ROTOGRAVURE PRINTING - heimann-hamm.de

pre-press
Galvanic | Color management | Engraving | Cylinder correction | Masuring devices
disCop
Order No.: B09-0508
The DisCoP electroplating process is a total system replacement using
non-dissolvable anodes for copper plating tanks. A proprietary anode is
used to transfer the current from the solution to the cylinder.
DisCoP has many advantages, including:
• a stable plating bath that is predictable and controllable
• a smooth 'mirror-like' surface
• no interference on the plated surface
• no downtime
• no sulfuric acid units
• no copper reduction unit necessary
• minimum or no polishing after plating
• minimum copper plating thru even surface
• elimination of nugget maintenance
• consistent plating thickness throughout the face length
• consistent grain structure
• noticeable reduction in plating time
• eliminates waste treatment costs
• less usage of hardening additive
• reduction in filter usage
• improved quality in the pressroom
The DisCoP System eliminates the conventional titanium basket and
copper nuggets. The DisCoP plating process works by placing copper
directly into solution. Micro particles of copper oxide (grain in the
form of black powder) are dissolved in a premixing circulation tank. A
copper analyzer measures the copper concentration of the solution. The
analyzer controls a feeder that adds copper levels and a feeder must be
installed to introduce the dissolved copper into the plating tank. These
components are all located on the DisCoP Mixing Tank. The titanium
anode basket must be replaced with a new non-dissolvable anode.
Increased quality, savings in production time and elimination of the need
for additional sulfuric acid will assure a fast return on your investment.
22
Mixing Tank with Feeder and Control System
DisCoP Analyzer
Copper plating tank with non-dissolvable
anode
Dissolvable Copper Oxide Pre-filtering of solution prior to returning to
work tank
OR
O