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Silicon photonics devices The different devices addressed by Silicon photonics are: • Individual Components and sub-components – Optical components – a single function silicon photonics device: • VOA, Multiplexer/demultiplexer, Active filters, Optical switches, • Sensor element – Optical engines – optics and electronics combined into an opto-electronic subassembly “engine”. Packaged with other components and an aluminum shell to create a transceiver, transmitter, sensor subsystem, etc.. • Transceiver-type Products – Embedded modules (EMs) – transceivers or transmitters, and receivers designed for use inside a systems and mounted on a PCB. – Transceivers, transmitters, and receivers –devices designed to be plugged into a system front panel connector slot; usually on a system external front panel. – Active optical cables (AOCs) – a set of optical fibers with transceivers integrated on both ends to form a single, pluggable cable that contains the optics inside and presents only an electrical connection outside. • Future Products – Hybrid packaged devices and 3DICs – Co-packaged silicon photonics with an ASIC either side-by-side or 3DIC bonded – Integrated opto-electronic chips – a single device with electronics and optics integrated on the same chip – It is important to note that passive optical elements (such as array wave guides, optical filters, couplers, splitters, polarizer arrays) can be created with silicon photonics technologies and integrated with active elements. © 2012 • 6
Silicon photonics market • Silicon photonics has tremendous potential as a new technology to blend optical technology with low cost CMOS semiconductor processing. • But there are still many challenges ahead. • The main problems in Silicon photonics development are: 1. Few products - most of the industry has been focused on developing individual silicon photonics elements and cores. Few companies have developed integrated product solutions. 2. High cost – devices have been expensive to develop; 1. Silicon photonics companies have had to create their own CAE/CAD programs 2. Only in 2011, did open market CAE/CAD programs become available. Suppliers are very few in number 3. Several efforts have been established to promote CAE/CAD design tools. See OpSIS and LETI-Mentor 3. Technical miss-matches - with high volume markets • Data centers want 850-nm and 1310-nm • Consumers want very inexpensive products, but silicon photonics is still expensive 4. Competition with VCSEL-based alternatives • VCSEL-based interconnects dominate both the data center and consumer areas with very low prices. 5. Need for high volumes - Manufacturing CMOS semiconductors is like the printing business where the design costs are amortized over high volumes. The key to low costs are high volumes. Silicon Photonics has not been able to achieve high enough volumes due to a number of constraints that impact costs. • Most research so far has been in developing high-speed individual elements and cores – Modulators, VOAs, switches, laser arrays, detector arrays, etc. – Most of the core optical control elements have been developed – Now about its about low power consumption, transmission characteristics and high data rates – Not much development has gone into integrated “products” (except for a few startups) © 2012 • 7
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