Electronics Cooling Products - Advanced Cooling Technologies, Inc.
Electronics Cooling Products - Advanced Cooling Technologies, Inc.
Electronics Cooling Products - Advanced Cooling Technologies, Inc.
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<strong>Advanced</strong> <strong>Cooling</strong><br />
<strong>Technologies</strong>, <strong>Inc</strong>.<br />
<strong>Electronics</strong> <strong>Cooling</strong> <strong>Products</strong><br />
Military <strong>Electronics</strong><br />
Power <strong>Electronics</strong><br />
Industrial <strong>Electronics</strong><br />
<strong>Products</strong><br />
Services<br />
<strong>Technologies</strong><br />
<strong>Electronics</strong> <strong>Cooling</strong> <strong>Products</strong>
Heat Pipe Assemblies<br />
Evaporator Area<br />
HEAT IN<br />
HEAT OUT<br />
Working Fluid Vapor flows through center<br />
Heat Pipes are passive two-phase devices that transfer heat<br />
very efficiently over relatively long distances. Heat pipes can be<br />
bent and flattened into a variety of geometries making them<br />
ideal for removing heat from high power, densely packed<br />
electronics. They can isothermalize multiple devices or transfer<br />
heat from high flux components, minimizing junction<br />
temperatures and improving device reliability.<br />
HEAT IN<br />
HEAT OUT<br />
Condenser Area<br />
Proven Reliability Versatile Form Factor<br />
Custom Features<br />
Ruggedized Designs<br />
Efficient, Reliable Thermal Management<br />
Operating Benefits<br />
Decrease Size and Weight<br />
Reduce Hot Spot Temperatures<br />
<strong>Inc</strong>rease Power Capabilities<br />
50,000 to 200,000 W/m-K Effective Conductivity<br />
Large Heat Transport Capability With Minimal<br />
Size Weight & Power (SWAP)<br />
Design Flexibility<br />
Bending and Flattening<br />
Standard & Custom Sizes Available<br />
Surface Coating Options<br />
Multiple Bonding Options<br />
Round, Rectangular & Flat Cross Sections<br />
Optimizing Engineering Resources<br />
Heat pipes designed and built correctly will reliably operate in a broad range of harsh operating environments<br />
for over 20 years. Our online resources can be used to help generate a preliminary design of a heat pipe<br />
assembly for your system.<br />
Visit www.1-ACT.com for detailed design documentation and interactive tools: ACT Design Guide, ACT<br />
Interactive Heat Pipe Calculator and Heat Pipe Reliability Guide.<br />
Board Chassis System<br />
2<br />
www.1-ACT.com
HiK Plates<br />
HiK or High Conductivity plates are heat spreader plates<br />
with embedded heat pipes. They are used to passively spread or<br />
transfer heat from discrete components to larger areas for heat<br />
dissipation. HiK plates can be used to improve heat spreading in<br />
standard conduction cooled cards, in wedge locks in standard<br />
chassis, and in natural or forced convection heat sinks. In some<br />
designs, thermal performance can be enhanced by 6X.<br />
Thermal Benefits<br />
Thermal Conductivity From 600 to<br />
1200 W/m-K<br />
Higher Fin Efficiency<br />
Lower Junction Temperature<br />
Applications<br />
Card Chassis<br />
Radar <strong>Electronics</strong><br />
Portable <strong>Electronics</strong><br />
Power <strong>Electronics</strong><br />
LEDs<br />
Armored Vehicles<br />
Aircraft <strong>Electronics</strong><br />
<strong>Inc</strong>reased Power Capabilities<br />
Lightweight<br />
Structurally Sound<br />
Higher Allowable Ambient Temperatures<br />
Thickness From 1.8 mm (0.072 in.)<br />
Materials<br />
Aluminum<br />
AlSiC (low CTE)<br />
Magnesium (light weight)<br />
Copper<br />
Manufacturing to High Standards<br />
ACT manufactures all of our products to ISO9001 and AS9100 quality<br />
standards. HiK plates are designed to meet even the most demanding<br />
thermal and mechanical specs found in military applications.<br />
Tight Tolerances<br />
Various Plating/Finishes<br />
Low to High Volume<br />
Shock/Vibration<br />
Freeze/Thaw Tolerant<br />
Retrofit into Current Design<br />
Temp ºC<br />
91.1<br />
Challenge Design Manufacture<br />
85.2<br />
79.2<br />
73.3<br />
67.4<br />
61.5<br />
55.6<br />
50.0<br />
43.8<br />
37.8<br />
31.9<br />
<strong>Advanced</strong> <strong>Cooling</strong> <strong>Technologies</strong>, <strong>Inc</strong>.<br />
