Freescale PowerPoint Template

27/May/2013
TM
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t
he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony
are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack,
ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ
Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks
of Freescale Semiconductor, Inc. All other product or service names are the property
of their respective owners. © 2011 Freescale Semiconductor, Inc.

1. Objective
This report describes the eSwitch SPQ family Cold Temperature Test removal plan and results.
Current Final Test Flow:
Room probe Test -> Hot Temp Testing ->Cold Temp Testing.
Proposed Final Test Flow:
Room probe Test -> Hot Temp Testing.
2. General Information
Product Family:
SPQ15 : MC15XS3400DHFK/MC15XS3400CHFK
SPQ35 : MC35XS3400DHFK/MC35XS3400CHFK
SPQ1035 : MC10XS3435DHFK/MC10XS3435BHFK/SC900599BHFK
SPQ1012 : MC10XS3412JHFK/MC10XS3412KHFK/MC10XS3412CHFK
Package : 24 ld PQFN
Test Site : Freescale TJN-FM Tianjin, China
Test Platform : MFLEX
3. Qualification Plan
The requirements and acceptance criteria were based on Freescale Test Elimination specification 12MQS10030G. Achieve
zero test insert failures from at least 460K units tested to the standard production Final Test flow. Units must be sourced from
at minimum of 3 wafer lots and 10 assembly lots from the same Fab and mask set.
TM
2
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.

4. Qualification Results : Lots and Data Summary
The Test Elimination evaluation of 740K units resulted in test enhancements and program adjustments at Final Test hot.
5. Final Verification steps
740 parts were tested with the final test program, no reject were reported.
JVT test and leakage were contained at the end of program.
6. Product Quality Customer Return Assessment
No customer return were reported from 2010 to March 2013 due to Cold Temperature fails.
No permanent corrective action being cold temperature test was implemented during these last 3 years.
It has been verified that all available customer returns (CQI) can be detected by the remaining test insertions.
7. Temperature Variation Analysis/Characterization
It has been verified that the electrical tests are worst case at remaining test temperature.
Product characterization on material with variation typical of the wafer fabrication process window show that they
are containable with the remaining test insertions.
8. Data analysis and verification summary
From the above data, it was verified that the requirements and acceptance criteria based on Freescale specification
12MQS10030G was achieved. For the Final test flow, Cold can be eliminated for SPQ family devices.
TM
3
Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, the Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore
and Symphony are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a
Package, Processor Expert, QorIQ Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners. © 2011 Freescale Semiconductor, Inc.