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From the Chip to the Fluid<br />
� Conductivity & <strong>Heat</strong> density<br />
� Simple rules !<br />
CHIP DCB<br />
<strong>Heat</strong> Spreader<br />
Thermal Interface<br />
� Conductivity increases heat spreading<br />
� Thickness increases heat spreading<br />
� <strong>Heat</strong> density decreases<br />
<strong>Heat</strong> <strong>sink</strong> <strong>base</strong><br />
Power<br />
Thermal<br />
Solution Solutions<br />
Division<br />
04 / 04 / 2011 Rev. 1.1 Guy Diemunsch<br />
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