TRADE SHOWS + EVENTS Christian Koenen Technology Day Forward thinking ideas shape the future of tomorrow With the focus on “Innovative ideas for today, and for the demands of tomorrow”, Christian Koenen GmbH had an informative Technology Day at their headquarters in Ottobrunn, Germany. Managing Director, Michael Brianda, greeted about 75 attendees and started the day off with reviewing their goals and aspirations for the future and their clients. The company wants to continue to meet the growing demands of customers, while keeping the focus on quality, reliability, and expertise. Immediately following, a variety of presentations took place that was moderated by Frank Breer (Sales Manager) and the day concluded with a company tour. A live demonstration of the application center was one of the main highlights of this day. The team for the application center, Sebastian Bechmann and Daniel Rudolph, took the visitors around the center, with the help of representatives from partners, including Ekra, Asys, Koh Young, Ersa, Wagenbrett, kolb Cleaning Technology, and GMS. Opened since 2008, it was built and configured with the customer in mind. A variety of services are offered, to analyze and test theories, before bringing the results to a real production. Customers can take advantage of the resources it includes, target it to the needs of their specific processes in order to find optimal solutions, reduce costs, and increase quality. The team also assists customers with measurement of PCBs, pad and opening sizes, as well as, 3D measurement of deposits, and more. The center includes an X5 STS screen printer from Ekra, a PB46 printing and balling machine from Wagenbrett, as well as a stencil printing and rework system Hybrid Rework 550 (S1) from Ersa. As part of the inline concept, a Series 5000 printer from Ekra, a SPI system 8030–2 from Koh Young, and a board handling system from Asys can be found. On the same floor, a cleaning area is also part of this application center. For cleaning screens, stencils, and substrates, it is equipped with two fully automatic cleaning systems, a PS 300 from kolb Cleaning Technology and a MC4000 from GMS. Manual cleaners are also part of this area which supports smaller cleaning processes. Dr. Thomas Ahrens, Trainalytics GmbH DoE (Design of Experiment) as tool for paste printing optimization The goal is to always have an optimal manufacturing in an SMD assembly, establishing reliable solder joints. Especially with paste printing, it may become complex to find what works best, as there are a variety of different processes, techniques, trends, and materials that can be used. This is why a plan needs to be put in place to achieve these optimal steps towards productivity. In order to do this, testing needs to be done to find what works best. According to Dr. Thomas Ahrens, there are different ways to achieve this, which include different experimental tests. Trial and error or the best guess are methods frequently used can be methods used, although these may not be very accurate. Instead, he suggests to use Design of Experiment (DoE) techniques, which is the act of gathering as much information as possible based on influencing factors, to evaluate an experiment. The specific approach used will depend on the goal of the experimental design and the desired end results. For instance, which processes should be optimized, how big of an optimization is it, as well as, how much effort should be made into it should first be considered. By using the fully partial factorial design, will track all available combinations and bring more conclusive results, but this also increases the effort put in. However, the partial factorial design is best used for more complex experiments, as it reduces the scope to the strongest combinations, however it is not the most accurate. By using DoE, all parameters and combinations can be tested to find the best process to be used for an assembly, and everything is recorded for future use. www.trainalytics.de Source: EPPEurope Dr. Thomas Ahrens, Trainalytics GmbH. 28 EPP EUROPE April 2019
Source: EPPEurope The Managing Director, Michael Brianda, welcomed all visitors to the Technology Day. The Sales Manager, Frank Breer moderated and introduced each speaker, throughout the day. Source: EPPEurope Christoph Hippin, Endress+Hauser SE+Co KG Stencil printing challenges for SOT and SOD components In recent years, miniaturization has been a prominent trend, and now consequences are starting to come about. There has been a higher demand for compact circuit boards and a more complex layout design, which has increased the requirements of stencil printing technology, especially when processing SOD and SOT designs. According to Christoph Hippin, this also affects the components, circuit board, layout, stencil, reliability, and rework. Ramifications can occur if these requirements are over looked, including locking gap, tilting, and twisting of the component. In order to have a reliable release of the solder paste from the stencil to the pad sizes, he believes that the openings should be 1:1. With this, due to the stencil opening being larger than the area of the top of the pad, a smaller adhesive is needed. The speaker also further discussed the benefits of using a brushing process versus electropolishing. It doesn’t create larger apertures, improves process stability, removes the least amount of material, keeps consistent thickness, and has lower edge rounding. Coating is also an important topic for stencil printing, as it reduces underside contamination and increases repeatability. Many benefits come with using the CK Plasma 3.0, including a longer stencil life with better process reliability and a better cleaning performance. Using the brushing process with the Plasma 3.0, creates a better filling, especially when it comes to miniaturization. www.de.endress.com/en Karsten Dierker, Tonfunk GmbH Ermsleben From prototyping to mass production- When the component mix ranges from 0402 to THR components The speaker first went through the company’s process. Starting with defining the template parameters, to adjusting the design of the stencil, applying adhesives dots to components, then describing the adhesive application, to its final step of reflow soldering and adhesive curing. The variety of the components that the company uses were then discussed, which in turn explained why a step tem- Karsten Dierker, Tonfunk GmbH Ermsleben, Source: EPPEurope Source: EPPEurope Christoph Hippin, Endress+Hauser SE+Co KG. EPP EUROPE April 2019 29
