупроводниковых 

модулей и электроники, а также подчеркнуты 

преимущества производственной линии, которая 

функционирует без какого-либо человеческого 

вмешательства. 

Sinergo’s aim is to increase automation in processes 

where it has not yet been fully implemented, 

such as in the production of semiconductor modules 

in which much of the assembly, loading and unloading 

is still carried out manually. Automation solutions 

in these areas change the operator’s role and 

drastically reduce their manual involvement in the 

process, effectively turning them into a ’plant manager’ 

who may only use the interface remotely. This 

ensures cleaner, safer, and fully traceable processes 

at all times. 

Each of our products offers a well-designed 

Human Machine Interface. Our staff design the HMI 

to match each individual customer’s request – as 

well as the specific needs of the operators. We offer 

large monitors, intuitive messages, simple yet detailed 

instructions and modern graphics in a userfriendly 

style. 

Our HMI typically provides these main functions: 

• Access management with password and different 

levels, fully configurable by the customer 

• Programming functions for plant use 

• Automatic and manual operating modes with 

real-time visualization of everything that happens 

(including video) 

• Control windows to manage all the actuators and 

robots 

• A control page for all subsystems and sensors 

• A dedicated page for both local and remote 

diagnostic functions 

• Comprehensive traceability and data logging 

functions related to both products and the plant 

• Database SW structure implemented to handle 

data, pictures and videos including storage (NAS) 

Cleaner processes with no human 

contact 

Combined, our equipment, optimized processes 

and automated parts handling result in an efficient 

production flow untouched by human hands. This is 

positive not only in terms of efficiency – it also reduces 

the risk of contamination, as well as of ESD 

and mechanical damage. 

sinergo.net 


Product Updates « PCB & ASSEMBLY 

Zero-defect PCB assembly 

Mycronic showcases high-productivity assembly 

solutions in Anaheim 

Mycronic, a Sweden-based electronics assembly solutions 

provider, responded to growing demand for 

high-productivity solutions for zero-defect PCB assembly 

by exhibiting its MYPro A40 pick-and-place 

machine equipped with MX7 high-speed mounthead 

technology at IPC Apex Expo 2024. The company 

says the new platform increases top placement 

speeds by 48% while handling a significantly wider 

range of component types and sizes. 

Source: Mycronic 

Placement of large components 

Manufacturers aiming to boost throughput will welcome 

the system’s IPC-rated top speed of 59,000 cph 

(components per hour). The new MX7 mounthead 

achieves this by integrating seven independent 

placement nozzles steered by individual Z and theta 

motors. To accommodate a wider range of applications 

and technologies, the new mounthead expands 

the upper component size limit by six times, 

enabling placement of components as large as 

45 × 45 × 15 mm or 150 × 40 × 15 mm. A high precision 

mounthead complements the MX7 to mount 

chip components as small as 0.3 × 0.15 mm (009005), 

and components as large as 99 × 73 × 15/22 mm. 

A newly designed graphical user interface has been 

introduced to simplify both training and pick-andplace 

operations for operators. 

Mycronic says its Iris 3D AOI vision technology enables 

manufacturers to improve test coverage while 

capturing high-resolution images at speeds up to 

30 % faster than previous technologies. According to 

the company, Escape Tracker, a real-time programming 

assistant embedded in the MYWizard programming 

software, demonstrates new levels of reliability 

and speed in 3D AOI programming. 

A live demo showed how the software continuously 

analyzes and updates the system’s inspection library 

to eliminate escapes, dramatically reduce false calls, 

and constantly improve inspection models over time. 

The company also highlighted its MYPro S series of 

stencil printers which enable super fast changeovers. 

SMTconnect, Stand 4A.235 

/www.mycronic.com 

“Wherever we can add 

new levels of flexibility, 

accuracy, advanced 

automation and easy 

usability, Mycronic 

continues to deliver 

value to its customers,” 

says Clemens 

Jargon, Sr VP High 

Flex Division 

On show at Apex Expo 2024 

Apollo Seiko presents induction heating soldering robot 

Source: Apollo Seiko 

The IH 

heating 

system ensures a 

safer soldering 

environment, and its 

non-contact approach minimizes 

operational costs, offering a 

compelling advantage for modern 

manufacturing. 

Apollo Seiko showcased its latest advancements 

during the IPC Apex Expo 

2024. The company presented five induction, 

laser, selective & contact soldering 

systems, including the J-CAT Wave induction 

heating (IH) soldering robot. 

This utilizes magnetic concentrating 

technology, enabling localized self-heating 

for quick and efficient soldering, even 

in applications with substantial heat 

sinks. The IH heating system ensures a 

safer soldering environment, and its noncontact 

approach minimizes operational 

costs, offering a compelling advantage 

for modern manufacturing. 

Key features 

• The IH soldering robot ensures 

precision with its non-contact and 

localized heating mechanism. 

• With efficient heating and reduced 

operational costs, the J-CAT Wave 

stands out for its cost-effectiveness. 

• Prioritizing safety, this system creates 

a safe soldering environment for 

diverse applications. 

