SMAC Applications Book - ORLIN Technologies Ltd
SMAC Applications Book - ORLIN Technologies Ltd
SMAC Applications Book - ORLIN Technologies Ltd
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<strong>SMAC</strong> 03<br />
Wire Bonding<br />
A. CONTACT<br />
¥ High speed Approach<br />
¥ Slow Down, soft land on pad<br />
B. HOT MELT<br />
¥ Increase force, follow wire as solder melts,<br />
maintain force at 200 - 500 gms<br />
¥ Track wire position, maintain force profile<br />
to ensure no separation<br />
¥ Hold<br />
C. RETRACT<br />
¥ High speed take-off<br />
Actuator: LAL-90<br />
Stroke (mm): 15, 50<br />
Resolution: 1 or 5 micron<br />
Force: 100 newtons<br />
Moving Mass: 250 gms<br />
Supply Voltage: 48 Volts<br />
Key Operational Details:<br />
High speed approach, slow down, soft land<br />
on pad<br />
Increase force, follow wire as solder melts,<br />
maintain force at 200 - 500 grams<br />
Track wire position, maintain force profile to<br />
ensure no separation<br />
High speed take-off<br />
<strong>SMAC</strong> Advantages:<br />
Instantaneous transition from position mode to force<br />
mode<br />
Ability to monitor position in force mode<br />
and make decision to change programs<br />
<strong>SMAC</strong> •5807 Van Allen Way •Carlsbad, California 92008•Fax: (760) 929-7588 •Tel: (760) 929-7575
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