Optoelectronic System Packaging
Optoelectronic System Packaging
Optoelectronic System Packaging
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Device Alignment: Active Alignment<br />
KTH/LECS/LRZ<br />
• Total 6 dimension of freedom<br />
θ z can be eliminated<br />
• First align 3-4um accuracy in 5-axis<br />
micropositioner<br />
• Finally scaning SM fiber array on<br />
the YZ plan while monitoring the<br />
coupled laser output from the<br />
outermost channels, -1um accuracy<br />
Passive Alignment Based on Micromachining Technologies<br />
KTH/LECS/LRZ
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