• The robot is designed for user-friendly 

operation, providing simplicity without 

compromising on performance. 

www.apolloseiko.com 


PACKAGING » News & Product Updates 

Chips driving industrial transformation 

GlobalData - Semiconductor chips driving innovation in AI and industry 


Semiconductor chips are driving a transformative 

wave across technology, healthcare, automotive, 

telecom, and power industries. Particularly those 

fuelling AI capabilities are fundamentally 

reshaping industries, ushering in a new 

era of innovation and efficiency gains, 

according to the latest Innovation 

Radar report by data and analytics 

company GlobalData. 

“The proliferation of generative AI 

(GenAI) and the ensuing enterprise 

have ignited fierce competition 

among chipmakers to develop semiconductor 

solutions that can handle 

the rigorous computational requirements 

of AI applications,” Kiran Raj, Practice 

Head of Disruptive Tech at the company, 

commented. “Simultaneously, leading tech giants 

invested in AI are intensifying their efforts in developing 

proprietary chip capabilities to decrease 

dependency on external platforms to power their 

AI initiatives.“ 

The report, “AI compute: how chips drive next industrial 

leap,” examines over 50 real-world applications 

of advanced chips across multiple industries 

including automotive, healthcare, power, 

technology, and telecom. It categorizes these 

based on different chip technologies to highlight 

their impact and potential across these industries. 

“Semiconductor chips stand as the backbone of transformation 

in multiple industries,” said Saurabh Daga, 

Associate Project Manager for Disruptive Tech. “They 

empower autonomous vehicles to navigate complex environments 

and revolutionize healthcare by decoding 

intricate medical data for precise diagnoses. ...These 

chips ... redefine standards of efficiency and accuracy, 

highlighting their role in propelling us into the era of 

AI-driven innovation.” 

Intel and Zeekr have partnered on a family of AI-enhanced 

automotive system-on-chips (SOCs). These advanced 

software-defined vehicle (SDV) chips enable 

various in-vehicle AI applications such as driver and 

passenger monitoring. 

Ceremorphic, a US-based chip startup, is accelerating 

drug discovery using AI chips. Its BioCompDiscoverX platform 

utilizes a heterogeneous accelerator incorporating 

analog silicon technology capable of mimicking human 

cells and tissues, speeding up identification of potential 

drug candidates and cutting development costs. 

“Tech advancements have pivoted from exclusively focusing 

on software to emphasizing hardware infrastructure, 

especially with the integration of computeheavy 

technologies like AI by enterprises,” concludes 

Daga. “Therefore, despite integration challenges and 

supply chain issues, semiconductor chips hold immense 

potential in propelling diverse industries towards an intelligent, 

efficient, and innovative future.” 

www.globaldata.com 

Research partnership on semiconductor research and innovation 

EU Chips Joint Undertaking launches joint call with South Korea 

The EU’s research partnership on semiconductors, 

the Chips Joint Undertaking 

(JU), has launched a joint call with South 

Korea as part of three new calls with a 

total budget of EUR 216 million. The project 

concerns heterogeneous integration 

and neuromorphic computing technologies 

for future semiconductor components 

and systems. It will last for 3 years. 

The call for early-stage, pre-commercial 

research projects is open to universities, 

research and technology organizations, 

and private companies. The EU has allocated 

EUR 6 million to the call, and is expected 

to dedicate EUR 1.5 million to 

each successful project. The National Re- 

40 EPP Europe » 05 | 2024 

search Foundation of Korea is preparing a 

call with an equal amount. 

The joint research consortium will be 

composed of EU Horizon Europe and Korean 

consortia, and the number of research 

groups participating should be approximately 

equal. 


“We are very happy to see the first joint 

call launched by Chips JU and the 

National Research Foundation of Korea 

(NRF) on a semiconductor research and 

innovation project,” said the Korea-EU 

Research Centre (KERC) in a statement. 

“The KERC hope that through these initiatives, 

researchers of Korea and Europe 

improve their understanding of each 

other, build networks for the future cooperation 

in Horizon projects, as Korea’s association 

to Horizon Europe is now under 

formal negotiation and is expected to be 

concluded this year.” 

www.chips-ju.europa.eu

Spanish government signs MoU with semiconductor R&D organization 

Imec to establish 300mm specialized chip R&D process line in Malaga 

The Spanish government, the regional 

government of Andalusia and imec, an international 

research and innovation hub 

in nanoelectronics and digital technology, 

have signed a Memorandum of Understanding 

(MoU) outlining their intent to 

establish a specialized chip technology 

pilot line in Malaga. 

The facility will leverage the advantages 

of leading-edge 300mm semiconductor 

process technology to drive new applications 

in health care, life sciences, 

photonics, augmented and virtual reality, 

precision sensing and more. It will complement 

the organization’s existing facility 

in Leuven, Belgium with non-standard 

processes that are currently incompatible 

with semiconductor 

manufacturing processes. 

