Electronics Cooling Products - Advanced Cooling Technologies, Inc.

Advanced Cooling
Technologies, Inc.
Electronics Cooling Products
Military Electronics
Power Electronics
Industrial Electronics
Products
Services
Technologies
Electronics Cooling Products

Heat Pipe Assemblies
Evaporator Area
HEAT IN
HEAT OUT
Working Fluid Vapor flows through center
Heat Pipes are passive two-phase devices that transfer heat
very efficiently over relatively long distances. Heat pipes can be
bent and flattened into a variety of geometries making them
ideal for removing heat from high power, densely packed
electronics. They can isothermalize multiple devices or transfer
heat from high flux components, minimizing junction
temperatures and improving device reliability.
HEAT IN
HEAT OUT
Condenser Area
Proven Reliability Versatile Form Factor
Custom Features
Ruggedized Designs
Efficient, Reliable Thermal Management
Operating Benefits
Decrease Size and Weight
Reduce Hot Spot Temperatures
Increase Power Capabilities
50,000 to 200,000 W/m-K Effective Conductivity
Large Heat Transport Capability With Minimal
Size Weight & Power (SWAP)
Design Flexibility
Bending and Flattening
Standard & Custom Sizes Available
Surface Coating Options
Multiple Bonding Options
Round, Rectangular & Flat Cross Sections
Optimizing Engineering Resources
Heat pipes designed and built correctly will reliably operate in a broad range of harsh operating environments
for over 20 years. Our online resources can be used to help generate a preliminary design of a heat pipe
assembly for your system.
Visit www.1-ACT.com for detailed design documentation and interactive tools: ACT Design Guide, ACT
Interactive Heat Pipe Calculator and Heat Pipe Reliability Guide.
Board Chassis System
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www.1-ACT.com

HiK Plates
HiK or High Conductivity plates are heat spreader plates
with embedded heat pipes. They are used to passively spread or
transfer heat from discrete components to larger areas for heat
dissipation. HiK plates can be used to improve heat spreading in
standard conduction cooled cards, in wedge locks in standard
chassis, and in natural or forced convection heat sinks. In some
designs, thermal performance can be enhanced by 6X.
Thermal Benefits
Thermal Conductivity From 600 to
1200 W/m-K
Higher Fin Efficiency
Lower Junction Temperature
Applications
Card Chassis
Radar Electronics
Portable Electronics
Power Electronics
LEDs
Armored Vehicles
Aircraft Electronics
Increased Power Capabilities
Lightweight
Structurally Sound
Higher Allowable Ambient Temperatures
Thickness From 1.8 mm (0.072 in.)
Materials
Aluminum
AlSiC (low CTE)
Magnesium (light weight)
Copper
Manufacturing to High Standards
ACT manufactures all of our products to ISO9001 and AS9100 quality
standards. HiK plates are designed to meet even the most demanding
thermal and mechanical specs found in military applications.
Tight Tolerances
Various Plating/Finishes
Low to High Volume
Shock/Vibration
Freeze/Thaw Tolerant
Retrofit into Current Design
Temp ºC
91.1
Challenge Design Manufacture
85.2
79.2
73.3
67.4
61.5
55.6
50.0
43.8
37.8
31.9
Advanced Cooling Technologies, Inc.
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ACT's Electronics Cooling Products
Mission Ready Solutions …
Mission
ACT's Electronics Products Group is dedicated to providing quality
thermal management solutions that meet the demanding operating
environments of today's electronics. We design, analyze and
manufacture thermal solutions for diverse applications from
ruggedized military electronics to sensitive medical electronics to
high power industrial electronics. We strive to meet or exceed our
customers' expectations in every aspect.
Markets
Military Electronics
Industrial Electronics
Medical Electronics
Embedded Computers
Power Electronics
Engineering Advantage
Our company has a broad range of engineering know-how, technical skills,
applications experience and manufacturing infrastructure which deliver:
Optimal Heat Transfer
Easy System Integration
Reliability in Harsh Environments
Affordable Manufacturing
Analysis, Design and Prototyping Services
Our engineers work closely with our customers to create the best possible
solutions for the specific applications. We can help at any point in the
product development process.
Feasibility Assessment
Design and Analysis
Prototypes
Testing
Production Builds
Production Launch
Volume Manufacturing
(6) Static Temperature
ISO9001- AS9100 Certified
ITAR Registered
Advanced Cooling Technologies Capabilities
............. Analysis .................................... Testing
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www.1-ACT.com

