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� Reducing Chip temperature &/or increasing<br />
∆ Tsolid/Tfluid<br />
Objective A:<br />
reduce chip temperature<br />
From the Chip to the Fluid<br />
Temperature<br />
peltier<br />
spreader<br />
chip Interface<br />
<strong>base</strong> fins<br />
Interface<br />
air<br />
Interface<br />
Consequences:<br />
increase these ∆T’s<br />
Power<br />
Objective B:<br />
increase this ∆T<br />
Power and temperature evolution from the chip to the fluid<br />
with a Peltier Cell<br />
Power<br />
Thermal<br />
Solution Solutions<br />
Division<br />
04 / 04 / 2011 Rev. 1.1 Guy Diemunsch<br />
9
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