The governments have agreed 

to support the construction of 

the new facility including the 

advanced equipment and to financially 

support the pilot 

line’s operations in a sustainable, 

long-term manner, to the 

benefit of its growing semiconductor 

ecosystem. Imec will manage operations, 

provide the required knowledge and technology, 

and guarantee access to its global 

academic and industrial partner network. 

www.imec-int.com 

The Spanish government and the government 

of Andalusia have signed a MoU with imec, an 

international research and innovation hub in 

nanoelectronics, for the construction of a 

specialized chip technology pilot line in Malaga 

(Andalusia) 

Source: imec 

Chip giant hoping for further European expansion 

Intel reportedly seeking funds for new chip facility in Ireland 


Intel has an existing 

manufacturing site in 

Leixlip, County Kildare 

which employs upwards 

of 4500 people 

Semiconductor giant Intel is seeking to raise $2bn 

(€1.86bn) in equity to fund a new semiconductor 

fabrication facility in Ireland, according to a report 

by Bloomberg citing people with knowledge of the 

matter. The company currently employs over 4,500 

people at its manufacturing sites at Leixlip, which 

includes a semiconductor wafer fabrication facility, 

and around 300 at its research and development 

facility in Shannon. Sources claim the chipmaker is 

working with an adviser, and has begun soliciting 

interest from potential investors. In October 2023, 

the company began producing Intel 4 chips at its 

Leixlip facility known as Fab 34. The company said 

that the arrival of this new capability “ushers in the 

future for products like upcoming Intel Core Ultra 

processors (code-named Meteor Lake), which will 

pave the way for AI-based PCs, as well as futuregeneration 

Intel Xeon processors in 2024 and produced 

on the Intel 3 process node.” 

www.intel.com 

UK strengthens tech ties with EU post-Brexit 

UK joins EU Chips Joint Undertaking programme 

The UK has joined the Chips Joint Undertaking, 

an EU semiconductor research 

initiative launched in late 2023 to address 

semiconductor shortages and strengthen 

Europe’s digital autonomy. The UK government’s 

Department for Science, Innovation 

and Technology has committed an initial 

GBP 5 million to the project, with another 

GBP 30 million to be provided between 

2025 and 2027. “This development marks a 

pivotal moment in the UK’s technological 

and research collaboration with the European 

Union following Brexit and under- 

scores the country’s dedication to contributing 

to Europe’s leadership in the development 

and innovation of semiconductor 

technologies, which are essential 

for the digital and green transitions on a 

global scale,” stated the press release. “We 

are looking forward to working with the 

UK partners to develop the European industrial 

ecosystem in microelectronics and 

its applications, contributing to the continent’s 

scientific excellence and innovation 

leadership in semiconductor technologies 

and related fields,” said Jari Kinaret, Chips 

Despite being initially outside the scope of 

the EU initiative as a non-EU member, the UK 

has now joined the Chips Joint Undertaking 

JU Executive Director. As a Participating 

State, the UK will have a role in setting research 

priorities and funding decisions as 

the fund evolves. 

https://www.chips-ju.europa.eu/ 



» TEST & QUALITY ASSURANCE 

Source: Göpel electronic 

Manual THT assembling with AR support and automated optical inspection 

Technologies for optimal use of AOI and AXI in THT production 

Efficiently ensuring THT quality 

With advances in green energy and electromobility, power electronics are becoming 

increasingly important in our environment. The following article details inspection 

technologies designed to detect different types of defects in THT PCB-As and explains 

where these can be placed in the manufacturing process to achieve optimal efficiency. 

» Jens Kokott, Product Manager Automated Optical Inspection, Göpel electronic 

Jens Kokott is 

Product Manager 

Automated Optical 

Inspection at 

Goepel electronic 

When considering a PCB-A with THT power 

electronics, quality assurance criteria can be 

divided into 3 areas: components on the top side; 

pins with solder joints on the bottom side; and the 

barrel fill through the PCB. The fulfilment of these 

criteria requires specifically configured inspection 

systems which have been adapted to the respective 

production step and the type of defects. 

Combining assembly and inspection 

Typically, the manufacturing of THT power electronics 

begins at assembly workstations where the 

THT components are manually mounted on the PCB. 

An automatic inspection at this stage in 

the process offers the greatest efficiency 

through a short quality control loop. Failures 

like a wrong polarised electrolytic capacitor 

can be detected and corrected immediately 

without the use of a soldering 

iron. Camera modules mounted directly 

above the assembly workstation can be 

used to carry out this task – and can conduct 

the inspection almost without the 

operator noticing. Another advantage of a 

quality check at this production stage is 

that, even if down holders are used for the 

PCB-A, the components at the workstation 

remain in direct view whereas, in subsequent 

stages, test objects may be covered. Typical component 

inspection at this production stage involves 

testing for: presence, polarity, labelling (OCR) and 

colour, as well as reading the serial number of the individual 

PCB. 

3D for high solder quality 

After the defect-free mounted PCB has left the 

combined assembly and inspection workstation, it 

can be fed into the soldering process. To detect defects 

at this stage, AOI systems are typically used to 

inspect the THT solder joints on the bottom side of 

the soldered PCB. The AOI system must, in this case, 

fulfil two main requirements. Firstly, it must inspect 

the PCB-A from below, as turning would mean an 

enormous additional effort. Secondly, in order to 

measure solder volume and pin length, a 3D system 

is required. 

AOI system in the THT process 

Depending on the process sequence, product variety 

and planned budget, component inspection can 

also be integrated directly into the production line. 

This can be done, for example, by integrating a 

double-sided AOI system after the soldering oven. 

Possible disadvantages of this, however, are higher 


costs for repairing the component defects as well as 

the potential covering of parts of the PCB-A by down 

holders. 