3
ACT's <strong>Electronics</strong> <strong>Cooling</strong> <strong>Products</strong><br />
Mission Ready Solutions …<br />
Mission<br />
ACT's <strong>Electronics</strong> <strong>Products</strong> Group is dedicated to providing quality<br />
thermal management solutions that meet the demanding operating<br />
environments of today's electronics. We design, analyze and<br />
manufacture thermal solutions for diverse applications from<br />
ruggedized military electronics to sensitive medical electronics to<br />
high power industrial electronics. We strive to meet or exceed our<br />
customers' expectations in every aspect.<br />
Markets<br />
Military <strong>Electronics</strong><br />
Industrial <strong>Electronics</strong><br />
Medical <strong>Electronics</strong><br />
Embedded Computers<br />
Power <strong>Electronics</strong><br />
Engineering Advantage<br />
Our company has a broad range of engineering know-how, technical skills,<br />
applications experience and manufacturing infrastructure which deliver:<br />
Optimal Heat Transfer<br />
Easy System Integration<br />
Reliability in Harsh Environments<br />
Affordable Manufacturing<br />
Analysis, Design and Prototyping Services<br />
Our engineers work closely with our customers to create the best possible<br />
solutions for the specific applications. We can help at any point in the<br />
product development process.<br />
Feasibility Assessment<br />
Design and Analysis<br />
Prototypes<br />
Testing<br />
Production Builds<br />
Production Launch<br />
Volume Manufacturing<br />
(6) Static Temperature<br />
ISO9001- AS9100 Certified<br />
ITAR Registered<br />
<strong>Advanced</strong> <strong>Cooling</strong> <strong>Technologies</strong> Capabilities<br />
............. Analysis .................................... Testing<br />
4<br />
www.1-ACT.com
<strong>Products</strong><br />
ACT’s thermal management products are designed to meet our customers’ specific thermal and mechanical<br />
requirements in a broad range of applications. Our electronic cooling products include but are not limited<br />
to the following:<br />
Heat Pipe Assemblies<br />
HiK Plates<br />
Vapor Chambers<br />
HiK Wedge Locks<br />
Cold Plates<br />
Power <strong>Electronics</strong> Heat Sinks<br />
Conduction Cooled Frames<br />
Custom Thermal Assemblies<br />
SWAP out your current thermal design<br />
Our engineered thermal products create benefits in Size, Weight<br />
and Power (SWAP).<br />
Size<br />
Better heat transfer reduces surface area for heat dissipation. This<br />
leads to less overall volume required for heat transfer.<br />
Weight<br />
More efficient thermal paths lead to trimming of unnecessary<br />
materials and reduction of the overall weight of the system.<br />
Power<br />
Heat pipes are totally passive heat transfer devices, which not only<br />
increases the system reliability but also reduces the system power<br />
requirements.<br />
<strong>Advanced</strong> <strong>Cooling</strong> <strong>Technologies</strong> Capabilities<br />
............................... Prototypes .................................. Production .......................<br />
<strong>Advanced</strong> <strong>Cooling</strong> <strong>Technologies</strong>, <strong>Inc</strong>. 5
High Performance Heat Spreaders<br />
Vapor Chamber - High Performance Heat Spreaders<br />
Vapor Chambers minimize the overall system thermal<br />
resistance by using highly efficient two-phase heat transfer to<br />
spread heat from small high power components to a larger area<br />
heat sink. This enhanced heat spreading allows for smaller heat<br />
sinks and reduced junction temperatures.<br />
Application Benefits<br />
2<br />
Can Accept Heat Flux up to 700 W/cm<br />
Thermal Resistance < 0.08 °C/W<br />
Thickness From 3mm (0.120 in.)<br />
Scalable<br />
Low CTE (Coefficient of Thermal Expansion) Available<br />
Temperature Uniformity<br />
Can Accept Multiple Heat Inputs<br />
Power <strong>Electronics</strong> <strong>Cooling</strong><br />
Power <strong>Electronics</strong> cooling has become more<br />
challenging as the push for higher power and smaller<br />
packaging continues. ACT's thermal solutions<br />
maximize cooling performance while minimizing the<br />
