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From the Chip to the Fluid<br />
� Drawback:<br />
� High constrains on the thermal interfaces (chip to<br />
evaporator block, evaporator block to <strong>Heat</strong> Pipe)<br />
Power<br />
Thermal<br />
Solution Solutions<br />
Division<br />
04 / 04 / 2011 Rev. 1.1 Guy Diemunsch<br />
15
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