The use of AOI systems in the THT process is highly 

efficient in production lines that provide return 

transport of the carriers (including PCBs). In addition 

to an optimised product transport sequence, this 

setup offers additional possibilities for the integration 

of optical inspection technology. For 

example, two AOI modules can be integrated into 

one housing in front of the soldering oven to save 

space. Components with defects can be redirected 

and repaired ’cold’ before soldering. In this case, 

solder joint inspection will take place in the same 

basic system but with a time delay in the lower return 

transport of the PCB-A. 

In conclusion, achieving secure 

and efficient quality assurance for 

THT power electronics places 

complex demands on inspection 

systems in terms of both 

technology and flexibility. 


Der Artikel beschreibt Inspektionstechnologien zur 

Erkennung verschiedener Arten von Fehlern in THT- 

Leiterplatten und erklärt, wo diese im Fertigungsprozess 

platziert werden können, um optimale Effizienz zu 

erreichen. 

Résumé 

Cet article décrit les technologies d’inspection employées 

pour identifier différents types d’erreurs dans 

les circuits imprimés THT et explique où les placer 

dans le processus de production pour atteindre une 

efficacité optimale. 

Резюме 

В статье описываются технологии контроля для 

обнаружения различных типов дефектов в 

печатных THT-платах и объясняется, где их можно 

разместить в производственном процессе для 

достижения оптимальной эффективности. 

Integrations like these are possible using the THT 

Line 3D AOI system, which offers configuration options 

for different AOI modules in both the upper and 

lower transport module, meaning different inspection 

programmes can be executed simultaneously. 

Depending on requirements, orthogonal inspection 

modules with or without angle view cameras as well 

as 3D measurement modules are also available. 

The integration of verification and repair stations 

contributes to the efficiency of the overall process in 

a way that should not be underestimated. In conventional 

line concepts, these are often located directly 

behind the respective inspection system. Even though, 

in such cases, the evaluation and further processing 

of the PCB-A takes place immediately after the AOI 

inspection without any loss of time, this approach has 

some disadvantages. Verification at this central point 

requires either an additional dedicated person or 

’jumpers’ from the respective assembly stations – 

both of which lead to increased use of resources. 

Reducing resources 

A solution for reducing this type of expenditure is 

a decentralised verification of the faults detected by 

the AOI systems from the respective manufacturing 

stages for all lines. This is possible if the faults from 

the inspected PCB-A are instead presented at the 

workstation. The PCB-A remains in the AOI system or 

on a conveyor module until the complete classification 

of all faults has been carried out “remotely”. 

This decentralised classification has a learning effect 

that is very valuable for continued quality improvement 

as operators are faced with their “own” failures. 

The PILOT Connect communication system 


Examples of accurate and defective THT solder joints 

Component and solder joint inspection after soldering 



» TEST & QUALITY ASSURANCE 


Component and solder joint inspection at different transport levels 

offers convenient verification via an ethernet connection 

to the appropriate position in the production 

line. Depending on the existing line control system, a 

faulty PCB-A can then be transported directly to the 

respective workstation for rework. 

These types of faults are visible on components, 

pins or the PCB-A. However, the third ’quality check’ 

is also critical as it evaluates the solder filling from 

the bottom to the top of the PCB. In the automotive 

sector or in other safety-reliant applications, this is 

often a particularly important quality measurement. 

High quality based on perfect 

interaction 

Regardless of whether utilising 2D nor 3D technologies, 

AOI inspection cannot be used to reliably 

measure solder filling. The only way of doing this is 

with X-ray technology. But even this method 

requires a performance analysis to determine 

whether a particular measurement can be carried 

out using the technology at hand. A solely 2D X-ray 

system is not able to determine the filling of the 

solder so precisely that it can reliably confirm if specific 

requirements (e.g. min. 75%) have been fulfilled, 

for instance. X-ray systems with tilt view offer 

the possibility of getting a view of the filling level of 

the solder joint; however, this can prove difficult in 

practice, especially for connectors with a high 

number of pins since closed pin overlaps are to be 

expected. This can, in addition, lead to increased ef- 

3D AOI system for component inspection and solder joint 

inspection of THT assemblies 

fort when it comes to test program generation as the 

imaging method causes perspective distortion and 

thus CAD data for the PCB-As cannot be used for 

automated program creation. Optimal results for 

measuring solder filling can be achieved using a 

3D-AXI system. Due to the standardised view of the 

solder joints in the X-ray image, pre-defined inspection 

functions can be used – greatly reducing the 

programming effort. The evaluation of the solder filling 

in individual layers also guarantees an exact 

measurement of the fill level as well as the detection 

of voids. 

In conclusion, achieving secure and efficient quality 

assurance for THT power electronics places complex 

demands on inspection systems in terms of both technology 

and flexibility. The integration of verification 

and repair stations also plays an important role. Suppliers 

of handling and inspection technology should be 

involved at an early stage in process planning to help 

jointly develop an optimal line concept. 


www.goepel.com 


Decentralised verification of component and solder joint defects 


Measurement of solder filling at a THT solder joint with the 

AXI system X-Line 3D 



Product Updates « TEST & QUALITY ASSURANCE 

Environmentally-friendly MicroLED displays 

Advantest & Toray Engineering establish technical partnership 

Semiconductor test equipment supplier Advantest 

Corporation has entered into a technical partnership 

with manufacturing technology developer Toray Engineering 

to promote efficient production technology 

for mini/microLED displays. This aims to accelerate 

the expansion of the mini/microLED display market 

and encourage their adoption through the joint 

provision of integrated data linkage solutions for 

manufacturing. 

