Optoelectronic System Packaging
Optoelectronic System Packaging
Optoelectronic System Packaging
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Laser and Amplifier <strong>Packaging</strong><br />
Bonding wire<br />
Heat sink<br />
Edge emitter laser<br />
Surface emitter laser (SEL)<br />
Surface emitter later (SEL)<br />
with flip-chip packaging<br />
Thermal vias<br />
Poor thermal conductivity<br />
Thermal conductive substrate<br />
Underfill material, good thermal conduction<br />
KTH/LECS/LRZ<br />
Heatsink and Device Metallization<br />
Laser Diode<br />
Adhesion layer<br />
Diffusion barrier layer<br />
Wettable layer<br />
Solder layers<br />
Bonding<br />
Heatsink<br />
Solder layers<br />
Wettable layer<br />
(Transition layer)<br />
Diffusion barrier layer<br />
Adhesion layer<br />
KTH/LECS/LRZ
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