Optoelectronic System Packaging

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Parasitic Effects in Electronic <strong>Packaging</strong> Package parasitic effects stop high frequency signals! L=1~10nH Lower data rate in wire bond package L < 100pH KTH/LECS/LRZ Higher data rate in flip-chip package Integrated Photoreceiver Detector and amplifier integration: reduce package level and improve bandwidth KTH/LECS/LRZ
Flip-Chip <strong>Packaging</strong> for Photodetectors KTH/LECS/LRZ Detector Package with Window •Hermetic, noise issues •Numerical apertures sinθ, and d •Flat window for large area devices •Centering the device in the package KTH/LECS/LRZ
Page 1 and 2: IL 2208 Electronic System Packaging
Page 3 and 4: Communication System Packaging Hier
Page 5 and 6: The Fiber Array KTH/LECS/LRZ Hemisp
Page 7 and 8: 2. Semiconductor Laser and Amplifie
Page 9 and 10: Heatsink/Heatspreader Metallization
Page 11 and 12: Flip-Chip Bonding IC Underbump Meta
Page 13: 3. Photo Detectors Packaging KTH/LE
Page 17 and 18: 4. Optoelectronic Packaging Integra
Page 19 and 20: Optical/Electrical Integrated Modul
Page 21 and 22: Device Alignment: Active Alignment
Page 23 and 24: 2-Dimensional Fiber Array Alignment

Optoelectronic System Packaging

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