The companies will offer manufacturers their combined 

inspection, transfer, mounting, data analysis, 

and manufacturing-related technologies. . 

About microLEDs 

MicroLED displays use an flat-panel display technology 

that does not require backlighting, thus greatly 

reducing energy requirements while offering pixellevel 

light control and a high contrast ratio. The 

technology is more environmentally friendly than 

traditional display technology. The market is expected 

to expand dramatically with the next generation 

of small and medium-sized displays used in 

smartwatches, automotive displays, and large displays 

for home and business use. 

A microLED display is a substrate covered with tiny 

LED chips just tens of micrometers square. For a 4K 

microLED, approximately 

25 million tiny LEDs must 

be precisely arranged on 

the substrate. Defect rates 

for these LEDs run at several 

percent, and defective 

devices must be eliminated 

during the production process, 

so manufacturing 

them requires advanced 

technological capabilities 

and material usage techniques. 

According to the companies, the combination of 

Toray Engineering’s manufacturing expertise with 

Advantest’s data coordination capabilities across 

manufacturing equipment and processes, data analysis 

technology, and test technology will make it possible 

to efficiently identify the cause of defective LEDs. 

Through the partnership, the two will work to develop 

even more efficient and high-quality mini/micro 

LED display manufacturing technology, and thus contribute 

to global sustainability by popularizing nextgeneration 

environmentally friendly displays. 


www.toray-eng.com; www.advantest.com 

Through their partnership, 

the companies will work to 

develop even more efficient 

and high-quality mini/micro 

LED display manufacturing 

technology - and thus 

contribute to global sustainability 

by popularizing 

next-generation environmentally 

friendly displays 


Meeting advanced inspection requirements 

Inspectis’ optical BGA inspection systems offer higher magnification 

The company’s BGA inspection systems can now 

be supplied with optional new XM lenses that 

offer up to 285x screen magnification 

Source: Inspectis 

Digital optical microscope producer Inspectis’ 

BGA inspection systems can now 

be supplied with optional new XM lenses 

that offer up to 285x screen magnifi- 

cation, compared to the original standard 

lens with 200x. The BGA lens package 

consists of a lens (standard or XM) plus a 

probe tip (standard or small). 

The new XM higher power lens is compatible 

with both the Standard and the Small 

probe tip, which features a 27% smaller 

footprint. 

The new XM lenses are designated by the 

following part numbers: 

• BGA-004-XM with standard probe tip 

• BGA-005-XM with Small probe tip 

The company offers a wide range of packages/sets 

covering basic or advanced inspection 

requirements. 

“This unique side-view BGA Inspection 

system features the tiniest and most robust 

optical probe available, with built-in 

high power lighting and a crisp, sharp 

high-resolution 90-degree viewing 

angle,” In Alistair Gooch, Marketing Manager, 

said. “Plus, we have recently made 

mechanical improvements to various aspects 

of the BGA camera stand, based on 

customer feedback that makes the platform 

more stable, and improves the 

mechanism that reduces the risk of prism 

damage.” The many advanced features in 

this system, complementing one another, 

make our BGA inspection system the 

most powerful and unique in its class, he 

added. 

The BGA Inspection System is available in 

2 system levels, Basics and ProX which includes 

the company’s BGA Inspection, 

analysis and documentation software. 

www.inspect-is.com 


TEST & QUALITY ASSURANCE » Product Updates 

Component placement 

Robotas unveils latest THT inspection technology 

The company’s Clinch Conveyor system 

Robotas Technologies, manufacturer of 

THT component placement and clinching 

systems, debuted its latest ’Mascot Verify’ 

Through-Hole Technology Inspection 

product, aimed at ensuring error-free PCB 

assembly at the 2024 IPC Apex Expo. 

The company’s Verify inspection product 

is designed to uphold the standard of 

error-free PCB assembly pre-soldering, 

The camera system guarantees, at the 

point of part placement by the operator, 

that each component is accurately positioned. 

It likewise ensures that components 

with polarity are correctly oriented 

during placement, thereby enhancing the 

overall precision and reliability of the assembly 

process. 

Mascot systems automate and streamline 

PCB assembly via their laser guided component 

placement and visual work instructions. 

These guide the operator 

through the complete build process, improving 

product quality, increasing 

throughput and virtually eliminating 

setup time and rework. Mascot systems 

are ESD safe, electronically height adjustable, 

and provide component storage and 

delivery via carousel and DPL arrays. 

Component storage is mounted on articulated 

arms for enhanced ergonomics. 

www.robotas.com 

Temperature measurement in the electronics industry 

Optris develops new microscope optics for infrared camera 

Source: Optris 

With the new MO2X microscope optics with 2x 

magnification, the camera is now able to capture 

infrared images of even complex structures. 

Optris has launched new microscope optics 

for the PI 640i infrared camera which 

measure temperatures precisely and with 

high geometric resolution, even in chiplevel 

structures. 

