Optoelectronic System Packaging

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O/E MCM Module Assembly Top View KTH/LECS/LRZ Hybrid O/E Assembly KTH/LECS/LRZ
Device Alignment: Active Alignment KTH/LECS/LRZ • Total 6 dimension of freedom θ z can be eliminated • First align 3-4um accuracy in 5-axis micropositioner • Finally scaning SM fiber array on the YZ plan while monitoring the coupled laser output from the outermost channels, -1um accuracy Passive Alignment Based on Micromachining Technologies KTH/LECS/LRZ
Page 1 and 2: IL 2208 Electronic System Packaging
Page 3 and 4: Communication System Packaging Hier
Page 5 and 6: The Fiber Array KTH/LECS/LRZ Hemisp
Page 7 and 8: 2. Semiconductor Laser and Amplifie
Page 9 and 10: Heatsink/Heatspreader Metallization
Page 11 and 12: Flip-Chip Bonding IC Underbump Meta
Page 13 and 14: 3. Photo Detectors Packaging KTH/LE
Page 15 and 16: Flip-Chip Packaging for Photodetect
Page 17 and 18: 4. Optoelectronic Packaging Integra
Page 19: Optical/Electrical Integrated Modul
Page 23 and 24: 2-Dimensional Fiber Array Alignment

Optoelectronic System Packaging

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