Cooling IGBT Modules with VDF - Parker
Cooling IGBT Modules with VDF - Parker
Cooling IGBT Modules with VDF - Parker
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The Future<br />
<strong>VDF</strong> cooling offers the design engineer another level of flexibility and performance<br />
but is not the solution for every application<br />
Arenas which lend themselves to this technology:<br />
• Where weight and size are important.<br />
• Applications which experience high cyclical loads.<br />
• Applications using “live” heatsinks for example <strong>with</strong> puck style devices or for EMC<br />
reduction.<br />
• Designs that require more power output from a given device package for example<br />
increased switching frequency or difficulty in paralleling devices.<br />
• Systems <strong>with</strong> multiple loads in the cooling loop connected in series which also require<br />
low thermal stacking.<br />
• Applications which already have a refrigerant loop.<br />
• Systems that require fast easy servicing and quick connect coolant connectors that can<br />
be used alongside high voltage.<br />
32 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France