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5 years ago

EPP EUROPE P1.2017

  • Text
  • Software
  • Hybrid
  • Packaging
  • Components
  • Electronics
  • Manufacturing
  • Assembly
  • Inspection
  • Soldering
  • Solder

PCB + ASSEMBLY The

PCB + ASSEMBLY The investment project began in 2012 and benchmarks were compared from all market providers for the components of an SMD system. From each segment there remained three potential partners, with whom we ran further tests. Test production began with one of the most complex real serial boards from Viessmann’s product range. At the end of the extensive process, criteria such as supplier/ manufacturer assessment, technology, energy efficiency, cost and quality were again assessed and weighted. In the end, the VisionXP+ was the clear winner. Now the entire changeover has been completed. The individual lines were replaced in an annual cycle and now the fourth system has been set up, tested and handed over. Project manager Olaf Eisele from Viessmann Elektronik GmbH is happy that Rehm systems were chosen. “In the past, we already had good experiences with Rehm’s quality and service. Now we can go on in the same way.” During significant project phases, a team of experts from Rehm Thermal Systems was on location in Allendorf to monitor and support each step. There were often only two days between dismantling an old machine and starting up a new one. Production processes were to be disturbed as little as possible. “It was an enormous logistical challenge to prepare the locations for the machines with all the supply lines and connections, and then to integrate the machines into the SMD lines so that everything fit in – without interrupting production. But we did it.” Michael Hanke, Chief Customer Officer of the Rehm Group, is very satisfied with the successful project. The Viessmann Group aims at continual improvement of energy efficiency in manufacturing. The new VisionXP+ machines will contribute to implementing this. SMT Hybrid Packaging, Booth 4A-100 www.rehm-group.com; www.viessmann.de Zusammenfassung Ein international führender Hersteller von Heiz-, Industrie- und Kühlsystemen verwirklicht nachhaltige Energiekonzepte mit einer zukunftsorientierten Unternehmensphilosophie. Um der Nachhaltigkeitsstrategie und der Energieeffizienz im Unternehmen gerecht zu werden, wurde nun ein großes Investitionskonzept in der Elektronikfertigung nach fünf Jahren abgeschlossen. Mit dabei sind die VisionXP+ Reflowlötsysteme von Rehm Thermal Systems. Résumé Un leader international dans la fabrication de systèmes de chauffage, industriels et autres systèmes de refroidissement réalise des concepts d‘énergie durable avec une philosophie d‘entreprise d‘avenir. Un grand concept d‘investissement dans la fabrication électronique a été mené à bout après 5 ans afin de répondre à la stratégie de développement durable et d‘efficacité énergétique dans l‘entreprise. Les systèmes de soudure par refusion VisionXP+ de Rehm Thermal Systems ont participé à l’opération. Резюме Ведущий международный производитель промышленных систем обогрева и охлаждения реализует долговременные энергетические концепции с учетом философии предприятия, ориентированной на будущее. Для соответствия концепции продолжительного использования и энергетической эффективности была разработана масштабная концепция инвестирования в производство электроники в течение 5 лет. Одним из ее компонентов являются системы пайки оплавлением припоя VisionXP+ от Rehm Thermal Systems. Source: Rehm Thermal Systems From left to right: Volker Feyerabend (Apros Int. Consulting + Company Services), Olaf Eisele (Head of Manufacturing at Viessmann Group) with his project team Rüdiger Feldbusch, Thomas Finger and Hans- Werner Jeude (not pictured) and Michael Hanke (Chief Customer Officer at Rehm Thermal Systems). 66 EPP EUROPE May 2017

PCB + ASSEMBLY PRODUCT UPDATES Reducing waste dross by 85 percent EVS International, the leader in solder recovery, presented the new EVS 500LF lead-free version and EVS 8KLFHS at the 2017 IPC Apex Expo, at the San Diego Convention Center in California. The simple yet ruggedly designed EVS 500LF is highly compatible with ISO14001, as it complies with the ISO mantra of Reduce – Reuse – Recycle. The system enables the customer to reduce solder consumption by up to 50+ percent, an unheard of reduction in the electronics pro- duction industry. The EVS 500 also can help to reduce de-drossing time by 75 percent and waste dross off-site by up to 85 percent. The system meshes perfectly with environmental control systems and helps to reduce customers’ carbon footprint, an important environmental imperative, by utilizing the latent heat already imputed to the dross to help the recovery process. The EVS 8KLFHS offers a capacity of 6 kg/12 lbs. Its integrated hopper makes the rapid transfer of dross simpler and safer, and speeds de-drossing time by up to 75 percent. This provides a cleaner wave with less maintenance, less downtime, and a reduction in shorts and bridging, as well as, the potential to discontinue the use of messy wave oils and/or dross reduction powders. Source: EVS EVS 500 (Lead). www.solderrecovery.com Updated control system for thermal equipment BTU International, Inc., a supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, announced plans to exhibit with EPP Electronic Production Partners GmbH at SMT Hybrid Packaging. The company’s representatives will demonstrate the Pyramax reflow oven with the Wincon connected factory interface in. “Our Wincon platform has proved to be a powerful tool in delivering solutions for Industry 4.0,” said Peter Tallian, general manager of the company. “Our connected factory interface and related solutions set the benchmark for Industry 4.0 implementation,” added Tallian. The solution is an advanced windows-based software system for controlling the operation of the company’s thermal pro- cessing equipment. It combines both the simplicity of a graphical user interface with powerful diagnostic and analytical tools. The system is used in conjunction with the company’s proprietary Intellimax control board on all systems; including the Pyramax family of convection reflow ovens. Intelllimax platform has been powering the company’s ovens and furnaces for the past decade; Wincon 6.0 adds support for the next-generation controller Intellimax2: a powerful, scalable and flexible control platform that delivers precise control to ensure process optimization and availability. SMT Hybrid Packaging, Booth 4-551 www.btu.com EPP EUROPE May 2017 67