High temperatures have a negative impact 

on the service life of electronic components 

and assemblies. This is due to the 

accelerated ageing of many semiconductor 

materials at high temperatures. With 

the MO2X microscope optics with 2x 

magnification, the camera is now able to 

capture infrared images of complex 

structures. For an exact temperature 

measurement, 4x4 pixels are required 

(MFOV), so that objects with a size of only 

34 µm can be measured - meaning that 

even tiny structures can be analyzed at 

chip level. 80 mK is a very good thermal 

resolution for this optic. The focus of the 

new optics makes it possible to work at a 

distance of 15 mm from the target object. 

As the optics on the PI series cameras can 

be exchanged, the system can be used 

flexibly for various measurement tasks. 

www.optris.com 

On show at Apex Expo 2024 

Mirtec unveils new hybrid 3D AOI System 

Mirtec, a provider of inspection technology, 

showcased its new ART Hybrid 3D 

AOI System in Anaheim in April. Referred 

to by the company as the first 75MP 

Multi-Camera / Full HD Resolution 12 

Projection 3D AOI System, ART leverages 

12 Projection Digital Blue Moiré Technology 

and five 15MP CoaXPress colour 

cameras to inspect reflective objects, particularly 

solder joints in high-end electronics 

manufacturing industries like 

automotive electronics, aerospace, and 

defense. The system overcomes chal- 

Source: Mirtec 

The TAL 3D SCAN design integrates directly into 

the PCB transport system of the MV-6 OMNI 

for precision 3D inspection of tall components 

prior to transport 

lenges faced by conventional 3D AOI systems, 

ensuring reliable 3D inspection results 

even on highly reflective surfaces. 

In scenarios where one camera faces light 

saturation due to reflective surfaces, the 

system utilizes the data from the other 

cameras to restore precise 3D shape images. 

This design allows the system to 

precisely measure 3D data at the very 

point where solder meets the component 

terminals. This capability to accurately 

measure and characterize solder joints 

and reflective surfaces sets ART apart. 

www.mirtecusa.com 


Customizable factory data platform 

Cogiscan collaborates with Koh 

Young on new software platform 

3D inspection solutions provider Koh Young demonstrated 

Factory Insights, the latest offering from Cogiscan, 

alongside KSMART during IPC Apex Expo 

2024. Cogiscan has built the new fully customizable 

factory data platform to meet the needs of circuit 

board assembly and complex manufacturing ecosystems. 

The software platform leverages over 25 

years of data expertise with an open architecture design 

to standardize, analyze, and transform manufacturing 

data into strategic action. 

Designed for circuit board assembly and complex 

manufacturing, it optimizes efficiency, enables realtime 

monitoring, facilitates data-driven decisionmaking, 

ensures scalability and adaptability, supports 

quality assurance and compliance, and provides visibility 

into the supply chain. Overall, it empowers 

manufacturers to streamline operations, improve 

productivity, and stay competitive in a rapidly evolving 

industry. 

Factory Insights allows users to easily collect, calculate, 

and visualize analytics data for other brands 

of machines in use on their floor. The new software 

platform easily integrates with the KSMART software 

suite to help enrich production data across 

the entire operation. From site-level OEE (Overall 

Equipment Effectiveness) to machine drill downs, 

manufacturers can easily find trends and analyze 

consolidated real-time and historical data to improve 

operations. 

Specifically for Koh Young, Factory Insights allows 

customers to gather and visualize analytics data from 

various equipment suppliers on the production line. 

With its fully customizable design, manufacturers 

have the flexibility to build specific KPI calculations, 

create unique dashboards, and seamlessly share calculated 

metrics with other machine platforms. 

kohyoung.com | cogiscan.com 

Source: Koh Young 

A customizable factory 

data platform designed 

for circuit board 

assembly and complex 

manufacturing is 

crucial for electronics 

manufacturers 

Eliminating false calls 

Mycronic launches deep learning system for 3D AOI 

Source: Mycronic 

The new system combines a deep understanding 

of user needs in demanding high-mix and highreliability 

electronics applications with the company’s 

years of active research in applied AI for 

electronics manufacturing 

Swedish electronics assembly solutions 

provider Mycronic has launched DeepReview, 

a new Automatic Defect Classification 

system that leverages the power of 

AI to reduce false call rates while improving 

first-pass-yield in 3D Automated Optical 

Inspection (AOI). 

In the effort to improve quality, flexibility 

and productivity in PCB assembly, the 

company is applying advanced neural 

networks to the highly data-intensive 

task of Automatic Defect Classification 

(ADC). The system promises to alleviate 

review operators of 50–90% of the time 

spent reviewing false calls, depending on 

the proportion of eligible components. 

“DeepReview is designed to automatically 

screen these false calls,” says Alexia Vey, 

Product Manager for product line inspection. 

“It utilizes deep learning to identify 

component contexts and imaging variations, 

which a typical algorithm-based 

system would simply be unable to classify.” 

Customers who periodically train the system 

on their own inspection imaging database 

can achieve a 50–100% reduction 

in potential false calls for eligible components. 

Since the system covers the major- 

ity of components on an average PCBA, 

this amounts to a reduction of up to 90 % 

of the time spent reviewing false calls – 

time which can better be used to focus on 

identifying real defects. 

“Our customers are laser-focused on preventing 

actual defects – and this is where 

human judgement is irreplaceable,” says 

Clemens Jargon, Sr VP High Flex Division. 

