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Metals and Ceramics Division - Oak Ridge National Laboratory

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Table 1. Electrical Power Inputs for EPD in different suspension solvents.<br />

Mixing ratio<br />

ethanol (vol. %)/acac (vol. %)<br />

Input electrical power<br />

Constant Current Mode<br />

(mW/cm 2 Constant Voltage Mode<br />

)<br />

(mW/cm 2 )<br />

0/100 61.2 1.5<br />

15/85 17.7 5.5<br />

30/70 16.2 6.1<br />

45/55 12.1 8.5<br />

60/40 7.5 12.5<br />

75/25 5.7 17.5<br />

90/10 5.3 17.2<br />

100/0 9.1 11.1<br />

Figure 3. Micro graphs of the dried green forms deposited on stainless steel substrates at a<br />

constant voltage of 50 V for 120 s. The depositions were conducted in the suspensions of 5g/l<br />

YSZ in solvents of (a) pure acac, (b) 45vol% ethanol /55vol% acac, <strong>and</strong> (c) pure ethanol for<br />

120 s.<br />

Conclusions<br />

The EPD behaviors in the suspension with acac <strong>and</strong> ethanol at different ratios were investigated.<br />

Even through depositions can be achieved in any of the mixing compositions, microstructure<br />

suggested that deposits obtained in the suspensions with ratio of ethanol to acac at about 1:1<br />

outcome homogeneously packed green form that may form dense coatings after sintering.<br />

References<br />

1. P. Sarkar, X. Huang, <strong>and</strong> P. Nicholson, J. Am. Ceram. Soc., 76, 1055 (1993).<br />

2. P.S. Nicholson, P. Sarkar, <strong>and</strong> X. Haung, J. Mater. Sci, 28, 6274 (1993).<br />

3. C.E. Baumgartner, V.J. Decarlo, P.G. Glugla, <strong>and</strong> J. Grimaldi, J. Electrochem. Soc. 132, 57<br />

(1985).<br />

4. C.T. Chu <strong>and</strong> B. Dunn, Appl. Phys. Lett., 55, 492-94(1993).<br />

5. Y. Yuan, X. Wang, <strong>and</strong> P. Xiao, J. Euro. Ceram. Soc., 24, 2233 (2004).<br />

6. H. Negishi, K. Yamaji, N. Sakai, T. Horita, H. Yanagishita <strong>and</strong> H. Yokokawa, J. Mater. Sci,<br />

39, 833 (2004).<br />

7. Z. Wang, J. Shemilt, <strong>and</strong> P. Xiao, J. Euro. Ceram. Soc. 22, (2002).<br />

8. M. Naigai, K. Yamashita, T. Umegaki, <strong>and</strong> Y. Takuma, J. Am. Ceram. Soc., 76, 253 (1993).<br />

9. R. Louh, Y. Hsu, Mater. Chem. Phy. 79, 226 (2003).

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