TEST + QUALITY ASSURANCE PRODUCT UPDATES Live demonstrations of inspection systems at SMT Nordson Dage, Nordson Matrix, and Nordson Yestech, divisions of Nordson, announced that they will exhibit at the upcoming SMT Hybrid Packaging scheduled to take place May 16–18 at the Messe in Nuremberg, Germany. Dage will demonstrate their flagship system – the new Quadra 7 with 0.1 μm sub-micron feature recognition which comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50 μm pixel pitch and 6.7 MP image size of the Aspire FP detector. The Quadra 5, with will also be showcased. This system offers high performance and ease of use for 2D and 3D X-ray applications. 0.35 μm feature recognition up to 10 W of power, makes the Quadra 5 the leading choice for printed circuit board and semiconductor package inspection. Matrix – an automated inline X-ray inspection, complements its existing application spectrum of SMT and PTH solder joint inspection with power hybrid applications (e.g. IGBT), battery inspection and wire bond testing. By focusing on these applications, Matrix answers the increased demand for more safety and quality inspection of consumer YESTECH FX-940 ULTRA. products like smartphones or earphones. The flexible configuration of its inline systems offers maximum possibilities to adapt to customer specific needs as one can choose between different inspection technologies (2D Transmission, SFTTM, 2.5D Off-Axis, 3D SART) depending on the actual inspection demand. Yestech FX-940 Ultra 3D AOI with cuttingedge 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity Source: Nordson Corporation Source: Nordson Corporation DAGE Quadra 7. of chips, BGAs and other height sensitive devices. With its Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing and both image and rule-based algorithms, it offers complete inspection coverage with unsurpassed 2D and 3D defect detection. SMT Hybrid Packaging, Booth 4-214 www.nordson.com 2D + 3D inspection with advanced technology V810i S2EX features Scan Path Merging (SPAM) state-of-art new technology. ViTrox Technologies, provider of innovative, advanced and cost-effective automated vision inspection systems and equipment for the semiconductor and electronics packaging industries, today announced plans to brought its new product line to the IPC APEX Expo. The V510i XXL system uses 2D and 3D inspection concurrently to achieve high productivity and high detectability. It boasts capabilities that are unmatched by other existing solutions in the market. The system is Source: ViTrox Technologies coupled with structured lighting for 2D illumination with multiple color LEDs. The multiangle multi-color illumination capability allows multiple images to be acquired for each view. The company has developed a platform for the V510i XXL for single lane inspection to cater to larger board inspection. The V810i S2EX is able to inspect boards up to 482 x 609 mm and provides the best support on the market for boards up to 7 mm thick and 4.5 kg . The solution features Scan Path Merging (SPAM) state-of-art new technology that can reduce the inspection time and hardware scanning path. Single Unified Management Office (SUMO) uses an 8-core processor with 128GB of RAM that accelerates the system to its optimum level of performance. Simultaneous Efficient Reconstruction Technique (SERT) and a new 64bit imaging processor architecture combine Predictive Slice Height (PSH) into a single scanning path. Phase Shift Profilometry 2 (PSP 2) boosts the projection and image acquisition speed up to 10 times faster using an inhouse proprietary projector. PSP 2 improves accuracy and test coverage on 100 percent pressfit and PTH boards. One of the highlighted features is 3D CT, which was released for failure analysis and volume calculation, while the repair station is for the operator to view the failed joints in 3D CT to make better judgement. Users can view the 3D image, vertical slicing, and 3D CT view at a glance. The Auto Exposure is a new advanced technology, with auto learning of the optimal exposure settings by weaving together the data from various exposure settings into a projection, in order to improve the image quality for very heavily shaded components. The 2 x 2 binning cameras are able to achieve higher resolutions up to 6 um . V-One is the new software-based product that combines all of the previous and future of the company’s software into one suite of solutions to connect the inspection machines in SMT production lines, in order to monitor their performance on a real-time basis. It allows users to manage factories smarter and optimize factory resources across geographical locations. www.vitrox.com 92 EPPEUROPE May 2017
