Catalog - Delphi

Reliable
Flexible
Effi cient
Optional tape
dispenser
Portable
stand
Low noise
level
Requires minimal
fl oor space
Quick and easy
die changes
Automatic cutter
cycle
Optional liquid
solder pot
Tooling
Application Tooling
Delphi E-Z Pack Die:
E-Z Pack Die can best be described as an advanced and
fl exible terminal application system.
Features: • This die consists of a die base, quick
change module (terminal specifi c), and
a conversion kit that adapts the base to
various presses.
• This die may be installed in Delphi’s 3 or
5-ton press, or into other manufacturers’
presses with an adapter kit.
• This die may be bench mounted or installed
on wire processing cutter equipment.
Advantages: • Reduces changeover time and downtime.
• Die changes are performed quickly and
easily, without a need for special tools.
Simply remove the tool module and insert
the next module into the die base.
E-Z Pack Dies may be purchased, leased or rented.
Contact your account representative.
Please see cross reference sheet for terminal-to-die
information. See Page 10.14.
Delphi Low Profi le Splice Die
and Stand:
This air operated press and die allows splicing of two or
more wire leads and provides good visibility to crimping
area.
Die and stand sold as a unit.
Specifi cations:
Overall height: 1143mm (45 inches)
Overall width: 914mm (36 inches)
Overall depth: 610mm (24 inches)
NOTE: Specifi cations in this catalog are for general reference only and are subject to change without notice. To verify product information, please contact a Delphi representative.
http://connectors.delphi.com 10.3
Application Tooling