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From the Chip to the Fluid<br />
� Conductivity & <strong>Heat</strong> density<br />
� When the cold source is small:<br />
CHIP DCB<br />
<strong>Heat</strong> Spreader<br />
Thermal Interface<br />
Pipe or heat pipe<br />
<strong>Heat</strong> <strong>sink</strong> <strong>base</strong><br />
� The heat density may remain stable or may<br />
increase!<br />
� Thermal Interfaces are more critical<br />
� <strong>Heat</strong> Transfer Coefficient must increase<br />
Power<br />
Thermal<br />
Solution Solutions<br />
Division<br />
04 / 04 / 2011 Rev. 1.1 Guy Diemunsch<br />
7
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