Software packages and backend quality management Digitaltest, Inc. demonstrated their latest flying probe solutions, engineering data exchange tools, back-end quality management software and their ICT systems. The company’s latest stand-alone versions of C-Link was introduced. These packages allow any manufacturer, OEM or EMS provider, to process over seventy CAD systems and output data for all test and inspection platforms used in electronics manufacturing. The company believes C-Link is easiest way to pass data from CAD to production and test. Their software suite also provides the facility to compare and analyze boards with many tools including Design-For-Manufacturing (DFM) and Design-For-Test (DFT). The EMS Edition of C-Link is bundled with all their CAD Importers and your choice of Test, Inspection and Manufacturing outputs. Whereas, the OEM Edition is fully configurable for every environment. The latest Condor flying prober now provides the highest fault coverage with enhanced capabilities for larger boards. With CITE 7 software, we are now able to provide automation in the programming and debug process that provides the fastest Time-To-Market of any of their test solutions. When these features are combined with the throughput, test capabilities and accuracy provided by the Condor, they have the most cost-effective test solution for all low to medium volume production requirements. Focused at the back-end test, inspection and manufacturing processes, the new release of QMAN allows manufacturers to quickly understand and control their process. Providing full reporting packages, routing checks, manual work instructions, paperless repair tools and real-time alarms, QMAN fills in the gaps missed by current manufacturing software solutions. In addition, on the hardware side, the company showed significant updates to their in-circuit and functional test systems, which include the Lambda versions of their MTS systems. Dependent on the configuration used, the latest Lambda solutions can deliver 2–6X the productivity of conventional test systems. 18-camera simultaneous AOI and GTAz range At the IPC APEX Expo in San Diego, Marantz Electronics (Mek), showcased its newest and most advanced optical head available on the company’s PowerSpector and SpectorBOX range of AOI machines including a combined Top/Bottom version. The GTAz delivers true Stereoscopic imaging using its 9 high speed (90 Fps) CameraLink cameras operating in full 24 bit color. This new generation optical head precludes the need for external capture cards. Full color 3D enables the user to actually see the side of components rather than extruded 2D images from single camera systems. The result is a perfect combination of the 2D fast programming advantages and 3D features such as verification of body height, tilt and coplanarity, pin height and solder meniscus profile analysis in addition to component presence/ absence, polarity, value, angle, offset, color, extra part detection, solder ball detection, and short detection. Unique stereoscopic 3D imaging is achieved utilizing the full 9 cameras of the GTAz. In the case of chips, for example, the height measurement of chip capacitors in combination with color analysis produces a more reliable inspection of the chip capacitors value. Line Sourced DOAL (Direct on Axis Lighting) coaxial lighting with high resolution Telecentric Optics enables the inspection of solder joints without shadow effects from tall com- Source: Marantz Electronics ponents nearby, as well as accurate inspection model building. Omnidirectional multi angle, multi color LED lighting provides optimal illumination regardless of component direction. The company’s flagship PowerSpector AOI featuring the GTAz head stands out in situations where production quality is the top priority. The PowerSpector series is available in Desktop, Inline and Dual Inline AOI in an 18 camera, top/bottom configuration for simultaneous inspection. Simultaneous Top/Bottom inspection delivers a huge efficiency and speed boost in both inline and island configurations. The SpectorBOX GTAz modular AOI can be used for bottom up/top down inspection of THT solder joints and the detection of solder bridges and solder balls. Component clearance over 5 ”, a 3 ” Z-Axis and 9 cameras per module allow for maximum THT versatility. Also on display was the iSpector, a desktop AOI solution with exceptional defect coverage. The iSpector is an entry-level machine for manufacturers requiring high-quality AOI with a low price tag. Providing a rapid, repeatable inspection process at an affordable cost, it’s a plug-and-play installation with iMentor online training and is exceptionally easy-to-program. www.marantz-electronics.com www.digitaltest.com PowerSpector and SpectorBOX range of AOI machines. EPPEUROPE May 2017 93
