Brochure for Business Partners - Kyocera

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(1) Electroless nickel/gold plating;
electrolytic gold plating; parts,
materials and chemicals used for
such plating;
(2) Lead that remains in plated parts
on electroless plating processing
(3) Optical glass; optical elements;
(4) Glass frits; Cu particles produced
in electrolysis;
(5) Lead contained in the glass parts
of cathode ray tubes, electronic parts
[resistor, conductive paste,
adhesive, glass frit, and
encapsulation glass materials are
included.] and fluorescent tubes
(6) Lead contained as alloy content in
steel up to 0.35 wt%, in aluminum up
to 0.4 wt%, or in copper [brass and
the phosphorus bronze are
included.] up to 4 wt%
(7) Lead in high-melting point solder
(Lead based alloys containing 85 %
or more lead in weight)
(8) Lead in solders for servers,
storage and storage array systems,
network infrastructure equipment for
switching, signal, transmission as
well as network management for
telecommunications
(9) Lead in ceramic electronic parts
[For instance, materials used for
piezo-electric]
(10) Lead used in compliant pin
connector systems
(11) Lead used as coating material for
thermal conduction module sealing
(12) Lead in solders consisting of
more than two elements for
connection between pins and
package of microprocessors with a
lead content of more than 80% and
less than 85% in weight
(13) Lead in solders used for
electrical connection between
semiconductor die and carrier within
integrated circuit flip chip packages
(14) Lead in linear incandescent
lamps with silicate coated tubes.
(15) Lead halide as radiant agent in
High Intensity Discharge(HID)lamps
used for professional reprography
applications
(16) Lead as activator in the
fluorescent powder (1%lead by
weight or less) of discharge lamps
when used as suntanning lamps
containing phosphors such as
BSP(BaSi2O5:Pb)as well as used
as specially lamps for diazo-printing
reprography , lithography, insect
traps,photochemical and curing
processes containing phosphors
such as
SMS((Sr,Ba)2Mg2Si2O7:Pb).
(17) Lead with PbBiSn-Hg and
PbInSn-Hg in specific compositions
as main amalgam and with PbSn-Hg
as auxiliary amalgam in very
compact Energy Saving Lamps
(ESL).
(18) Lead oxide in glass used for
bonding front and rear substrates of
flat fluorescent lamps used for Liquid
Crystal Displays (LCD).
[Exceptions] Substances in equipment, tools, jigs, dies etc., when there is no possibility of
their becoming contained in any products
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