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Introduction to silicon detectors and radiation ... - IRTG Heidelberg

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[2008 JINST 3 S08003]<br />

ATLAS Pixel Module<br />

Typical hybrid pixel<br />

module built of<br />

Readout “flex” hybrid<br />

Sensor: 46k pixels<br />

<strong>IRTG</strong> Fall School 2010, <strong>Heidelberg</strong>, November 1–5, 2010, U. Husemann: <strong>Introduction</strong> (Part I)<br />

16 front-end (FE) chips<br />

Lots of electrical<br />

connections<br />

FE chips bump-bonded <strong>to</strong><br />

sensor, wire-bonded <strong>to</strong> flex<br />

In: chip <strong>and</strong> sensor power<br />

(low <strong>and</strong> high voltage), chip<br />

comm<strong>and</strong>s, trigger<br />

Out: digitized data (later<br />

transformed in<strong>to</strong> optical)<br />

Cooling system (not<br />

shown): remove heat<br />

dissipated by FE chips<br />

8<br />

2008 JINS

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