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Download Datasheet - Infineon

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SIDC112D170H<br />

Maximum Ratings<br />

Parameter Symbol Condition Value Unit<br />

Repetitive peak reverse voltage V RRM T vj = 25 °C 1700 V<br />

Continuous forward current I F T vj < 150°C<br />

Maximum repetitive forward current I FRM T vj < 150°C 410<br />

Junction temperature range T vj -40...+175 °C<br />

Operating junction temperature T vj -40...+150 °C<br />

Dynamic ruggedness² )<br />

P max<br />

1 ) depending on thermal properties of assembly<br />

2 ) not subject to production test - verified by design/characterisation<br />

I Fmax = 410A, V Rmax =<br />

1700V, T vj ≤ 150°C<br />

1 )<br />

tbd<br />

A<br />

kW<br />

Static Characteristic (tested on wafer), T vj = 25 °C<br />

Parameter Symbol Conditions<br />

Value<br />

min. typ. max.<br />

Reverse leakage current I R V R =1700V 20 µA<br />

Cathode-Anode<br />

breakdown Voltage<br />

3)<br />

Diode forward voltage V F<br />

3)<br />

V F tested at lower current<br />

V BR I R =0.25mA 1700 V<br />

Unit<br />

I F =205A 1.9 2.3 V<br />

Further Electrical Characteristics<br />

Switching characteristics and thermal properties are depending strongly on module design and mounting<br />

technology and can therefore not be specified for a bare die.<br />

Edited by INFINEON Technologies, IMM PSD, L4502A, Edition 0.9, 22.02.2010

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