system volume and weight. Examples of our power<br />
electronics cooling products include both heat pipe<br />
based heat sinks and liquid cooled cold plates.<br />
Natural Convection Heat Sinks<br />
Forced Convection Heat Sinks<br />
Cold Plates<br />
Micro / Mini Channels Heat Sinks<br />
ACT Custom Product Advantages<br />
Higher Allowable Power<br />
Custom Dimensions<br />
Thermal Resistance as low as 0.017 °C/W<br />
Optimal Balance Between Flow and Pressure Drop<br />
Fan / Pump Selection<br />
Typical Power<br />
Thermal Applications<br />
IGBTs<br />
Thyristors<br />
IPMs<br />
PFC Modules<br />
SCRs<br />
6<br />
www.1-ACT.com
Component, Board, and System Level <strong>Cooling</strong><br />
Analyzing all thermal resistances in the thermal path and determining which have the largest impact<br />
on the overall power dissipation are key to understanding and improving thermal solutions. Whether it is<br />
removing heat from a few key high power components, minimizing the interface between an Line Replaceable<br />
Unit and the chassis, or improving the efficiency of an air or liquid cooled heat sink, ACT can assist in<br />
addressing and solving thermal challenges at all levels in the system.<br />
Effective Heat Transfer at the Component and Board Level<br />
Conduction and Air-Cooled Frame Enhancements- ACT<br />
Works to VITA/VME Standards<br />
Component Level <strong>Cooling</strong> - Optimizing the Thermal Path<br />
From the Device to the Board to the Chassis<br />
Detailed Device Level Modeling<br />
0.072”<br />
THIN<br />
The Industry’s Thinnest Embedded Heat Pipe Assemblies<br />
Low Profile<br />
Low Thermal<br />
Resistance<br />
Retrofit into Current Design<br />
Conduction/Convection Cooled<br />
Cards<br />
System Level Solutions<br />
ACT routinely designs, develops and manufactures system level cooling<br />
solutions, moving heat from the electronics chassis to the ultimate sink. We<br />
have extensive experience with a variety of potential solutions including:<br />
Optimized Fin Geometries, Thermo-Electric Coolers, Heat Pipe Assemblies, and<br />
Liquid Cooled Cold Plates.<br />
Design: ACT's design engineers perform<br />
engineering analysis to optimize the thermal path<br />
from heat source to sink, and design proper<br />
thermal solutions to address your primary<br />
challenges.<br />
Geometry: ACT provides custom thermal<br />
solutions working within existing geometries and accommodating a variety of features<br />
from cabling, connectors, I/O's to mechanical features and mounting holes.<br />
Plating/Finishes: ACT offers a variety of plating finishes addressing harsh installation<br />
environments and meeting system specifications.<br />
Reliability: Enhanced heat transfer with proven, reliable thermal technology<br />
increases reliability and extends service life.<br />
<strong>Advanced</strong> <strong>Cooling</strong> <strong>Technologies</strong>, <strong>Inc</strong>.<br />
7
THERMAL MANAGEMENT EXPERTS<br />
<strong>Advanced</strong> <strong>Cooling</strong> <strong>Technologies</strong>, <strong>Inc</strong>. is an internationally respected<br />
designer and supplier of heat pipes, loop heat pipes, cold plates<br />
and other thermal management products. Our products provide<br />
reliable thermal management for military/Industrial electronics,<br />
HVAC energy recovery, biomedical, aerospace and other<br />
sophisticated devices on the ground, in the water, in air and in space.<br />
In addition to our expertise in heat pipes, we are also experts in<br />
other thermal technologies including pumped liquid and two-phase<br />
cooling, thermal storage, catalytic reaction and nanotechnology.<br />
This combination of in-depth expertise in heat pipe design and<br />
manufacturing and active participation in emerging thermal<br />
technologies enables us to provide our customers with the best<br />
performing, most cost effective thermal solutions.<br />
ISO 9001 & AS9100 Certified<br />
ITAR Registered<br />
<strong>Advanced</strong> <strong>Cooling</strong> <strong>Technologies</strong>, <strong>Inc</strong>., 1046 New Holland Avenue, Lancaster, Pennsylvania 17601<br />
Ph:717-295-6061, Fax:717-295-6064, www.1-ACT.com<br />
DOC-ACT-EPG Electronic Product Group Overview 001 D-12