“Thanks to powerful new capabilities offered 

by deep learning, the MYPro I series 

3D AOI can offload some of the more 

tedious tasks, making it possible to apply 

full test coverage to any product mix 

without the fear of more false calls.” 

By periodically training the neural network 

on their own inspection data, customers 

can apply, adapt and refine their 

defect classification models according to 

in-house inspection standards. 


www.mycronic.com 


TEST & QUALITY ASSURANCE » Product Updates 

Smart tools for electronics designers 

ISP programming tool for semiconductor devices 

Canavisia, part of the Seica SpA group, 

exhibited its latest series of Smart Tools 

for electronics designers, test and production 

engineers at Embedded World 

2024, which took place from 9-11 April in 

Nuremberg. The tools can be deployed as 

stand-alone solutions or embedded in integrated 

manufacturing systems, whether 

for small or high-volume production. 

ISP programming tool 

DeviceClip is a universal ISP (In-System 

Programming) programming tool designed 

for programming all types of semiconductor 

devices (microcontrollers, serial 

memories, programmable logic devices) 

from any semiconductor manufacturer. 

The solution is modular and can be 

configured to provide up to 64 parallel, 

totally independent, multi-protocol ISP 

channels, and is provided with an embedded 

control panel compatible with 

any operating system. 

LED test tool 

Visitors also saw the LedMeter tool for 

testing the LEDs which are commonly assembled 

on electronic boards. This Smart 

Tool measures RGB, Hue, XY chromaticity, 

color saturation and relative intensity and 

wave length in nano meters. LedMeter 

has a modular architecture for easy scalability, 

based on i2C communication: 

each control module can manage up to 

64 sensors and is available in a TTL 

USB and RS232 version. 

Source: Canavisia 

The LedMeter tool for testing LEDs 

commonly assembled on electronic boards 

measures RGB, Hue, XY chromaticity, color 

saturation and relative intensity and wave 

length in nanometers 


www.canavisia.com | www.seica.com 

Faster board handling, multi-component alignment checking 

Yamaha introduces upgrades to 3D AOI systems 

Source: Yamaha Robotics SMT Section 

The multi-component checking 

feature helps the system to measure 

alignment and spacing, for applying 

corrections or recording positions 

Yamaha Robotics SMT Section has unveiled upgrades 

for the YRi-V 3D AOI system, including faster board 

handling, multi-component alignment checking, and 

enhanced LED coplanarity measurement. 

The new stopperless transfer system brakes and 

stabilises each board electronically after entering the 

machine, cutting the time to position the assembly 

ready for inspection. The cumulative time saving accelerates 

the completion of every batch and significantly 

increases overall productivity. 

Yamaha YRi-V 

Source: Yamaha Robotics SMT Section 

The new multi-component alignment check simplifies 

programming the system to measure the distances 

between arrayed parts such as LED emitters in 

automotive or general lighting. When building automotive 

headlamps, users can leverage the captured 

AOI data to individually optimise the placement of 

beam-focusing lenses for maximum lighting performance. 

The alignment check can be used to verify 

spacings between many other types of components, 

such as Hall sensors for precision motion control. 

The multi-component checking feature helps setup 

the YRi-V to measure alignment and spacing, for applying 

corrections or recording positions 

The upgraded height measurement system, using a 

blue laser, ensures accurate and repeatable height 

assessment for components that are difficult to capture 

with standard equipment, such as transparent 

LED packages. Now offering superior capabilities, the 

YRi-V helps lighting manufacturers ensure greater 

product reliability with superior optical performance 

and visual appearance. In addition, the YRi-V can be 

now equipped with a 25-megapixel top-camera system, 

which significantly expands the inspection area 

that can be imaged at one time. 


www.yamaha-motor-robotics.eu 


Software solution: streamlining production preparation 

Marantz Electronics launches AI-based AOI programming software 

Marantz Electronics (Mek) has launched AOI machine 

programming that harnesses the power of AI. The 

EZPro Software allows for the preparation of approximately 

70% of an AOI program in around 20 minutes 

using only CAD + Gerber data, eliminating the need 

for a PCB. Additionally, with ODB++ integration, the 

software achieves even faster programming times, 

taking a maximum of approximately 10 minutes. 

Unlike traditional methods, EZPro Software follows a 

streamlined, programmer-independent procedure, 

reducing dependency on specific individuals and 

constant fine-tuning and enhancing overall operational 

efficiency. Its user-friendly interface ensures 

that even users with minimal technical expertise can 

operate the software effectively. 

AI plays a pivotal role in the software’s capabilities. 

EZPro Software recognises CAD formats and footprints 

of package types, including multi-panel recognition 

for enhanced accuracy and precision in programming. 

The comprehensive AI package recognition 

extends to all three dimensions of body and lead 

dimensions for various package types, such as SOP’s, 

AI plays a pivotal 

role in the software’s 

capabilities 

SOT’s, QFP’s, and more. 

The software integrates across the ISO-Spector true 

3D AOI system and the range of Mek Through-Hole 

Technology (THT) AOI systems. 


marantz-electronics.com 

The Cyclops provides 

magnification levels 

ranging from 13x to 

140x, ensuring versatility 

for a wide range 

of inspection tasks 

Source: Marantz Electronics 

Microscope for increased accuracy and less user fatigue 

Aven launches new 4K HD digital microscope 

Source: Aven 

Aven has introduced the new Cyclops 4K 

Ultra HD Digital Microscope. According to 

the company, this instrument increases 

accuracy and productivity while easing 

eye strain and user fatigue – providing 

valuable benefits in high-volume appli- 

cations, such as parts inspection 

in assembly operations. 

