PCB + ASSEMBLY fluxer
PCB + ASSEMBLY fluxer with the intelligent pattern spraying programming is even more precise than the previously pneumatically driven motor control. This ensures less residue on the printed circuit board, as well as the end of complex manual cleaning with a brush, saving exponential time and cost. The preheating concept with convection, as well as medium and short wave infrared emitter modules reduces faulty soldering points by approximately 40 %. Particularly with large mass-efficient components, that are available at TCI, the configurable preheating concept of the system ensures uniform heating without overheating. Only high quality materials are used for soldering, so that the solder cannot react with the surface. The use of the Wörthmann wave ensures a complete wetting of the SMD pads. This causes fewer soldering bridges and a positive soldering result, especially with the difficult THT components of the LED drivers. Alessandro Gallingani further confirms this: “We have not only reduced problems involving soldered assembly by about 40 %, but we have also increased our production by 25 %, all thanks to the wave soldering systems.” Another positive aspect of the systems is the multi-stage cleaning systems, which minimizes maintenance times. Throughout the preheating zones and the soldering units, a part of the atmosphere is constantly absorbed, cleaning the central module. The three gas streams are never mixed, which helps prevent the residual oxygen content in the soldering module from forming air pockets. The constant change of the atmosphere prevents overheating of the gas and helps to stabilize the thermal conditions. All of this has an easy-to-use control system concept with simple operation via a desktop-PC or touchscreen. +++ Video-Interview +++ A full tunnel wave soldering system ensures high process reliability in the THT area during the manufacturing of drivers. Our readers can find the video here: http://epp-europe.eu/applikation-video/ full-tunnel-wave-soldering-system-ersa-tci. From left to right: Alessandro Gallingani (TCI), Tom Berx (Ersa) and Luca Fiorucci with the camera crew. Source: Doris Jetter In the manufacturing area for the modules with a Hotflow 3/20 XL. TCI is not looking to forgo this collaboration with Ersa, as the Plant Manager confirms: “We have many advantages with this long-term cooperation with Ersa. Not only is the company trustworthy, but they also provide great support, along with their innovative equipment. I also would like to include Packtronic and their Managing Director, Luca Fiorucci. If we ever have any problems with one of the systems, support is directly here to investigate deeper and find an efficient solution. We also receive specific instructions to be able to start production as quickly as possible.” (dj) SMT Hybrid Packaging, Booth 4-111 www.tci.it; www.packtronic.it; www.ersa.com Source: Doris Jetter Zusammenfassung TCI ist einer der führenden LED-Hersteller mit Sitz in Saronno und bekannt durch sein umfangreiches Angebot an LED-Modulen, -Treibern und -Konvertern. Einer langjährigen Partnerschaft verdankend findet sich umfangreiches Lötequipment von Ersa in der Produktion. Der Artikel befasst sich mit der THT-Herstellung der Treiber, die mit hoher Prozesssicherheit durch die Volltunnel-Wellenlötanlage einhergeht. Résumé TCI fait partie des constructeurs pilotes en matière de LED et a son siège à Saronno. La société est connue par son offre très étendue de modules, de pilotes et de convertisseurs pour LED. Grâce à un partenariat déjà établi depuis longtemps, on trouve dans la production un vaste choix d’équipements de soudure d’Ersa. L’article traite de la fabrication THT des pilotes, laquelle s’accompagne d’une grande sécurité des processus du fait de l’installation de brasage à la vague en tunnel complet. Резюме TCI — один из ведущих производителей светодиодов, штаб-квартира которого расположена в Саронно. Компания известна обширным предлагаемым спектром светодиодных модулей, приводов и конвертеров. Благодаря многолетнему партнерству в производстве используется обширный ассортимент паяльного оборудования Ersa. Статья рассказывает о ТНТ-производстве приводов, высокая степень безопасности которого обеспечивается за счет полнотуннельной установки для пайки волной припоя. 52 EPP EUROPE May 2017
PCB + ASSEMBLY PRODUCT UPDATES Versatile, stable, low-voiding solder paste Indium Corporation will feature its void-reducing Indium8.9HF solder paste to help customers “Avoid the Void” at SMT Hybrid Packaging May 16–18, in Nuremberg, Germany. This solder paste is a no-clean, halogen-free that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF: • demonstrates consistent printing performance for up to 12 months when refrigerated. • maintains excellent printing and reflow performance after remaining at room temperature for one month. • delivers excellent response-to-pause even after being left on the stencil for 60 hours. The company has specifically formulated Indium8.9HF solder paste to reduce voiding significantly below the industry average for improved finished goods reliability. This paste delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects. It has a unique oxidation barrier technology that makes it perfectly suited for a variety of applications, especially automotive assembly. Source: Indium Corporation Indium8.9HF is a no-clean, halogen-free solder paste. SMT Hybrid Packaging, Booth 4-321 www.indium.com New solder paste & preform innovations for low voiding Alpha Assembly Solutions, a part of the Mac- Dermid Performance Solutions group of businesses featured Alpha OM-358, the next generation high-reliability Innolot solder paste with ultra-low voiding properties ideal for automotive applications. Alpha Accuflux Preforms, designed specifically for large area power components that require consistent low-voiding solder joints from normal SMT processes, will also be highlighted. “Voiding is a critical reliability issue that one can help mitigate by choosing the right soldering materials for your process or application,” said Robert Wallace, Regional Marketing Manager for the Americas. “Alpha OM-358 is ideal for OEM’s using high reliability alloys, alloys that historically have produced a larger amount of voids than the SAC family of standard alloys, to reduce the level of voids in the joints close to those achieved in SAC305 while using Innolot/Maxrel /Maxrel Plus alloys and benefitting from all the mechanical properties of these high reliability alloys.” He continues, “Accuflux Preforms also contain an ultra-low voiding flux formulation that is deposited very accurately from preform to preform ensuring repeatable performance every time. They are available in Tape & Reel for easy assembly in SMT reflow applications.” SMT Hybrid Packaging, Booth 4-101 Future packaging line at SMT A subset of IPTE’s capabilities will be shown in the Future Packaging line, at the SMT Hybrid Packaging show at the Messe in Nuremberg, Germany. Besides all connection conveyor between the various brands of equipment, they will also show a laser marker Flex- Marker II and a test handler ETH Boardhandler. The FlexMarker II can be equipped with a selection of lasers matching your requirements. The laser is positioned in an XY table allowing marking on a wide area. An optional fast flip unit can also be used to enable marking on the other side as well. The ETH is the economical test handler within the company’s portfolio and is ideally suited for flashing/functional/small ICT appli- cations. An optional bypass transport within the 500 mm footprint can be used to enable parallel testing in a serial line. The ETH can also be equipped with an optional Cage of Faraday for RF testing. The family of boardhandlers also include heavy-duty handler (up to 15,000 N), as well as, real in-line hot test (125 ºC) handler. IPTE’s Easyline conveying equipment can be easily integrated in your production lines and offer smooth PCB transport between processes. EasyLine modules are available in Small (300 mm), Medium (500 mm) or Large size (600 mm) segments for both conventional PCBs as Hybrid ceramic panels. SMT Hybrid Packaging, Booth 5-434 www.ipte.com Source: IPTE http://alphaassembly.com The future packaging line. EPP EUROPE May 2017 53
