TRADE SHOWS + EVENTS A demonstration of the Fuji line took place demonstrating the Smart Factory capabilities. Source: Charlene Hesse size 0402 require a nitrogen atmosphere for a secure soldering process. Basically, the process window for manageable and secure assembly production is the goal for the production of reliable electronics. Frank Breer, Christian Koenen Smarter service for error-free printing With the approach of barcode, data matrix code and RFID on the template, traceability is enabled in a networked production. A highquality stencil is no longer just a laser-cut metal sheet, it has to be refined, since the precision stencil or screen-printing tool has a high impact on the quality of SMT production. Attention should be paid to high-quality and specific basic materials as well as, coordinated and consistent control. Precision and know-how in production in conjunction with an optimal, product-specific layout is also important, as well as, a reliable and fast delivery and a partnership-based cooperation. Despite smaller components for improved functionality, the Plasma 2.0 solution provides a stable printing process, especially if IPC recommendations cannot be met. For more challenging applications, Plasma 3.0, laser photoplotter, or special step stencils for pin-in-paste technology without preforms were discussed. Wolfgang Runte, Koh Young Technology Europe Smart Production by Smart Data The presentation covered the company‘s KSmart solution, which implements process optimization of the complete line and provides a variety of useful tools. The analysis tool collects all the information from the measurement and inspection processes of each system, in order to control every step of the process within the machine. The 3D SPI (printing system), Pre-Reflow AOI (placement system) and Post-Reflow AOI (soldering process) gives feedback and feedforward to each other, in order to communicate any process inconsistencies in real time. Through immediate intervention, the process can be optimized so no errors can occur. The 3D real-time measurement creates a complete reconstruction of an object, to be able to detect the height of the component or the entire structure of a printed circuit board. Other various tools were also discussed, in order to do justice to the Smart Factory. This included the Library Manager, Statistical Process Control, Offline Programming Optimizer, Real-time Monitoring, Remote Monitoring, and KSmart Process Optimization. Werner Kreibl, Asys Group Intelligent Factory – Next Steps In addition to complete transparency and traceability, holistic solutions are necessary for flexible production. In particular, the material flow is crucial for achieving planned production goals. This means that individual production stations, both inside and outside a line, are automatically supplied with material without interruption. Selforganizing, intelligent transport systems should autonomously transport the material from A to B. The so-called AIVs are very flex- Frank Breer, Christian Koenen. Source: Charlene Hesse Wolfgang Runte, Koh Young Technology Europe. Source: Charlene Hesse Werner Kreibl, Asys Group. Source: Charlene Hesse 36 EPP EUROPE April 2019
Source: Charlene Hesse Dr. Helmut Schweigart, Zestron Europe. Markus Ankenbrand, FAPS. Source: Charlene Hesse ible and can be adapted to individual applications. Higher-level software virtually maps the production line, as well as, monitors and analyzes the current data and machine conditions. This also ensures controlled processes based on the data collected. The company is thus gradually approaching its vision, from manual to fully automated solutions for flexible production. Dr. Helmut Schweigart, Zestron Europe Underside cleaning in the printer The cleaner for the underside cleaning should not only have a good cleaning power and low fluid consumption, but it should also be compatible with the solder paste. This is because the cleaning agent can pass through the apertures during the cleaning and interact with the solder paste. Incompatible cleaning agents, such as isopropyl alcohol (IPA), change the viscosity of the solder paste, which can have a negative effect on the printing result in the next printing process. The company offers specially developed water- and solvent-based stencil cleaners which are suitable for cleaning typical steel stencils or nanocoated stencils in the printer. The cleaning of the underside of the stencil in the printer is important for an optimal and constantly good printing result, in addition to the mechanical stencil cleaning. Markus Ankenbrand, FAPS Additive manufacturing of mechatronically integrated circuit carriers By combining classic additive manufacturing processes with printed structures, the production of complex mechatronically integrated assemblies is realized. This not only aids to shorten production process chains and delivery times, but it can also implement customerspecific production and design freedom across all relevant economic sectors. Instead of semiconductor processes, printing processes for the additive processing of functional materials are used in printed electronics, with emphasis on simple and large-area electronic systems. While additive printing processes provide electrical functionality for a variety of applications based on different materials and technologies, digital printing processes can be used to create 3D functional structures for high-frequency applications. The rapid developments in the field of printed electronics open new potential for the functionalization of components. www.fuji-euro.de Mastering electronics automation Make the switch to consistent output. From processing through assembly & test to final packaging. Stäubli’s range of clean, consistent high performance Robots provide flexible manufacturing solutions, even in the most sensitive electronic environments. Stäubli – Experts in Man and Machine www.staubli.com Stäubli Tec-Systems GmbH, Tel. +49 (0) 921 883 0, sales.robot@staubli.com EPP EUROPE April 2019 37