The microscope offers users 

an immersive viewing experience 

with 4K resolution, delivering 

unprecedented detail 

and clarity. Equipped with advanced 

optics and high-resolution 

imaging technology, the 

Cyclops provides magnification 

levels ranging from 

13x to 140x, ensuring exceptional 

versatility for a wide 

range of inspection tasks. 

Key features include: 

• 4K Ultra HD Resolution: 

experience world image 

clarity and detail with stunning 4K resolution, 

allowing for precise examination 

of even the smallest components. 

• Versatile Magnification Range: with 

magnification levels ranging from 13x 

to 140x, the Cyclops offers unmatched 

versatility for various inspection tasks, 

from detailed electronics assembly to 

biological specimen examination. 

• Flexible Viewing Options: seamlessly 

switch between HDMI and USB output 

modes for flexible viewing options and 

easy integration with existing imaging 

systems. 

• Intuitive Controls: the Cyclops features 

user-friendly controls and a simple 

interface, allowing for effortless 

operation and precise image capture. 

• Enhanced Connectivity: connect the 

Cyclops to a computer or monitor via 

HDMI or USB for real-time viewing 

and image capture, making it ideal for 

collaborative work environments. 

• Compact and Portable Design: designed 

for convenience and portability, 

the Cyclops boasts a compact and 

lightweight design, making it perfect 

for fieldwork or on-the-go inspections. 

aventools.com 


» ADVERTISERS | PREVIEW | IMPRINT 

Advantest Corporation 45 

Apollo Seiko 38 

ArtiMinds Robotics 24 

ASMPT 18 

Aven 49 

Canavisia 48 

Cogiscan 47 

cts 28 

Cybord 6 

ERSA GmbH 3 

EU Chips Joint Undertaking 41 

FUJI EUROPE CORPORATION GmbH 31 

GlobalData 40 

Göpel electronic 42 

IBL-Löttechnik GmbH 35 

imec 41 

in4ma 11 

Inspectis 45 

Intel 41 

International Federation of Robotics 10 

IPC Electronics Europe 11 

IPC 10, 12 

Koh Young Europe GmbH 7, 15 

Koh Young 47 

Marantz Electronics (Mek) 49 

Mechnano 34 

Mesago 16 

Mycronic 39, 47 

National Research Foundation of Korea 40 

Optris 46 

Panasonic Industry Europe 34 

PCIM Europe 16 

PIEK International Education Centre (I.E.C.) GmbH 11 

Rehm Thermal Systems GmbH 27 

Sasinno Americas 33 

Schunk 32 

Seica 48 

SEMI Europe 15 

Siemens Digital Industries 27 

Sinergo 36 

SMT Maschinen- und Vertriebs GmbH & Co. KG, 33 

SMTconnect 16 

Toray Engineering 45 

Ventec Giga Solutions 32 

Yamaha Motor Europe N.V. 

Niederlassung Deutschland 13 

Yamaha Robotics SMT Section 48 

ZEVATRON Löttechnik GmbH 35 

ISSN 1618–5587 

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EPP Europe 11/2024 will be published on 23 October 2024 


Ausgabe 11 | 2022 

epp-online.de 

Issue 11 | 2022 


The leading information source 

for electronics manufacturing 

in Germany and Europe 


www.epp-online.de 

Elektronik 

Produktion 

Prüftechnik 

Messen & Veranstaltungen 

30. FED-Jubiläumskonferenz 

in Potsdam 

» Seite 12 

Baugruppenfertigung 

Weltneuheit aus dem Bereich des 

maschinellen Lötens 

» Seite 38 

Test & Qualitätssicherung 

Optische Qualitätsprüfung in 

Bestückautomaten 

» Seite 62 

Interview 

“Die Vorfreude auf die 

electronica in der 

Branche ist riesig.“ 

Dr. Reinhard Pfeiffer, 

Messe München 

» Seite 6 

TITELSTORY 

Digital 

vernetztes 

Handlöten 

» Seite 26 

SMT at its best 

Electronics 

Production & 

Test 

Industry News 

IPC: Likelihood of 2023 

recession in Europe is 

increasing 

» Page 13 

Tradeshow + Events 

Sustainability to take centre 

stage at Electronica 2022 

» Page 14 

W 

PCB + Assembly 

Remove insoluble particulate 

efficiently and sustainably with 

vapor degreasing 

» Page 22 

Interview 

“We do not offer a machine, 

but a ready-made 

application” 

Daniel Schultze, 

Tresky 

» Page 6 

COVER FEATURE 

Overcoming 

the challenges of 

conformal coating 

inspection 

» Page 16 

SMT at its best 

Thickness 

measurement 

for transparent 

materials 

LIVE-EVENTS 

WEBSESSION 

Medical meets SMT 

Power Electronics 

19.10.2023 

Your Multi-Channel Expert 

Andreas Hugel 

andreas.hugel@konradin.de 

phone +49 711 7594 -472 

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