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1. Objective<br />
This report describes the eSwitch SPQ family Cold Temperature Test removal plan and results.<br />
Current Final Test Flow:<br />
Room probe Test -> Hot Temp Testing ->Cold Temp Testing.<br />
Proposed Final Test Flow:<br />
Room probe Test -> Hot Temp Testing.<br />
2. General Information<br />
Product Family:<br />
SPQ15 : MC15XS3400DHFK/MC15XS3400CHFK<br />
SPQ35 : MC35XS3400DHFK/MC35XS3400CHFK<br />
SPQ1035 : MC10XS3435DHFK/MC10XS3435BHFK/SC900599BHFK<br />
SPQ1012 : MC10XS3412JHFK/MC10XS3412KHFK/MC10XS3412CHFK<br />
Package : 24 ld PQFN<br />
Test Site : <strong>Freescale</strong> TJN-FM Tianjin, China<br />
Test Platform : MFLEX<br />
3. Qualification Plan<br />
The requirements and acceptance criteria were based on <strong>Freescale</strong> Test Elimination specification 12MQS10030G. Achieve<br />
zero test insert failures from at least 460K units tested to the standard production Final Test flow. Units must be sourced from<br />
at minimum of 3 wafer lots and 10 assembly lots from the same Fab and mask set.<br />
TM<br />
2<br />
<strong>Freescale</strong>, the <strong>Freescale</strong> logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore<br />
and Symphony are trademarks of <strong>Freescale</strong> Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a<br />
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of <strong>Freescale</strong> Semiconductor, Inc.<br />
All other product or service names are the property of their respective owners. © 2011 <strong>Freescale</strong> Semiconductor, Inc.