Products
ACT’s thermal management products are designed to meet our customers’ specific thermal and mechanical
requirements in a broad range of applications. Our electronic cooling products include but are not limited
to the following:
Heat Pipe Assemblies
HiK Plates
Vapor Chambers
HiK Wedge Locks
Cold Plates
Power Electronics Heat Sinks
Conduction Cooled Frames
Custom Thermal Assemblies
SWAP out your current thermal design
Our engineered thermal products create benefits in Size, Weight
and Power (SWAP).
Size
Better heat transfer reduces surface area for heat dissipation. This
leads to less overall volume required for heat transfer.
Weight
More efficient thermal paths lead to trimming of unnecessary
materials and reduction of the overall weight of the system.
Power
Heat pipes are totally passive heat transfer devices, which not only
increases the system reliability but also reduces the system power
requirements.
Advanced Cooling Technologies Capabilities
............................... Prototypes .................................. Production .......................
Advanced Cooling Technologies, Inc. 5

High Performance Heat Spreaders
Vapor Chamber - High Performance Heat Spreaders
Vapor Chambers minimize the overall system thermal
resistance by using highly efficient two-phase heat transfer to
spread heat from small high power components to a larger area
heat sink. This enhanced heat spreading allows for smaller heat
sinks and reduced junction temperatures.
Application Benefits
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Can Accept Heat Flux up to 700 W/cm
Thermal Resistance < 0.08 °C/W
Thickness From 3mm (0.120 in.)
Scalable
Low CTE (Coefficient of Thermal Expansion) Available
Temperature Uniformity
Can Accept Multiple Heat Inputs
Power Electronics Cooling
Power Electronics cooling has become more
challenging as the push for higher power and smaller
packaging continues. ACT's thermal solutions
maximize cooling performance while minimizing the
system volume and weight. Examples of our power
electronics cooling products include both heat pipe
based heat sinks and liquid cooled cold plates.
Natural Convection Heat Sinks
Forced Convection Heat Sinks
Cold Plates
Micro / Mini Channels Heat Sinks
ACT Custom Product Advantages
Higher Allowable Power
Custom Dimensions
Thermal Resistance as low as 0.017 °C/W
Optimal Balance Between Flow and Pressure Drop
Fan / Pump Selection
Typical Power
Thermal Applications
IGBTs
Thyristors
IPMs
PFC Modules
SCRs
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www.1-ACT.com

Component, Board, and System Level Cooling
Analyzing all thermal resistances in the thermal path and determining which have the largest impact
on the overall power dissipation are key to understanding and improving thermal solutions. Whether it is
removing heat from a few key high power components, minimizing the interface between an Line Replaceable
Unit and the chassis, or improving the efficiency of an air or liquid cooled heat sink, ACT can assist in
addressing and solving thermal challenges at all levels in the system.
Effective Heat Transfer at the Component and Board Level
Conduction and Air-Cooled Frame Enhancements- ACT
Works to VITA/VME Standards
Component Level Cooling - Optimizing the Thermal Path
From the Device to the Board to the Chassis
Detailed Device Level Modeling
0.072”
THIN
The Industry’s Thinnest Embedded Heat Pipe Assemblies
Low Profile
Low Thermal
Resistance
Retrofit into Current Design
Conduction/Convection Cooled
Cards
System Level Solutions
ACT routinely designs, develops and manufactures system level cooling
solutions, moving heat from the electronics chassis to the ultimate sink. We
have extensive experience with a variety of potential solutions including:
Optimized Fin Geometries, Thermo-Electric Coolers, Heat Pipe Assemblies, and
Liquid Cooled Cold Plates.
Design: ACT's design engineers perform
engineering analysis to optimize the thermal path
from heat source to sink, and design proper
thermal solutions to address your primary
challenges.
Geometry: ACT provides custom thermal
solutions working within existing geometries and accommodating a variety of features
from cabling, connectors, I/O's to mechanical features and mounting holes.
Plating/Finishes: ACT offers a variety of plating finishes addressing harsh installation
environments and meeting system specifications.
Reliability: Enhanced heat transfer with proven, reliable thermal technology
increases reliability and extends service life.
Advanced Cooling Technologies, Inc.
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THERMAL MANAGEMENT EXPERTS
Advanced Cooling Technologies, Inc. is an internationally respected
designer and supplier of heat pipes, loop heat pipes, cold plates
and other thermal management products. Our products provide
reliable thermal management for military/Industrial electronics,
HVAC energy recovery, biomedical, aerospace and other
sophisticated devices on the ground, in the water, in air and in space.
In addition to our expertise in heat pipes, we are also experts in
other thermal technologies including pumped liquid and two-phase
cooling, thermal storage, catalytic reaction and nanotechnology.
This combination of in-depth expertise in heat pipe design and
manufacturing and active participation in emerging thermal
technologies enables us to provide our customers with the best
performing, most cost effective thermal solutions.
ISO 9001 & AS9100 Certified
ITAR Registered
Advanced Cooling Technologies, Inc., 1046 New Holland Avenue, Lancaster, Pennsylvania 17601
Ph:717-295-6061, Fax:717-295-6064, www.1-ACT.com
DOC-ACT-EPG Electronic Product Group Overview 001 D-12